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A bio-sensor has been developed in this study for the purpose of point-of-care diagnostics. Point-of-care-diagnostic is a type of diagnosis where the diagnostic centre, i.e. the diagnosis kit is made available at the location of the patient when the patient needs immediate action. In this process of diagnosis a compact, portable, integrated kit must be available which can diagnose the disease of the patient by testing various analytes.

Using a fully experimental methodology, a blood glucose sensor is made by conducting carbon interdigitated electrode (IDE) on a flexible substrate. IDEs are used to increase the effective capacitance of the structure, as well as the effective electroactive area of the sensor. Interdigitated structure permits two-electrode sticks with “each other” and “infuse” together. As a consequence, the distance between electrodes can be tuned to a much smaller value than traditional thin-film architectures. Narrowing the distance between electrodes allows for fast ion diffusion that offers better rate capability and efficiency in power density. The fabricated device exhibits a remarkable value of sensitivity in the order of 2.741 µA mM-1 cm⁻².

A highly sensitive, portable and inexpensive blood glucose sensor has been developed in this context.

This research study can be a scope for future research in the field of bio-sensors.

The purpose of this paper is to review recent developments in the sensing of electromagnetic radiation (EMR) with wavelengths longer than those of visible light.

Following a short introduction, this paper discusses recent research into the sensing of infra‐red (IR), terahertz (THz) and microwave radiation.

It is shown that novel sensors are being developed for all of these classes of EMR. Improved IR sensors are attracting strong interest from the military, novel THz sensor developments reflect the growing uses of this radiation and research into cosmology and astronomy are driving the development of highly sensitive microwave sensors.

The paper provides a technical review of recent research into sensing IR, THz and microwave radiations.

A new fabrication process for rapid prototyping is proposed in this paper. Optical and thermal effects are simultaneously used in this process to locally induce a phase change in a liquid resin. This phase change phenomena is used to “write” three‐dimensional shapes or patterns. Such objects or patterns can involve macroscopic engineering prototypes through to nanostructures for exploitation in waveguiding and photonic crystals. Several advantages can be achieved through this new process, in terms of accuracy, cost and time.

The purpose of this paper is to demonstrate a successful fabrication of 2 × 128 linear array of typical infrared (IR) detectors made of p-type tSi/porous Si Schottky barrier.

Using metal-assisted chemical etching (MaCE) as a unique approach, a sample definition of a porous Si nanostructure region for fabricating of any high-density photodetectors array has been formulated. Besides, the uniformity of pixels at different position along the array has been confirmed by optical images and measurements of photocurrent in IR regime at room temperature.

The experimental result illustrates the existence of an open-circuit voltage up to 30 mV at 1.5-μm wavelength for an area of 50 × 50 μm2. Additionally, this behavior is almost the same at different pixels of fabricated array.

The uniformity of pixels and definition of nanostructure region are two most important challenges in fabrication of any high-density photodetectors array.

MaCE guarantees formation of reproducible, high-fidelity and controllable nanometer-size porous Si with well-defined and sharp edges of the patterned areas.

The proposed method offers a low-cost and simple process to fabricate high-density arrays of Schottky detectors which are compatible with the complementary metal-oxide semiconductor process.

Smart sensors based on graphene field effect transistor (GFET) and biological receptors are regarded as a promising nanomaterial that could be the basis for future generation of low-power, faster, selective real-time monitoring of target analytes and smaller electronics. So, the purpose of this paper is to provide details of sensors based on selective nanocoatings by combining trinitrotoluene (TNT) receptors (Trp-His-Trp) bound to conjugated polydiacetylene polymers on a graphene channel in GFET for detecting explosives TNT.

Following an introduction, this paper describes the way of manufacturing of the GFET sensor by using investigation methods for transferring graphene sheet from Cu foil to target substrates, which is functionalized by the TNT peptide receptors, to offer a system which has the capability of answering the presence of related target molecules (TNT). Finally, brief conclusions are drawn.

In a word, shortly after graphene discovery, it has been explored with a variety of methods gradually. Because of its exceptional electrical properties (e.g. extremely high carrier mobility and capacity), electrochemical properties such as high electron transfer rate and structural properties, graphene has already showed great potential and success in chemical and biological sensing fields. Therefore, the authors used a biological receptor with a field effect transistor (FET) based on graphene to fabricate sensor for achieving high sensitivity and selectivity that can detect explosive substances such as TNT. The transport property changed compared to that of the FET made by intrinsic graphene, that is, the Dirac point position moved from positive Vg to negative Vg, indicating the transition of graphene from p-type to n-type after annealing in TNT, and the results show the bipolar property change of GFET with the TNT concentration and the possibility to develop a robust, easy-to-use and low-cost TNT detection method for performing a sensitive, reliable and semi-quantitative detection in a wide detection range.

In this timeframe of history, TNT is a common explosive used in both military and industrial settings. Its convenient handling properties and explosive strength make it a common choice in military operations and bioterrorism. TNT and other conventional explosives are the mainstays of terrorist bombs and the anti-personnel mines that kill or injure more than 15,000 people annually in war-torn countries. In large, open-air environments, such as airports, train stations and minefields, concentrations of these explosives can be vanishingly small – a few parts of TNT, for instance, per trillion parts of air. That can make it impossible for conventional bomb and mine detectors to detect the explosives and save lives. So, in this paper, the authors report a potential solution with design and manufacture of a GFET sensor based on a biological receptor for real-time detection of TNT explosives specifically.

This paper aims to encompass the technological advancements in the area of flexible sensing electronics fabrication particularly for wearable device development applications. In the recent past, it is evident that there is a tremendous growth in the field of flexible electronics and sensors fabrication technologies all around the world. Even though, there is a significant amount of research has been carried in the past decade, but still there is a huge need for exploring novel materials for low temperature processing, optimized printing methods and customized printing devices with accurate feature control.

The author has done an extensive literature survey in the proposed area and found that the researchers are showing significant interest in exploring novel materials, new conductive ink processing methods suitable for additive manufacturing, and fabrication technologies for developing the plastic substrate-based flexible electronics for the on growing demands of wearable devices in the market.

The author has consolidated some of the recent advancements in the area of flexible sensing electronics using the inkjet-printing platform carried out by the researchers. The novel customized inkjet-printing technology, materials selections for device development, compatibility of the materials for the inkjet-printing process and the interesting results of the devices fabricated are highlighted in this paper.

The author has reported the novel inkjet-printing platforms explored by researchers in the recent past for various applications which primarily includes gas sensing. The author has consolidated in a crisp manner about the technology, materials compatible for inkjet-printing, and the exciting results of the printed devices. The author has reported the advantages and challenges of the proposed methods by the researchers. This work will bridge the technical gap in the inkjet-printing technology and will be useful for the researchers to take forward the research work on this domain to the next level.

A recent meeting involved co‐operation with the organisers of the Canadian High Technology Show and the local Chapter of the SMTA. The programme included an inspiring keynote address by Mr Frank J. Pipp, Xerox Corporation. The topic of the address was ‘Malcolm Baldridge National Quality Control and the Evaluation of Total Quality Control in Xerox Corporation.’

The purpose of this paper is to provide a technical review of silicon micro‐electromechanical systems (MEMS) technology and its applications.

Following an introduction, the paper describes silicon MEMS fabrication and assembly techniques, considers a selection of commercially important products and their applications and concludes with a brief review of power MEMS research.

Silicon MEMS fabrication technology is derived from techniques used in semiconductor manufacture and has yielded a diverse and ever‐growing range of sensors, actuators and other miniaturised devices that find applications in a multitude of industries.

This paper provides a detailed technical review of MEMS technology and its applications.

ISHM‐Benelux held its 1987 Autumn Conference on 29 October, at the Antwerp Crest Hotel. This one‐day meeting focused on applications of hybrid circuit technology in various fields of electronic and related industries.

Some marking systems are very simple, such as barcoded labels, others are more sophisticated incorporating a degree of programmability. However, in recent years the need for much more than simple identification and marking has emerged and more interest is being paid to devices which are capable of holding ever‐larger amounts of data securely. Though security tagging alone constitutes a large proportion of any potential market in its own right, security, in terms of both accidental erasure and confidentiality, is always important. This paper examines various methods for secure tagging of manufactured parts including RF tags, thermochromic changes and UV absorption.