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Article
Publication date: 21 December 2023

Xinran Zhao, Yingying Pang, Gang Wang, Chenhui Xia, Yuan Yuan and Chengqian Wang

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Abstract

Purpose

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Design/methodology/approach

An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples.

Findings

The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth.

Originality/value

The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 16 August 2022

Zhao Yuhang, Zhicai Yu, Hualing He and Huizhen Ke

This study aims to fabricate a multifunctional electromagnetic interference (EMI) shielding composite fabric with simultaneous high-efficiency photothermal conversion and Joule…

Abstract

Purpose

This study aims to fabricate a multifunctional electromagnetic interference (EMI) shielding composite fabric with simultaneous high-efficiency photothermal conversion and Joule heating performances.

Design/methodology/approach

A multifunctional polypyrrole (PPy) hydrogel/multiwalled carbon nanotube (MWCNT)/cotton EMI shielding composite fabric (hereafter denoted as PHMC) was prepared by loading MWCNT onto tannin-treated cotton fabric, followed by in situ crosslinking-polymerization to synthesize three-dimensional (3D) conductive networked PPy hydrogel on the surface of MWCNT-coated cotton fabric.

Findings

Benefiting from the unique interconnected 3D networked conductive structure of PPy hydrogel, the obtained PHMC exhibited a high EMI-shielding effectiveness vale of 48 dB (the absorbing electromagnetic wave accounted for 84%) within a large frequency range (8.2–12.4 GHz). Moreover, the temperature of the laminated fabric reached 54°C within 900 s under 15 V, and it required more than 100 s to return to room temperature (28.7°C). When the light intensity was adjusted to 150 mW/cm2, the PHMC temperature was about 38.2°C after lighting for 900 s, indicating high-efficiency electro-photothermal effect function.

Originality/value

This paper provides a novel strategy for designing a type of multifunctional EMI shielding composite fabric with great promise for wearable smart garments, EMI shielding and personal heating applications.

Details

Pigment & Resin Technology, vol. 53 no. 2
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 1 March 2024

Asif Ur Rehman, Pedro Navarrete-Segado, Metin U. Salamci, Christine Frances, Mallorie Tourbin and David Grossin

The consolidation process and morphology evolution in ceramics-based additive manufacturing (AM) are still not well-understood. As a way to better understand the ceramic selective…

Abstract

Purpose

The consolidation process and morphology evolution in ceramics-based additive manufacturing (AM) are still not well-understood. As a way to better understand the ceramic selective laser sintering (SLS), a dynamic three-dimensional computational model was developed to forecast thermal behavior of hydroxyapatite (HA) bioceramic.

Design/methodology/approach

AM has revolutionized automotive, biomedical and aerospace industries, among many others. AM provides design and geometric freedom, rapid product customization and manufacturing flexibility through its layer-by-layer technique. However, a very limited number of materials are printable because of rapid melting and solidification hysteresis. Melting-solidification dynamics in powder bed fusion are usually correlated with welding, often ignoring the intrinsic properties of the laser irradiation; unsurprisingly, the printable materials are mostly the well-known weldable materials.

Findings

The consolidation mechanism of HA was identified during its processing in a ceramic SLS device, then the effect of the laser energy density was studied to see how it affects the processing window. Premature sintering and sintering regimes were revealed and elaborated in detail. The full consolidation beyond sintering was also revealed along with its interaction to baseplate.

Originality/value

These findings provide important insight into the consolidation mechanism of HA ceramics, which will be the cornerstone for extending the range of materials in laser powder bed fusion of ceramics.

Details

Rapid Prototyping Journal, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1355-2546

Keywords

Article
Publication date: 27 January 2023

Dhanalakshmi K.M., Kavya G. and Rajkumar S.

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband…

Abstract

Purpose

This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband (UWB) frequency range. The antenna is designed for usage in massive multiple input multiple output (MIMO) and closed packaging applications.

Design/methodology/approach

The size of the antenna is 24 × 24 × 1.6 mm3. The radiating element of the antenna is derived from the Sierpinski–Knopp (SK) fractal geometry for miniaturization of the antenna size. The antenna has a single reflecting stub placed between the two orthogonal feeds, to improve isolation.

Findings

The proposed antenna system exhibits S11 < −10 dB, S21 < −15 dB and stable radiation characteristics in the entire operating region. It also offers an envelope correlation coefficient < 0.01, a diversity gain > 9.9 dB and a capacity loss < 0.4 bps/Hz. The simulated and measured outputs were compared and results were found to be in similarity.

Originality/value

The proposed UWB-MIMO antenna has significant size reduction through usage of SK fractal geometry for radiating element. The antenna uses a single radiating element with dual feed. The stub is between the antenna elements which provide a compact and miniaturized MIMO solution for high density packaging applications. The UWB-MIMO antenna provides an isolation better than −20 dB in the entire UWB operating band.

Article
Publication date: 30 September 2022

Hamada Abdelwahab, Fatimah A.M. Al-Zahrani, Ali A. Ali, Ammar Mahmoud and Long Lin

This paper aims to synthesize new screen-printing ink formula based on new derivatives of azo thiadiazol disperse dyes and evaluate their characteristics after being printed on…

Abstract

Purpose

This paper aims to synthesize new screen-printing ink formula based on new derivatives of azo thiadiazol disperse dyes and evaluate their characteristics after being printed on polyester fabric substrates.

Design/methodology/approach

New dispersed dyes based on 1, 3, 4-Thiadiazole derivatives (dyes 1 and 2) were prepared and confirmed by different analyses, infrared (IR), mass and nuclear magnetic resonance (NMR) spectroscopy, and then formulated as colored materials in the screen-printing ink formulations. Printing pastes containing the prepared dyestuffs and other ingredients were used for printing polyester using screen-printing or traditional printing. The characteristics of printed polyester fabric substrates were measured by color measurements such as a*, b*, L*, C*, E, Ho, R% and color strength, as well as light, washing, crock and alkali perspiration fastness, and finally, the depth of penetration was evaluated.

Findings

The prepared 1, 3, 4-Thiadiazole derivatives (dyes 1 and 2) were obtained from the reaction of 5,5’-(1,4-phenylene)bis(1,3,4-Thiadiazole-2-amine) with resorcinol and m-toluidine as a coupling component. The suitability of the prepared dyestuffs for silk screen-printing on polyester fabrics has been investigated. The prints obtained from a formulation containing dye 1 possess high color strength as well as good overall fastness properties if compared to those obtained using dye 2.

Practical implications

The method of synthesis of the new dyestuffs and screen-printing ink provides a simple and practical solution to prepare some new heterocyclic disperse azo dyes, and they are formulated in the screen-printing inks for printing on a polyester fabric substrate.

Originality/value

The prepared disperse dyes based on 1,3,4-Thiadiazole derivatives (dyes 1 and 2) could be used in textile printing of polyester on an industrial scale.

Details

Pigment & Resin Technology, vol. 53 no. 3
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 15 December 2023

Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng and Tao Zhang

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Abstract

Purpose

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Design/methodology/approach

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

Findings

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

Originality/value

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 March 2024

Khaled Mostafa and Azza El-Sanabary

The novelty addressed here is undertaken by using tailor-made and fully characterized starch nanoparticles (SNPs) having a particle size ranging from 80 to 100 nm with a larger…

Abstract

Purpose

The novelty addressed here is undertaken by using tailor-made and fully characterized starch nanoparticles (SNPs) having a particle size ranging from 80 to 100 nm with a larger surface area, biodegradability and high reactivity as a starting substrate for cadmium ions and basic dye removal from wastewater effluent. This was done via carboxylation of SNPs with citric acid via esterification reaction using the dry preparation technique, in which a simple, energy-safe and sustainable process concerning a small amount of water, energy and toxic chemicals was used. The obtained adsorbent is designated as cross-linked esterified starch nanoparticles (CESNPs).

Design/methodology/approach

The batch technique was used to determine the CESNPs adsorption capacity, whereas atomic adsorption spectrometry was used to determine the residual cadmium ions concentration in the filtrate before and after adsorption. Different factors affecting adsorption were examined concerning pH, contact time, adsorbent dose and degree of carboxylation. Besides, to validate the esterification reaction and existence of carboxylic groups in the adsorbent, CESNPs were characterized metrologically via analytical tools for carboxyl content estimation and instrumental tools using Fourier-transform infrared spectroscopy (FTIR) spectra and scanning electron microscopy (SEM) morphological analysis.

Findings

The overall adsorption potential of CESNPs was found to be 136 mg/g when a 0.1 g adsorbent dose having 190.8 meq/100 g sample carboxyl content at pH 5 for 60 min contact time was used. Besides, increasing the degree of carboxylation of the CESNPs expressed as carboxyl content would lead to the higher adsorption capacity of cadmium ions. FTIR spectroscopy analysis elucidates the esterification reaction with the appearance of a new intense peak C=O ester at 1,700 cm−1, whereas SEM observations reveal some atomic/molecules disorder after esterification.

Originality/value

The innovation addressed here is undertaken by studying the consequence of altering the extent of carboxylation reaction expressed as carboxyl contents on the prepared CESNPs via a simple dry technique with a small amount of water, energy and toxic chemicals that were used as a sustainable bio nano polymer for cadmium ions and basic dye removal from wastewater effluent in comparison with other counterparts published in the literature.

Details

Pigment & Resin Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 3 November 2022

Xiaoping Lin, Xiaoyan Li, Jiming Yao, Xianghong Li and Jianlin Xu

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible…

Abstract

Purpose

To develop electrode materials for supercapacitor with superior electrochemical performance and simple preparation process, the purpose of this study is to prepare flexible CC/NiS/a-NiS electrodes with self-supporting structure by loading hydrothermally synthesized a-NiS particles along with nano-NiS on carbon cloth by electroplating method.

Design/methodology/approach

The effects of current densities, temperatures and pH values on the loading amount and uniformity of the active substances during the plating process were investigated on the basis of optimization of surface morphology, crystalline structure and electrochemical evaluation as the cyclic voltammetry curves, constant current charge–discharge curves and AC impedance.

Findings

The a-NiS particles on CC/NiS/a-NiS were mostly covered by the plated nano-NiS, which behaved as a bulge and provided a larger specific surface area. The CC/NiS/a-NiS electrode prepared with the optimized parameter exhibited a specific capacitance of 115.13 F/g at a current density of 1 A/g and a Coulomb efficiency of 84% at 5 A/g, which is superior to that of CC/NiS electrode prepared by electroplating at a current density of 10 mA/cm2, a temperature of 55°C and a pH of 4, demonstrating its fast charge response of the electrode and potential application in wearable electronics.

Originality/value

This study provides an integrated solution for the development of specifically structured NiS-based electrode for supercapacitor with simple process, low cost and high electrochemical charge/discharge performance, and the simple and easy-to-use method is also applicable to other electrochemically active composites.

Details

Pigment & Resin Technology, vol. 53 no. 3
Type: Research Article
ISSN: 0369-9420

Keywords

Article
Publication date: 28 September 2023

Vicente-Segundo Ruiz-Jacinto, Karina-Silvana Gutiérrez-Valverde, Abrahan-Pablo Aslla-Quispe, José-Manuel Burga-Falla, Aldo Alarcón-Sucasaca and Yersi-Luis Huamán-Romaní

This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite…

Abstract

Purpose

This paper aims to present the novel stacked machine learning approach (SMLA) to estimate low-cycle fatigue (LCF) life of SAC305 solder across structural parts. Using the finite element simulation (FEM) and continuous damage mechanics (CDM) model, a fatigue life database is built. The stacked machine learning (ML) model's iterative optimization during training enables precise fatigue predictions (2.41% root mean square error [RMSE], R2 = 0.975) for diverse structural components. Outliers are found in regression analysis, indicating potential overestimation for thickness transition specimens with extended lifetimes and underestimation for open-hole specimens. Correlations between fatigue life, stress factors, nominal stress and temperature are unveiled, enriching comprehension of LCF, thus enhancing solder behavior predictions.

Design/methodology/approach

This paper introduces stacked ML as a novel approach for estimating LCF life of SAC305 solder in various structural parts. It builds a fatigue life database using FEM and CDM model. The stacked ML model iteratively optimizes its structure, yielding accurate fatigue predictions (2.41% RMSE, R2 = 0.975). Outliers are observed: overestimation for thickness transition specimens and underestimation for open-hole ones. Correlations between fatigue life, stress factors, nominal stress and temperature enhance predictions, deepening understanding of solder behavior.

Findings

The findings of this paper highlight the successful application of the SMLA in accurately estimating the LCF life of SAC305 solder across diverse structural components. The stacked ML model, trained iteratively, demonstrates its effectiveness by producing precise fatigue lifetime predictions with a RMSE of 2.41% and an “R2” value of 0.975. The study also identifies distinct outlier behaviors associated with different structural parts: overestimations for thickness transition specimens with extended fatigue lifetimes and underestimations for open-hole specimens. The research further establishes correlations between fatigue life, stress concentration factors, nominal stress and temperature, enriching the understanding of solder behavior prediction.

Originality/value

The authors confirm the originality of this paper.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

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