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Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.

Silicon piezoresistive pressure sensor dies are mounted on a ceramic substrate where the signal conditioning electronics are implemented in thick film technology. In this paper some of these techniques, e.g. special attachment and bonding requirements, methods for temperature compensation, the principles of parameter adjustment, and encapsulation, are presented. For illustration two examples are described. The first is a multipoint monitoring system with 720 measuring points in a test mattress. The second example is a family of industrial pressure transducers.

Diffusion patterning is a dielectric patterning technology, which is used in the screen printed thick film technology for higher density multilayer circuits. This technology is suitable for producing lower cost multichip modules and requires a low additional investment in conventional thick film technology production lines. Comparisons of via resolution capability of diffusion patterning versus conventional thick film technology are described and discussed. Preliminary experimental results obtained with a test circuit showed that 200μm lines and 200μm vias could be achieved with acceptable yield and with minimal modification to standard production lines. The electronic circuit for the pressure sensor was designed and realised with the verified technology as a low‐cost ceramic multichip module. A few results of an investigation of some thick film materials, which comprise the “set” of pastes for diffusion patterning technology, are presented.

The opportunity for mutual benefit across Europe to develop low‐cost MCM technologies arose from recognition of the scientific skills and design and prototyping capabilities in organic and inorganic circuits in countries of Central Europe. As a result, the leading research institutions and small/medium‐size enterprises of Hungary, Romania and Slovenia together with relevant institutions of the UK and Belgium proposed and received approval for a European Union INCO‐Copernicus project “Cheap multichip models” to establish fast prototyping low cost multichip module (MCM) technology facilities. The project commenced in May 1997.