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Article
Publication date: 31 July 2007

Z.W. Zhong, T.Y. Tee and J‐E. Luan

This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.

Abstract

Purpose

This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.

Design/methodology/approach

Of the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.

Findings

Research on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.

Research limitations/implications

Because of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.

Originality/value

This review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

Details

Microelectronics International, vol. 24 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 December 2003

Abstract

Details

Aircraft Engineering and Aerospace Technology, vol. 75 no. 6
Type: Research Article
ISSN: 0002-2667

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Article
Publication date: 1 January 1990

A.J.C. Brown and F. Gilbert

Optical profilometry has many industrial uses, from machine tool measurements to microelectronics, as experts explain.

Abstract

Optical profilometry has many industrial uses, from machine tool measurements to microelectronics, as experts explain.

Details

Sensor Review, vol. 10 no. 1
Type: Research Article
ISSN: 0260-2288

Content available
Article
Publication date: 1 April 2000

Professor Nihal Sinnadurai

Abstract

Details

Microelectronics International, vol. 17 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 December 2004

Abstract

Details

Aircraft Engineering and Aerospace Technology, vol. 76 no. 6
Type: Research Article
ISSN: 0002-2667

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Article
Publication date: 3 April 2018

Muna E. Raypah, Mutharasu Devarajan and Fauziah Sulaiman

Proper thermal management is a key to improve the efficiency and reliability of light-emitting diodes (LEDs). This paper aims to report the influence of applying thermally…

Abstract

Purpose

Proper thermal management is a key to improve the efficiency and reliability of light-emitting diodes (LEDs). This paper aims to report the influence of applying thermally conductive materials on thermal performance of indium gallium aluminum phosphide (InGaAlP)-based thin-film surface-mounted device (SMD) LED.

Design/methodology/approach

The LED thermal and optical parameters were determined using the combination of thermal transient tester (T3Ster) and thermal and radiometric characterization of power LEDs (TeraLED) instruments. The LED was mounted on FR4, 2W and 5W aluminum (Al) package substrates. Measurements were carried out by setting different boundary conditions: air between LED package and substrate and using thermally conductive epoxy (TIM A) and adhesive (TIM B) of thermal conductivity 1.67 and 1.78 W/mK, respectively.

Findings

For LED mounted on FR4 package, the total real thermal resistance is improved because of TIM B by 6 and 9 per cent at 50 and 100 mA, respectively. Likewise, the relative decrease in total thermal resistance of LED on 2W Al package is about 9 and 11 per cent. As well, for LED mounted on 5W Al package, the total real thermal resistance is reduced by 2 and 4 per cent.

Originality/value

No much work can be found in the literature on thermal interface material effects on thermal performance of low-power SMD LED. This work can assist in thermal management of low-power LEDs.

Details

Microelectronics International, vol. 35 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 2 January 2018

Muna E. Raypah, Dheepan M.K., Mutharasu Devarajan, Shanmugan Subramani and Fauziah Sulaiman

Thermal behavior of light-emitting diode (LED) device under different operating conditions must be known to enhance its reliability and efficiency in various applications…

Abstract

Purpose

Thermal behavior of light-emitting diode (LED) device under different operating conditions must be known to enhance its reliability and efficiency in various applications. The purpose of this study is to report the influence of input current and ambient temperature on thermal resistance of InGaAlP low-power surface-mount device (SMD) LED.

Design/methodology/approach

Thermal parameters of the LED were measured using thermal transient measurement via Thermal Transient Tester (T3Ster). The experimental results were validated using computational fluid dynamics (CFD) software.

Findings

As input current increases from 50 to 90 mA at 25°C, the relative increase in LED package (ΔRthJS) and total thermal resistance (ΔRthJA) is about 10 and 4 per cent, respectively. In addition, at 50 mA and ambient temperature from 25 to 65°C, the ΔRthJS and ΔRthJA are roughly 28 and 22 per cent, respectively. A good agreement between simulation and experiment results of junction temperature.

Originality/value

Most of previous studies have focused on thermal management of high-power LEDs. There were no studies on thermal analysis of low-power SMD LED so far. This work will help in predicting the thermal performance of low-power LEDs in solid-state lighting applications.

Details

Microelectronics International, vol. 35 no. 1
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 1 August 1997

V. Székely, M. Rencz and B. Courtois

Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and theincreasing density brought in by advanced packaging techniques…

Abstract

Thermal issues are becoming increasingly serious with the scaling down of integrated circuits and the increasing density brought in by advanced packaging techniques. Consequently, thermal issues need to be considered during both design and test. The present paper addresses thermal testing, and more specifically thermal transient testing.

Details

Microelectronics International, vol. 14 no. 2
Type: Research Article
ISSN: 1356-5362

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Article
Publication date: 25 September 2019

Muna Raypah, Mutharasu Devarajan and Shahrom Mahmud

The presence of voids in the solder layer has been considered as one of the main issues causing reliability problems in optoelectronic devices. Voids can be created due to…

Abstract

Purpose

The presence of voids in the solder layer has been considered as one of the main issues causing reliability problems in optoelectronic devices. Voids can be created due to trapped gas, clean-up agent residues (fluxes), poor wettability at interface or shortcoming of the reflow process. The voids hinder the heat conduction path and subsequently, the thermal resistance will increase. The purpose of this paper is to investigate the influence of lead-free water-washable Sn96.5Ag3.0Cu0.5 (SAC305) solder paste (SP) voids on the thermal and optical performance of white high-power (HP) surface-mounted device (SMD) light-emitting diode (LED).

Design/methodology/approach

Five LEDs are mounted on five SinkPAD substrates by using the SP. The SMT stencil printing is used to control the thickness of the SP and reflow oven for the soldering process. The fraction of voids in the SP layer is calculated using the X-ray machine software. The thermal parameters of the LEDs with different voids fraction and configuration are measured using a thermal transient tester (T3Ster) system. In addition, the optical characterizations of the LEDs are determined by the thermal and radiometric characterization of power LEDs (TeraLED) and the electroluminescence by using the spectrometer.

Findings

The results showed that the thermal performance and temperature distribution are improved for the LED with lower voids fraction and good filling state of soldering. In addition, luminous flux, efficacy and color shift of the LEDs with different fraction and configurations of voids on the SP layer are compared and discussed. It is found that the color shift of LED1 of low voids fraction and higher thickness are less than other LEDs.

Originality/value

The paper provides valuable information about the effect of water-washable SAC305 SP voids fraction and filling state of solder on the thermal and optical performance of ThinGaN HP SMD LED. A comprehensive overview of the outcomes is not available in the literature. It was shown experimentally that the voids fraction, height and configuration of the SP layer could strongly influence the heat dissipation efficiency and thermal resistance. This study can help in heat diffusion investigation and failure analysis of HP SMD LEDs.

Details

Soldering & Surface Mount Technology, vol. 32 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 25 September 2007

Z.W. Zhong, P. Arulvanan, Hla Phone Maw and C.W.A. Lu

The purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag…

Abstract

Purpose

The purpose of this paper is to present the results of experiments performed to attach silicon dies (chips) to low‐temperature co‐fired ceramic (LTCC) substrates with Ag or AgPd pads using SnAgCu or SnPb solder and the results of the characterization of the solder joints.

Design/methodology/approach

LTCC substrates were fabricated by stacking and laminating four green tapes with the top layer screen‐printed with Ag or AgPd paste to form pads. Silicon die sizes of 1 × 1 mm and 2 × 2 mm with electroless nickel immersion gold plated were soldered to 2 × 2 mm pads on the LTCC substrates using SnPb or SnAgCu solder. The solder joints were then characterized using X‐ray, die shear, energy dispersive X‐ray and scanning electron microscopy techniques.

Findings

The joints made by AgPd pads with SnAgCu solder provided the best results with the highest shear strength having strong interfaces in the joints. However, the joints of Ag pads with SnPb solder did not provide high‐shear strength.

Originality/value

The findings provide certain guidelines to implement LTCC applications. AgPd pads with SnAgCu solder can be considered for applications where small silicon dies need to be attached to LTCC substrates. However, Ag pads with SnAgCu solder can be considered for lead‐free solder applications.

Details

Soldering & Surface Mount Technology, vol. 19 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

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