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The paper aims to provide a review of the use of lasers in industry, with an emphasis on applications in manufacturing and material processing.

Following an introduction to lasers and their development, this paper considers a selection of key material processing applications.

This shows that, since their invention in 1960, lasers have emerged to play a vital role in numerous industrial processes. Gas (CO₂), solid‐state, excimer, semiconductor and fibre lasers are used in welding, soldering, drilling, cutting, micromachining, marking, engraving, heat treatment, material deposition and adhesive curing.

The paper provides a detailed review of the uses of lasers in industrial material processing and also places these applications in an historical context.

Considering its vast utility in industries, this paper aims to present a detailed review on fundamentals, classification and progresses in pressure sensors, along with its wide area of applications, its design aspects and challenges, to provide state-of-the-art gist to the researchers of the similar domain at one place.

Swiftly emerging research prospects in the micro-electro-mechanical system (MEMS) enable to build complex and sophisticated micro-structures on a substrate containing moving masses, cantilevers, flexures, levers, linkages, dampers, gears, detectors, actuators and many more on a single chip. One of the MEMS initial products that emerged into the micro-system technology is MEMS pressure sensor. Because of their high performance, low cost and compact in size, these sensors are extensively being adopted in numerous applications, namely, aerospace, automobile and bio-medical domain, etc. These application requirements drive and impose tremendous conditions on sensor design to overcome the tedious design and fabrication procedure before its reality. MEMS-based pressure sensors enable a wide range of pressure measurement as per the application requirements.

The paper provides a detailed review on fundamentals, classification and progresses in pressure sensors, along with its wide area of applications, its design aspects and challenges, to provide state of the art gist to the researchers of the similar domain at one place.

The present paper discusses the basics of MEMS pressure sensors, their working principles, different design aspects, classification, type of sensing diaphragm used and illustration of various transduction mechanisms. Moreover, this paper presents a comprehensive review on present trend of research on MEMS-based pressure sensors, its applications and the research gap observed till date along with the scope for future work, which has not been discussed in earlier reviews.

Because of the small size and high integration of capacitive micromachined ultrasonic transducer (CMUT) component, it can be made into large-scale array, but this lead to high hardware complexity, so the purpose of this paper is to use less elements to achieve better imaging results. In this research, an optimized sparse array is studied, which can suppress the side lobe and reduce the imaging artifacts compared with the equispaced sparse array with the same number of elements.

Genetic algorithm is used to sparse the CMUT linear array, and Kaiser window apodization is added to reduce imaging artifacts, the beam pattern and peak-to-side lobe ratio are calculated, point targets imaging comparisons are performed. Furthermore, a 256-elements CMUT linear array is used to carry out the imaging experiment of embedded mass and forearm blood vessel, and the imaging results are compared quantitatively.

Through the imaging comparison of embedded mass and forearm blood vessel, the feasibility of optimized sparse array of CMUT is verified, and the purpose of reducing the hardware complexity is achieved.

This research provides a basis for the large-scale CMUT array to reduce the hardware complexity and the amount of calculation. At present, the CMUT array has been used in medical ultrasound imaging and has huge market potential.

This paper intends to lay a background knowledge towards the feasibility of developing a bottom-drive variable capacitance micromotor (VCM) using a surface micromachining process (SMP). The purpose of this paper is to determine the possibility of neglecting the bending of the rotor plates caused by the electrostatic normal forces when deploying a set of mechanical supports.

A multiphysics simulation approach is considered in order to analyse the coupled electromechanical effects in a steady state and to evaluate if the proposed geometries are useful to reduce the bending of the plates.

A surfaced micromachined bottom-drive VCM requires mechanical reinforcement in order to eliminate the risk of an electrical short circuit caused by the deformation in the rotor plates. The combination of an external supporting ring and anchored structural ribs on top of the rotor poles is sufficient to neglect the deformation in the poles of the rotor.

An original analysis with the objective of setting a background in the development of a bottom-drive electrostatic micromotor using a SMP is presented.

This paper aims to purpose the new design and fabrication scheme of Touch Mode Capacitive Pressure Sensor (TMCPS), which can be used in a wireless integrated resistor, inductor and capacitor circuit for monitoring pressure in biomedical applications.

This study focuses on the design, simulation and fabrication of dynamic capacitors, based on surface micromachining using polysilicon or aluminum films as the top electrode, both structural materials are capped with a 1.5 μm-thick polyimide film.

The design of microstructures using a composite model fits perfectly the preset mechanical behavior. After the full fabrication, the dynamic capacitors show complete mechanical flexibility and stability.

The novelty of the method presented in this study includes two important aspects: first, the capacitors are designed as a planar cavity within a rigid frame, where two walls contain channels which allow for the etching of the sacrificial material. Second, the electromechanical structures are designed using a composite model that includes a polyimide film capping for a precise pressure sensing, which also protects the internal cavity and, at the same time, provides full biocompatibility.

This paper aims to propose a method to reduce the resistance of silicon-based V-shaped electrothermal microactuator (VEM) by applying a surface sputtering process.

Four VEM’s samples have been fabricated using traditional silicon on insulator (SOI)-Micro-electro-mechanical System (MEMS) technology, three of them are coated with a thin layer of platinum on the top surface by sputtering technique with different sputtered times and the other is original. The displacements of the VEM are calculated and simulated to evaluate the advantages of sputtering method.

The measured results show that the average resistance of the sputtered structures is approximately 1.16, 1.55 and 2.4 times lower than the non-sputtering sample corresponding to the sputtering time of 1.5, 3 and 6 min. Simulation results confirmed that the maximum displacement of the sputtered VEM is almost 1.45 times larger than non-sputtering one in the range of voltage from 8 to 20 V. The experimental displacements are also measured to validate the better performance of the sputtered samples.

The experimental results demonstrated the better displacement of the VEM structure after using the platinum sputtering process. The improvement can be considered and applied for enhancing displacement as well as decreasing the driving voltage of the other electrothermal microactuators like U- or Z-shaped structures while combining with the low-cost SOI-MEMS micromachining technology.

At the start of a new year, Stephen McClelland gives a personal opinion on the most interesting sensor technologies to have emerged recently.