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David Tuffield, former UK marketing manager for Augat/Isotronics, has been appointed European marketing manager to head the company's plans to increase penetration into this expanding hybrid micropackaging industry. He will be responsible for the complete marketing and sales effort for micropackaging products providing the interface between US manufacturing facilities and Augat subsidiary product managers.

Two die attach adhesive products, manufactured by Furane Products Co., claim to meet the military specification for epoxy electronic adhesives (MIL‐STD‐883C, Method 5011) without exception. The products are EPIBOND 7002 which is a thermally conductive adhesive and EPIBOND 7200, an electrically and thermally conductive die attach adhesive. Both are 100% solids and contain no solvents or diluents. Consequently, the likelihood of outgassing and void formation is greatly reduced. Both are extremely high purity systems, and have a hot die‐shear strength of over 6,000 N/M2 at 150°C. Both materials are screen printable and undergo virtually no bleed‐out during processing.

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.

The conference and exhibition got off to a good start with an official reception by the Mayor of Bournemouth on Tuesday evening where attendees could relax and chat—a pleasant way to meet old friends and to make new acquaintances.

Circuit Technology, now in its fourth year, is still an event concentrating exclusively on PCB technology, production equipment and processes. Nevertheless, the organisers believe that Circuit Technology '86 will derive great benefit from participation in the UK's largest electronics gathering, The British Electronics Week.

On August 5 MinTech published the booklet GRADUATE TRAINING IN MANUFACTURING TECHNOLOGY (HMSO 22½p.) It is the second report of the Working Group on Engineering Training and the Requirements of Industry. The first report of this working group was published in 1966 and is now known as the Bosworth Report. This present report can best be described as Bosworth Two. We take this opportunity of setting out formally the Bosworth system and show how Bosworth Two relates to it.