This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu…
This paper used a novel technique, which is thermo-compression bonding, and Sn-1.0Ag-0.5Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu joints). The purpose of the study is to form high-melting-point IMC joints for high-temperature power electronics applications. The study also investigated the effect of temperature gradient on the microstructure evolution and the growth behavior of IMCs.
In this paper, the thermo-compression bonding technique was used to form full Cu3Sn joints.
Experimental results indicated that full Cu/Cu3Sn/Cu solder joints with the thickness of about 5-6 µm are formed in a short time of 9.9 s and under a low pressure of 0.016 MPa at 450°C by thermo-compression bonding technique. During the bonding process, Cu6Sn5 grew with common scallop-like shape at Cu/SAC105 interfaces, which was followed by the growth of Cu3Sn with planar-like shape between Cu/Cu6Sn5 interfaces. Meanwhile, the morphology of Cu3Sn transformed from a planar-like shape to wave-like shape until full IMCs solder joints were eventually formed during thermo-compression bonding process. Asymmetrical growth behavior of the interfacial IMCs was also clearly observed at both ends of the Cu/SAC105 (Sn-1.0Ag-0.5Cu)/Cu solder joints. Detailed reasons for the asymmetrical growth behavior of the interfacial IMCs during thermo-compression bonding process are given. The compound of Ag element causes a reduction in Cu dissolution rate from the IMC into the solder solution at the hot end, inhibiting the growth of IMCs at the cold end.
This study used the thermo-compression bonding technique and Sn-1.0Ag-0.5Cu to form full Cu3Sn joints.
The high heat induced by fire can substantially decrease the load-bearing capacity, which is more critical in unprotected steel structures than concrete reinforced…
The high heat induced by fire can substantially decrease the load-bearing capacity, which is more critical in unprotected steel structures than concrete reinforced structures. One of the conventional steel structures is a steel-plate shear wall (SPSW) in which thin infill steel plates are used to resist against the lateral loads. Due to the small thickness of infill plates, high heat seems to dramatically influence the lateral load-bearing capacity of this type of structures. Therefore, this study aims to provide an investigation into the performance of SPSW with reduced beam section at high temperature.
In the present paper, to examine the seismic performance of SPSW at high temperature, 48 single-span single-story steel frames equipped with steel plates with the thicknesses of 2.64 mm, 5 mm and 7 mm and yield stresses of 85 MPa, 165 MPa, 256 MPa and 300 MPa were numerically modeled. Furthermore, their behavioral indices, namely, strength, stiffness, ductility and hysteresis behavior, were studied at the temperatures of 20, 458, 642 and 917? The simulated models in the present paper are based on the experimental specimen presented by Vian and Bruneau (2004).
The obtained results revealed that the high heat harshly diminishes the seismic performance of SPSW so that the lateral strength is reduced even by 95% at substantially high temperatures. Therefore, SPSW starts losing its strength and stiffness at high temperature such that it completely loses its capacity of strength, stiffness and energy dissipation at the temperature of 917? Moreover, it was proved that by separating the percentage of their participations variations of the infill plate in SPSW, their behavior and the bare frame can be examined even at high temperatures.
To the best of the authors’ knowledge, the seismic performance of SPSW at different temperatures has not been evaluated and compared yet.