Search results

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

As it is known, the electrostatic discharge (ESD) protection design of integrated circuit is very important, among which the silicon controlled rectifier (SCR) is one of the most commonly used ESD protection devices. However, the traditional SCR has the disadvantages of too high trigger voltage, too low holding voltage after the snapback and longer turn-on time. The purpose of this paper is to design a high-performance SCR in accordance with the design window under 0.25 µm process, and provide a new scheme for SCR design to reduce the trigger voltage, improve the holding voltage and reduce the turn-on time.

Based on the traditional SCR, an RC-INV trigger circuit is introduced. Through theoretical analysis, TCAD simulation and tape-out verification, it is shown that RC-INV triggering SCR can reduce the trigger voltage, increase the holding voltage and reduce the turn-on time of the device on the premise of maintaining good robustness.

The RC-INV triggering SCR has great performance, and the test shows that the transmission line pulse curve with almost no snapback can be obtained. Compared with the traditional SCR, the trigger voltage decreased from 32.39 to 16.24 V, the holding voltage increased from 3.12 to 14.18 V and the turn-on time decreased from 29.6 to 16.6 ns, decreasing by 43.9% the level of human body model reached 18 kV+.

Under 0.25 µm BCD process, this study propose a high-performance RC-INV triggering SCR ESD protection device. The work presented in this paper has a certain guiding significance for the design of SCR ESD protection devices.

This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes.

This study analyzes warpage during the reflow process. The shadow moiré experiment methodology is used to collect data on the dynamic warpage performance of a model with a form factor of 10mm × 10mm × 1mm. The temperature profile with heating from 25°C to 300°C at intervals of 50°C is used, and the sample is made to undergo a cooling process until it reaches the room temperature. Subsequently, ANSYS static structural simulation is performed on similar form factor models to ascertain the accuracy of the simulation results.

Results show that the deformation and total force induced by coefficient of thermal expansion (CTE) mismatch are examined based on the warpage performance of models with different sizes, that is, 45mm × 45mm × 1mm and 45mm × 15mm × 1mm. Compared with the experimental data, the simulated modeling accuracy yields a less than 5% deviation in the dynamic warpage prediction at a reflow temperature of 300°C. Results also reveal that the larger the model, the larger the warpage changes under the reflow temperature.

The simulated warpage is limited to the temperature and force induced by CTE mismatch between two materials. The form factor of the ball-grid array model is limited to only three different sizes. The model is assumed to be steady, isothermal and static. The simulation adopts homogenous materials, as it cannot accurately model nonhomogeneous multilayered composite materials.

This study can provide engineers and researchers with a profound understanding of molded PCB warpage, minimal resource utilization and the improved product development process.

The accurate prediction of molded PCB warpage can enable efficient product development and reduce resources and production time, thereby creating a sustainable environment.

The literature review points out that warpage in various types of PCBs was successfully examined, and that considerable efforts were exerted to investigate warpage reduction in PCB modules. However, PCB warpage studies are limited to bare PCBs. To the best of the authors’ knowledge, the examination of warpage in a molded PCB designed with a molded compound cover, as depicted in Figure 3, is yet to be conducted. A molded compound provides strong lattice support for PCBs to prevent deformation during the reflow process, which is a topic of considerable interest and should be explored.

The hygroscopic properties of 3D-printed filaments and moisture absorption itself during the process result in dimensional inaccuracy, particularly for nozzle movement along the x-axis and for micro-scale features. In view of that, this study aims to analyze in depth the dimensional errors and deviations of the fused filament fabrication (FFF)/fused deposition modeling (FDM) 3D-printed micropillars (MPs) from the reference values. A detailed analysis into the variability in printed dimensions below 1 mm in width without any deformations in the printed shape of the designed features, for challenging filaments like polymethyl methacrylate (PMMA) has been done. The study also explores whether the printed shape retains the designed structure.

A reference model for MPs of width 800 µm and height 2,000 µm is selected to generate a g-code model after pre-processing of slicing and meshing parameters for 3D printing of micro-scale structure with defined boundaries. Three SETs, SET-A, SET-B and SET-C, for nozzle diameter of 0.2 mm, 0.25 mm and 0.3 mm, respectively, have been prepared. The SETs containing the MPs were fabricated with the spacing (S) of 2,000 µm, 3,200 µm and 4,000 µm along the print head x-axis. The MPs were measured by taking three consecutive measurements (top, bottom and middle) for the width and one for the height.

The prominent highlight of this study is the successful FFF/FDM 3D printing of thin features (<1mm) without any deformation. The mathematical analysis of the variance of the optical microscopy measurements concluded that printed dimensions for micropillar widths did not vary significantly, retaining more than 65% of the recording within the first standard deviation (SD) (±1 s). The minimum value of SD is obtained from the samples of SET-B, that is, 31.96 µm and 35.865 µm, for height and width, respectively. The %RE for SET-B samples is 5.09% for S = 2,000µm, 3.86% for S = 3,200µm and 1.09% for S = 4,000µm. The error percentage is so small that it could be easily compensated by redesigning.

The study does not cover other 3D printing techniques of additive manufacturing like stereolithography, digital light processing and material jetting.

The presented study can be potentially implemented for the rapid prototyping of microfluidics mixer, bioseparator and lab-on-chip devices, both for membrane-free bioseparation based on microfiltration, plasma extraction from whole blood, size-selection trapping of unwanted blood cells, and also for membrane-based plasma extraction that requires supporting microstructures. Our developed process may prove to be far more economical than the other existing techniques for such applications.

For the first time, this work presents a comprehensive analysis of the fabrication of micropillars using FDM/FFF 3D printing and PMMA in filament form. The primary focus of the study is to minimize the dimensional inaccuracies in the 3D printed devices containing thin features, especially in the area of biomedical engineering, by delivering benefits from the choice of the parameters. Thus, on the basis of errors and deviations, a thorough comparison of the three SETs of the fabricated micropillars has been done.

The coronavirus disease 2019 (COVID-19) pandemic has had a big impact on organisations globally, leaving organisations with no choice but to adapt to the new reality of remote work to ensure business continuity. Such an unexpected reality created the conditions for testing new applications of smart home technology whilst working from home. Given the potential implications of such applications to improve the working environment, and a lack of research on that front, this paper pursued two objectives. First, the paper explored the impact of smart home applications by examining the factors that could contribute to perceived productivity and well-being whilst working from home. Second, the study investigated the role of productivity and well-being in motivating the intention of remote workers to use smart home technologies in a home-work environment in the future.

The study adopted a cross-sectional research design. For data collection, 528 smart home users working from home during the pandemic were recruited. Collected data were analysed using a structural equation modelling approach.

The results of the research confirmed that perceived productivity is dependent on service relevance, perceived usefulness, innovativeness, hedonic beliefs and control over environmental conditions. Perceived well-being correlates with task-technology fit, service relevance, perceived usefulness, perceived ease of use, attitude to smart homes, innovativeness, hedonic beliefs and control over environmental conditions. Intention to work from a smart home-office in the future is dependent on perceived well-being.

The findings of the research contribute to the organisational and smart home literature, by providing missing evidence about the implications of the application of smart home technologies for employees' perceived productivity and well-being. The paper considers the conditions that facilitate better outcomes during remote work and could potentially be used to improve the work environment in offices after the pandemic. Also, the findings inform smart home developers about the features of technology which could improve the developers' application in contexts beyond home settings.

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Low value in total thermal resistance (R_th-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(R_th-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The T_J value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔT_J) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the T_J values.

The purpose of this paper is to find a closed relation for the phase noise of LC oscillators.

The governing equation of oscillators is generally a stochastic nonlinear differential equation. In this paper, a closed relation for the phase noise of LC oscillators was obtained by approximating the I–V characteristic of the oscillator with third-degree polynomials and analyzing its differential equation.

This relation expresses phase noise directly in terms of circuit parameters, including the sizes of the transistors and the bias. Next, for evaluation, the phase noise of the cross-coupled oscillator without tail current was calculated with the proposed model. In this approach, the obtained equations are expressed independently of technology by combining the obtained phase noise relation and g_m/I_D method.

A technology-independent method using the g_m/I_D method and the closed relationship is provided to calculate phase noise.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

The purpose of this study is to numerically and experimentally investigate the natural convection heat transfer in flat plates and plates with square, trapezoidal and triangular corrugations.

This work is an extension of the previous studies by Verderio et al. (2021a, 2021b, 2021c, 2021d, 2022a). An experimental apparatus was built to measure the plates’ temperatures during the natural convection cooling process. Several physical parameters were evaluated through the experimental methodology. Free and open-source computational tools were used to simulate the experimental conditions and to quantitatively and qualitatively evaluate the thermal plume characteristics over the plates.

The numerical results were experimentally validated with reasonable accuracy in the range of studied RaLP for the different plates. Empirical correlations of Nu¯LPexp=f(RaLP), h¯conv=f(RaLP) and Nu¯LPexp⋅(A/AP)=f(RaLP), with good accuracy and statistical representativeness, were obtained for the studied geometries. The convective thermal efficiency of corrugated plates (Δη), as a function of RaLP, was also experimentally studied quantitatively. In agreement with the findings of Oosthuizen and Garrett (2001), the experimental and numerical results proved that the increase in the heat exchange area of the corrugations has a greater influence on the convective exchange and the thermal efficiency than the disturbances caused in the flow (which reduce h¯conv). The plate with trapezoidal corrugations presented the highest convective thermal efficiency, followed by the plates with square and triangular corrugations. It was also proved that the thermal efficiency of corrugated plates increases with RaLP.

The results demonstrate that corrugated surfaces have greater thermal efficiency than flat plates in heating and/or cooling systems by natural convection. This way, corrugated plates can reduce the dependence on auxiliary forced convection systems, with application in technological areas and Industry 4.0.

The empirical correlations obtained for the corrected Nusselt number and thermal efficiency for the corrugated plate geometries studied are original and unpublished, as well as the experimental validation of the developed three-dimensional numerical code.

This study aims to examine the moment-to-moment (MTM) effects of in-consumption dynamic comments on consumers' responses to digital engagement and the underlying mechanisms involved, as well as the interactive role of advertisements embedded in short-form online video.

This study uses data extracted from 2,081 videos posted on the prominent Chinese online live platform, Bilibili. The hypotheses are tested using regression models and natural language processing.

The results indicate that the intensity of live comments at the beginning negatively affects users' digital engagement, while a corresponding increase in live comments at the end elicits a positive effect. A linear trend and peak difference in live comments intensity positively affect digital engagement, while the variability of live comment intensity exerts a negative effect. These MTM effects were driven by sentiments of live comments. Furthermore, in-video advertisements are likely to amplify the negative beginning effect on users' digital engagement and mitigate the negative variability of live comments.

This study is the first to examine the direct effects of MTM comments from the online temporal sequence perspective, differentiating the process- and performance-based engagement. The mechanism and interactive role of in-video advertisements were identified. These findings contribute to literature on interactive marketing and provide valuable guidance for influencer marketing.