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A simplified general purpose analytical finite element model has been developed to analyze the thermal performance of a continuous flow polymerase chain reaction (CPCR) microdevice. The corresponding governing differential equations along with the appropriate boundary conditions have been solved using a self‐developed code in Matlab®. Results obtained from the finite element simulations have been validated with available published results and also showed good agreement with those obtained from commercial FEA package, ANSYS®. The present methodology has an added advantage due to its flexibility where the unit cell of the finite element model can be arranged into different orientation for analyses of different CPCR microdevice configuration. In microchannel heat sinks, the results obtained agree well with the published result which demonstrates the flexibility and robustness of present methodology to be used for various applications.

The scope of this paper is to propose an integrated strategy to support the decision process of a semiconductor company interested in entering a new market and launching a new product in the biotech industry. The complexity of the environment and the high numbers of factors involved, leads to the conclusion that the traditional tools and models of the strategic management are not enough to analyse fully the market and to elaborate a winning strategy. For this reason an integrated approach is developed, which is able to combine elements coming from different perspectives through the introduction of new ones. The proposed approach is then applied to a real situation.

This paper aims to investigate the applicability of 3D-printed molds to be used as a substitute for photolithography in the formation of polymer-based stamps. It proposes leveraging 3D printing as a rapid prototyping tool to be applied to microfluidic fabrication.

Different designs are created using computer-aided design (CAD) software and printed via Makerbot 3D printer. The molds serve as negative reliefs for a PDMS stamp. The stamp is used to apply paraffin wax to chromatography paper, creating hydrophobic barriers and hydrophilic channels. The minimum functional channel widths and barrier widths are determined for the method.

The method is demonstrated to be effective for bypassing the more cost-prohibitive photolithography approach for rapid paper microdevice fabrication. This approach produces functional channels that can be used for on-chip analytical assays. The minimum functional barrier widths and minimum functional channel widths are in good agreement with other published methods for paper-based microchannel fabrication.

The approach cannot generate the high-resolution structures possible with photolithography. Therefore, if higher resolutions are needed for a particular application, this approach is not the best.

The simplicity of the approach introduces an affordable method to create disposable devices that can be used at the point of testing.

The paper satisfies a need for inexpensive, rapid prototyping of paper-based devices. The method is simple and can be used as a tool for introducing labs to microfluidics research.

This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. In this system, to allow close monitoring of magnitude and direction of microforces (adhesion, surface tension, friction, and assembly forces) acting on microdevices during assembly, the PVDF polymer films are used to fabricate the highly sensitive 1D and 2D sensors, which can detect the real‐time microforce and force rate information during assembly processes. This technology has been successfully used to perform a tele‐assembly of the surface MEMS structures with force/visual feedback via Internet between USA and Hong Kong. Ultimately, this E‐manufacture system will provide a critical and major step towards the development of automated micromanufacturing processes for batch assembly of microdevices.

The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications.

A broad array of manufacturing approaches available in the packaging industry, including lamination, lithography, etching, electroforming, machining, bonding, etc. and a large number of available functional materials such as polymers, ceramics, metals, etc. were explored for producing functional microdevices with greater design freedom.

Good quality MEMS devices can be manufactured using packaging style fabrication, particularly using stacks of laminates. Furthermore, such microdevices can be built with a high degree of integration, pre‐packaged, and at low cost.

Further manufacturing research work should be undertaken in collaboration with the PCB and packaging industries, which stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own integrated MEMS products.

The paper presents examples of basic packaging fabrication processes for producing 3‐D structures and free‐standing structures, and a new MEMS manufacturing paradigm to build micro‐electromechanical (MEMS) for biomedical, optical, and RF communication applications.

Historically, the idea of using electrostatic phenomena to produce motion has long stimulated the activity of scientists. Although the power generated by electrostatic motors is modest, the absence of windings and ferromagnetic material makes this kind of device competitive for applications characterized by low levels of torque and reduced volumes. During last years a renewed attention appeared towards electrostatic devices in the microscopic scale; their fabrication has been possible thanks to the technology for Si‐integrated‐circuits. In particular, electrostatic micromotors have an increasing role as position actuators when submillimetric movements are required. Methodologies of numerical simulation applied to microdevices are a helpful tool for the designer, who should fulfil criteria often in mutual clash like electromechanical response and fabrication cost. More generally, procedures of automated optimal design are now available, tackling the design problem as the constrained minimization of an objective function suitably set up.

The purpose of this paper is twofold: to describe a relevant improvement to an in-house FEM procedure for the heat transfer analysis of cross-flow micro heat exchangers and to study the influence of microchannel cross-sectional geometry and solid wall thermal conductivity on the thermal performance of these microdevices.

The velocity field in each microchannel is calculated separately. Then the energy equation is solved in the whole computational domain. Domain decomposition and grids that do not match at the common interface are employed to make meshing more effective. Some flow maldistribution effects are taken into account.

The results show that larger thermal conductivities of the solid walls and rectangular cross-sectional geometries with higher aspect ratios allow the maximization of the total heat flow rate in the device. However, on the basis of the heat transfer per unit pumping power, the square cross-section could be the best option.

The value of the average viscosity is assumed to be different in different microchannels, but constant within each of the microchannels.

The procedure can represent a valuable tool for the design of cross-flow micro heat exchangers.

In spite of requiring limited computational resources, the improved procedure can take into account flow maldistribution effects stemming from non-uniform microchannel temperatures.

This paper presents our development of a novel force and force rate sensory system to advance applications in micromanipulation using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. To allow close monitoring of magnitude and direction of microforces acting on microdevices during manipulation, PVDF ploymer films are used to fabricate highly sensitive 1D and 2D sensors to detect real‐time microforce and force rate information during the manipulation process. The sensory system with a resolution in the range of sub‐micronewtons can be applied effectively to develop a technology on the force‐reflection microassembly of surface MEMS structures. In addition, a tele‐micromanipulation platform, which can be used to perform tele‐microassembly of the MEMS structures and tele‐cell‐manipulation with force/haptic feedback via Internet was also built successfully.