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Article
Publication date: 4 December 2023

Yang Liu, Xin Xu, Shiqing Lv, Xuewei Zhao, Yuxiong Xue, Shuye Zhang, Xingji Li and Chaoyang Xing

Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the…

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Abstract

Purpose

Due to the miniaturization of electronic devices, the increased current density through solder joints leads to the occurrence of electromigration failure, thereby reducing the reliability of electronic devices. The purpose of this study is to propose a finite element-artificial neural network method for the prediction of temperature and current density of solder joints, and thus provide reference information for the reliability evaluation of solder joints.

Design/methodology/approach

The temperature distribution and current density distribution of the interconnect structure of electronic devices were investigated through finite element simulations. During the experimental process, the actual temperature of the solder joints was measured and was used to optimize the finite element model. A large amount of simulation data was obtained to analyze the neural network by varying the height of solder joints, the diameter of solder pads and the magnitude of current loads. The constructed neural network was trained, tested and optimized using this data.

Findings

Based on the finite element simulation results, the current is more concentrated in the corners of the solder joints, generating a significant amount of Joule heating, which leads to localized temperature rise. The constructed neural network is trained, tested and optimized using the simulation results. The ANN 1, used for predicting solder joint temperature, achieves a prediction accuracy of 96.9%, while the ANN 2, used for predicting solder joint current density, achieves a prediction accuracy of 93.4%.

Originality/value

The proposed method can effectively improve the estimation efficiency of temperature and current density in the packaging structure. This method prevails in the field of packaging, and other factors that affect the thermal, mechanical and electrical properties of the packaging structure can be introduced into the model.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 2 February 2023

Shanmugan Subramani and Mutharasu Devarajan

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested…

Abstract

Purpose

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Design/methodology/approach

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Findings

Low value in total thermal resistance (Rth-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(Rth-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The TJ value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔTJ) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Originality/value

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the TJ values.

Details

Microelectronics International, vol. 41 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 26 March 2024

Sajad Pirsa and Fahime Purghorbani

In this study, an attempt has been made to collect the research that has been done on the construction and design of the H2O2 sensor. So far, many efforts have been made to…

Abstract

Purpose

In this study, an attempt has been made to collect the research that has been done on the construction and design of the H2O2 sensor. So far, many efforts have been made to quickly and sensitively determine H2O2 concentration based on different analytical principles. In this study, the importance of H2O2, its applications in various industries, especially the food industry, and the importance of measuring it with different techniques, especially portable sensors and on-site analysis, have been investigated and studied.

Design/methodology/approach

Hydrogen peroxide (H2O2) is a very simple molecule in nature, but due to its strong oxidizing and reducing properties, it has been widely used in the pharmaceutical, medical, environmental, mining, textile, paper, food production and chemical industries. Sensitive, rapid and continuous detection of H2O2 is of great importance in many systems for product quality control, health care, medical diagnostics, food safety and environmental protection.

Findings

Various methods have been developed and applied for the analysis of H2O2, such as fluorescence, colorimetry and electrochemistry, among them, the electrochemical technique due to its advantages in simple instrumentation, easy miniaturization, sensitivity and selectivity.

Originality/value

Monitoring the H2O2 concentration level is of practical importance for academic and industrial purposes. Edible oils are prone to oxidation during processing and storage, which may adversely affect oil quality and human health. Determination of peroxide value (PV) of edible oils is essential because PV is one of the most common quality parameters for monitoring lipid oxidation and oil quality control. The development of cheap, simple, fast, sensitive and selective H2O2 sensors is essential.

Details

Sensor Review, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 27 January 2023

Dhanalakshmi K.M., Kavya G. and Rajkumar S.

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband…

Abstract

Purpose

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband (UWB) frequency range. The antenna is designed for usage in massive multiple input multiple output (MIMO) and closed packaging applications.

Design/methodology/approach

The size of the antenna is 24 × 24 × 1.6 mm3. The radiating element of the antenna is derived from the Sierpinski–Knopp (SK) fractal geometry for miniaturization of the antenna size. The antenna has a single reflecting stub placed between the two orthogonal feeds, to improve isolation.

Findings

The proposed antenna system exhibits S11 < −10 dB, S21 < −15 dB and stable radiation characteristics in the entire operating region. It also offers an envelope correlation coefficient < 0.01, a diversity gain > 9.9 dB and a capacity loss < 0.4 bps/Hz. The simulated and measured outputs were compared and results were found to be in similarity.

Originality/value

The proposed UWB-MIMO antenna has significant size reduction through usage of SK fractal geometry for radiating element. The antenna uses a single radiating element with dual feed. The stub is between the antenna elements which provide a compact and miniaturized MIMO solution for high density packaging applications. The UWB-MIMO antenna provides an isolation better than −20 dB in the entire UWB operating band.

Article
Publication date: 14 February 2024

Lu Luo, Kang Qi and Hualiang Huang

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag…

Abstract

Purpose

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).

Design/methodology/approach

A self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.

Findings

The SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.

Research limitations/implications

The significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).

Practical implications

This study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.

Social implications

The social implication of this study is to predict the service life of PCB.

Originality/value

The ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.

Details

Anti-Corrosion Methods and Materials, vol. 71 no. 2
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 21 December 2023

Xinran Zhao, Yingying Pang, Gang Wang, Chenhui Xia, Yuan Yuan and Chengqian Wang

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Abstract

Purpose

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Design/methodology/approach

An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples.

Findings

The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth.

Originality/value

The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Open Access
Article
Publication date: 21 April 2023

Rana I. Mahmood, Harraa S. Mohammed-Salih, Ata’a Ghazi, Hikmat J. Abdulbaqi and Jameel R. Al-Obaidi

In the developing field of nano-materials synthesis, copper oxide nanoparticles (NPs) are deemed to be one of the most significant transition metal oxides because of their…

Abstract

Purpose

In the developing field of nano-materials synthesis, copper oxide nanoparticles (NPs) are deemed to be one of the most significant transition metal oxides because of their intriguing characteristics. Its synthesis employing green chemistry principles has become a key source for next-generation antibiotics attributed to its features such as environmental friendliness, ease of use and affordability. Because they are more environmentally benign, plants have been employed to create metallic NPs. These plant extracts serve as capping, stabilising or hydrolytic agents and enable a regulated synthesis as well.

Design/methodology/approach

Organic chemical solvents are harmful and entail intense conditions during nanoparticle synthesis. The copper oxide NPs (CuO-NPs) synthesised by employing the green chemistry principle showed potential antitumor properties. Green synthesised CuO-NPs are regarded to be a strong contender for applications in the pharmacological, biomedical and environmental fields.

Findings

The aim of this study is to evaluate the anticancer potential of CuO-NPs plant extracts to isolate and characterise the active anticancer principles as well as to yield more effective, affordable, and safer cancer therapies.

Originality/value

This review article highlights the copper oxide nanoparticle's biomedical applications such as anticancer, antimicrobial, dental and drug delivery properties, future research perspectives and direction are also discussed.

Details

Arab Gulf Journal of Scientific Research, vol. 42 no. 2
Type: Research Article
ISSN: 1985-9899

Keywords

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