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The purpose of this paper is to improve the productivity and quality of the wire arc additive manufacturing process by benchmarking the strategies from the selected six strategies, namely, heat treatment process, inter pass cooling process, inter pass cold rolling process, peening process, friction stir processing and oscillation process.

To overcome the lack of certainty associated with correlations and relationships in quality functional deployment, fuzzy numbers have been integrated with the quality functional deployment framework. Twenty performance measures have been identified from the literature under five groups, namely, mechanical properties, physical properties, geometrical properties, cost and material properties. Using house of quality weights are allocated to performance measures and groups, relationships are established between performance measures and strategies, and correlations are assigned between strategies. Finally, for each strategy, relative importance, score and crisp values are calculated.

Inter pass cold rolling process strategy is computed with the highest crisp value of 15.80 which is followed by peening process, heat treatment process, friction stir processing, inter pass cooling process,] and oscillation process strategy.

To the best of the authors’ knowledge, there has been no research in the literature that analyzes the strategies to improve the quality and productivity of the wire arc additive manufacturing process.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

Everyone is extremely concerned about environmental protection and health safety due to the rise in living standards. Plant-derived natural dyes have garnered much industrial attention in food, pharmaceutical, textile, cosmetics, etc. owing to their health and environmental benefits. The present study aims to focus on the elimination of the use of synthetic dyes and provides brief information about natural dyes, their sources, extraction procedures with characterization and various advantages and disadvantages.

In producing natural colors, extraction and purification are essential steps. Various conventional methods used till date have a low yield, as these consume a lot of solvent volume, time, labor and energy or may destroy the coloring behavior of the actual molecules. The establishment of proper characterization and certification protocols for natural dyes would improve the yielding of natural dyes and benefit both producers and users.

However, scientists have found modern extraction methods to obtain maximum color yield. They are also modifying the fabric surface to appraise its uptake behavior of color. Various extraction techniques such as solvent, aqueous, enzymatic and fermentation and extraction with microwave or ultrasonic energy, supercritical fluid extraction and alkaline or acid extraction are currently available for these natural dyes and are summarized in the present review article.

If natural dye availability can be increased by the different extraction measures and the cost of purified dyes can be brought down with a proper certification mechanism, there is a wide scope for the adoption of these dyes by small-scale dyeing units.

This paper comprehensively addresses the influence of chopped strand mat glass fiber-reinforced polymer (GFRP) patch configurations such as geometry, dimensions, position and the number of layers of patches, whether a single or double patch is used and how well debonding the area under the patch improves the strength of the cracked aluminum plates with different crack lengths.

Single-edge cracked aluminum specimens of 150 mm in length and 50 mm in width were tested using the tensile test. The cracked aluminum specimens were then repaired using GFRP patches with various configurations. A three-dimensional (3D) finite element method (FEM) was adopted to simulate the repaired cracked aluminum plates using composite patches to obtain the stress intensity factor (SIF). The numerical modeling and validation of ABAQUS software and the contour integral method for SIF calculations provide a valuable tool for further investigation and design optimization.

The width of the GFRP patches affected the efficiency of the rehabilitated cracked aluminum plate. Increasing patch width WP from 5 mm to 15 mm increases the peak load by 9.7 and 17.5%, respectively, if compared with the specimen without the patch. The efficiency of the GFRP patch in reducing the SIF increased as the number of layers increased, i.e. the maximum load was enhanced by 5%.

This study assessed repairing metallic structures using the chopped strand mat GFRP. Furthermore, it demonstrated the superiority of rectangular patches over semicircular ones, along with the benefit of using double patches for out-of-plane bending prevention and it emphasizes the detrimental effect of defects in the bonding area between the patch and the cracked component. This underlines the importance of proper surface preparation and bonding techniques for successful repair.

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

This study aims to systematically review the health risk assessment of the concentration of heavy metals in Pistacia species globally.

The authors systematically searched PubMed, Science Direct, Scopus and Google Scholar to identify all articles published between 1 January 2002 and 20 August 2022. A total of 33 studies met the authors’ inclusion criteria, and their data were extracted. Additionally, the potential risk to human health was assessed by calculating the target hazard quotient and hazard index for both child and adult consumers.

The estimated daily intake for heavy metals in the included studies ranged from 9.72 × 10^–9 to 7.35 (mg/day) in the following order: zinc (Zn) > mercury (Hg) > iron (Fe) > lead (Pb) > copper (Cu) > aluminum (Al) > nickel (Ni) > chromium (Cr) > manganese (Mn) > cadmium (Cd) > arsenic (As) > selenium (Se) > cobalt (Co). Among the studies that investigated heavy metals in Pistacia species around the world, the non-carcinogenic risk for all species of Pistacia was determined to be less than 1, except for Pb and Hg in Pistacia lentiscus.

The soil near the industrial area contained excessive amounts of heavy metals, which led to the transfer of heavy metals to plants. Owing to the insufficiency of the number of studies that examined heavy metals in Pistacia species, further monitoring and investigations were recommended.

This paper aims to present the design development and measurement of two aerodynamic slotted X-bands back-to-back planer substrate-integrated rectangular waveguide (SIRWG/SIW) to Microstrip (MS) line transition for satellite and RADAR applications. It facilitates the realization of nonplanar (waveguide-based) circuits into planar form for easy integration with other planar (microstrip) devices, circuits and systems. This paper describes the design of a SIW to microstrip transition. The transition is broadband covering the frequency range of 8–12 GHz. The design and interconnection of microwave components like filters, power dividers, resonators, satellite dishes, sensors, transmitters and transponders are further aided by these transitions. A common planar interconnect is designed with better reflection coefficient/return loss (RL) (S₁₁/S₂₂ ≤ 10 dB), transmission coefficient/insertion loss (IL) (S₁₂/S₂₁: 0–3.0 dB) and ultra-wideband bandwidth on low profile FR-4 substrate for X-band and Ku-band functioning to interconnect modern era MIC/MMIC circuits, components and devices.

Two series of metal via (6 via/row) have been used so that all surface current and electric field vectors are confined within the metallic via-wall in SIW length. Introduced aerodynamic slots in tapered portions achieve excellent impedance matching and tapered junctions with SIW are mitered for fine tuning to achieve minimum reflections and improved transmissions at X-band center frequency.

Using this method, the measured IL and RLs are found in concord with simulated results in full X-band (8.22–12.4 GHz). RLC T-equivalent and p-equivalent electrical circuits of the proposed design are presented at the end.

The measurement of the prototype has been carried out by an available low-cost X-band microwave bench and with a Keysight E4416A power meter in the microwave laboratory.

The transition is fabricated on FR-4 substrate with compact size 14 mm × 21.35 mm × 1.6 mm and hence economical with IL lie within limits 0.6–1 dB and RL is lower than −10 dB in bandwidth 7.05–17.10 GHz. Because of such outstanding fractional bandwidth (FBW: 100.5%), the transition could also be useful for Ku-band with IL close to 1.6 dB.

This study aims to enhance merging of additive manufacturing (AM) techniques with powder injection molding (PIM). In this way, the prototypes could be 3D-printed and mass production implemented using PIM. Thus, the surface properties and mechanical performance of parts produced using powder/polymer binder feedstocks [material extrusion (MEX) and PIM] were investigated and compared with powder manufacturing based on direct metal laser sintering (DMLS).

PIM parts were manufactured from 17-4PH stainless steel PIM-quality powder and powder intended for powder bed fusion compounded with a recently developed environmentally benign binder. Rheological data obtained at the relevant temperatures were used to set up the process parameters of injection molding. The tensile and yield strengths as well as the strain at break were determined for PIM sintered parts and compared to those produced using MEX and DMLS. Surface properties were evaluated through a 3D scanner and analyzed with advanced statistical tools.

Advanced statistical analyses of the surface properties showed the proximity between the surfaces created via PIM and MEX. The tensile and yield strengths, as well as the strain at break, suggested that DMLS provides sintered samples with the highest strength and ductility; however, PIM parts made from environmentally benign feedstock may successfully compete with this manufacturing route.

This study addresses the issues connected to the merging of two environmentally efficient processing routes. The literature survey included has shown that there is so far no study comparing AM and PIM techniques systematically on the fixed part shape and dimensions using advanced statistical tools to derive the proximity of the investigated processing routes.

This paper aims to establish a lattice Boltzmann (LB) method for solid-liquid phase transition (SLPT) from the pore scale to the representative elementary volume (REV) scale. By applying this method, detailed information about heat transfer and phase change processes within the pores can be obtained, while also enabling the calculation of larger-scale SLPT problems, such as shell-and-tube phase change heat storage systems.

Three-dimensional (3D) pore-scale enthalpy-based LB model is developed. The computational input parameters at the REV scale are derived from calculations at the pore scale, ensuring consistency between the two scales. The approaches to reconstruct the 3D porous structure and determine the REV of metal foam were discussed. The implementation of conjugate heat transfer between the solid matrix and the solid−liquid phase change material (SLPCM) for the proposed model is developed. A simple REV-scale LB model under the local thermal nonequilibrium condition is presented. The method of bridging the gap between the pore-scale and REV-scale enthalpy-based LB models by the REV is given.

This coupled method facilitates detailed simulations of flow, heat transfer and phase change within pores. The approach holds promise for multiscale calculations in latent heat storage devices with porous structures. The SLPT of the heat sinks for electronic device thermal control was simulated as a case, demonstrating the efficiency of the present models in designing and optimizing SLPT devices.

A coupled pore-scale and REV-scale LB method as a numerical tool for investigating phase change in porous materials was developed. This innovative approach allows for the capture of details within pores while addressing computations over a large domain. The LB method for simulating SLPT from the pore scale to the REV scale was given. The proposed method addresses the conjugate heat transfer between the SLPCM and the solid matrix in the enthalpy-based LB model.

The criteria importance through intercriteria correlation (CRITIC) and range of value (ROV) combined methods were used to determine a single index for all multiple responses.

This paper used cold metal transfer (CMT) and pulse metal-inert gas (MIG) welding processes to study the weld-on-bead geometry of AA2099-T86 alloy. This study used Taguchi's approach to find the optimal setting of the input welding parameters. The welding current, welding speed and contact-tip-to workpiece distance were the input welding parameters for finding the output responses, i.e. weld penetration, dilution and heat input. The L9 orthogonal array of Taguchi's approach was used to find out the optimal setting of the input parameters.

The optimal input welding parameters were determined with combined output responses. The predicted optimum welding input parameters were validated through confirmation tests. Analysis of variance showed that welding speed is the most influential factor in determining the weld bead geometry of the CMT and pulse MIG welding techniques.

The heat input and weld bead geometry are compared in both welding processes. The CMT welding samples show superior defect-free weld beads than pulse MIG welding due to lesser heat input and lesser dilution.