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Article
Publication date: 22 September 2023

Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar and Fakhrozi Che Ani

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

Abstract

Purpose

This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing.

Design/methodology/approach

The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing.

Findings

The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%.

Originality/value

Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 2 January 2024

Chongbin Hou, Yang Qiu, Xingyan Zhao, Shaonan Zheng, Yuan Dong, Qize Zhong and Ting Hu

By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the…

Abstract

Purpose

By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process.

Design/methodology/approach

A simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared.

Findings

The Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend.

Originality/value

Previous studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process.

Details

Multidiscipline Modeling in Materials and Structures, vol. 20 no. 1
Type: Research Article
ISSN: 1573-6105

Keywords

Article
Publication date: 21 December 2023

Xinran Zhao, Yingying Pang, Gang Wang, Chenhui Xia, Yuan Yuan and Chengqian Wang

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Abstract

Purpose

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Design/methodology/approach

An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples.

Findings

The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth.

Originality/value

The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 28 March 2024

Zhong Jin, Xiang Li, Feng He, Fangting Liu, Jinyu Li and Junhui Li

The performance of oil-filled pressure cores is very much affected by the corrugated diaphragm and the oil filling volume. The purpose of this paper is to show the effects of…

Abstract

Purpose

The performance of oil-filled pressure cores is very much affected by the corrugated diaphragm and the oil filling volume. The purpose of this paper is to show the effects of different corrugated diaphragms, different oil filling volumes and different treatments of the corrugated diaphragms on the performance of pressure sensors.

Design/methodology/approach

Pressure-sensitive cores with different diaphragm diameters, different diaphragm ripple numbers and different oil filling volumes are produced, and thermal cycling is introduced to improve the diaphragm performance, and finally the performance of each pressure-sensitive core is tested and the test data are analyzed and compared.

Findings

The experimental results show that the larger the diameter of the corrugated diaphragm used for encapsulation, the better the performance. For pressure-sensitive cores using smaller diameter corrugated diaphragms, the performance of one corrugation is better than that of two corrugations. When the number of corrugations and the diameter are the same size, the performance of the outer ring of the diaphragm with concave corrugations is better than that with convex corrugations. At the same time, the diaphragm after thermal cycling treatment and appropriate reduction of encapsulated oil filling can improve the performance of the pressure-sensitive core.

Originality/value

By exploring the effects of corrugated diaphragm and oil filling volume on the performance of oil-filled pressure cores, the design of oil-filled pressure sensors can be guided to improve sensor performance.

Details

Sensor Review, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 21 February 2024

Mohamed Bechir Ben Hamida

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration…

Abstract

Purpose

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

Design/methodology/approach

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Findings

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

Originality/value

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.

Details

Multidiscipline Modeling in Materials and Structures, vol. 20 no. 2
Type: Research Article
ISSN: 1573-6105

Keywords

Open Access
Article
Publication date: 5 February 2024

Krištof Kovačič, Jurij Gregorc and Božidar Šarler

This study aims to develop an experimentally validated three-dimensional numerical model for predicting different flow patterns produced with a gas dynamic virtual nozzle (GDVN).

Abstract

Purpose

This study aims to develop an experimentally validated three-dimensional numerical model for predicting different flow patterns produced with a gas dynamic virtual nozzle (GDVN).

Design/methodology/approach

The physical model is posed in the mixture formulation and copes with the unsteady, incompressible, isothermal, Newtonian, low turbulent two-phase flow. The computational fluid dynamics numerical solution is based on the half-space finite volume discretisation. The geo-reconstruct volume-of-fluid scheme tracks the interphase boundary between the gas and the liquid. To ensure numerical stability in the transition regime and adequately account for turbulent behaviour, the k-ω shear stress transport turbulence model is used. The model is validated by comparison with the experimental measurements on a vertical, downward-positioned GDVN configuration. Three different combinations of air and water volumetric flow rates have been solved numerically in the range of Reynolds numbers for airflow 1,009–2,596 and water 61–133, respectively, at Weber numbers 1.2–6.2.

Findings

The half-space symmetry allows the numerical reconstruction of the dripping, jetting and indication of the whipping mode. The kinetic energy transfer from the gas to the liquid is analysed, and locations with locally increased gas kinetic energy are observed. The calculated jet shapes reasonably well match the experimentally obtained high-speed camera videos.

Practical implications

The model is used for the virtual studies of new GDVN nozzle designs and optimisation of their operation.

Originality/value

To the best of the authors’ knowledge, the developed model numerically reconstructs all three GDVN flow regimes for the first time.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 34 no. 4
Type: Research Article
ISSN: 0961-5539

Keywords

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