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Article
Publication date: 8 April 2020

Tomofumi Miyanoshita, Tohru Yoshioka-Kobayashi and Daisuke Kanama

Researchers have pointed out that product packaging in the food industry has a significant influence on consumer decision-making. However, the impact of package…

Abstract

Purpose

Researchers have pointed out that product packaging in the food industry has a significant influence on consumer decision-making. However, the impact of package development on firm performance has not been investigated due to the limited availability of analyses on package design. The purpose of this study is to investigate the relationship between package development and firm performance in the Japanese food manufacturing industry.

Design/methodology/approach

This study empirically analyzed the relationship between package development and firm performance in the Japanese food manufacturing industry by using design patents data.

Findings

As a result of multiple regression analysis, it became clear that the number of design patents related to packaging is significantly linked to the operating profit ratio, growth rate of sales and increase in operating profits of firms. Moreover, the results show inverse U-shaped effects between design patents and firm performance.

Research limitations/implications

The results imply the importance of effective package design management.

Originality/value

This study provides novel insight on both marketing strategy and intellectual property management in the food industry, and it also provides a new method for empirical analysis using design patent data.

Details

British Food Journal, vol. 122 no. 7
Type: Research Article
ISSN: 0007-070X

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Article
Publication date: 28 October 1988

James A. Lee

America’s patent rate (per 100,000 population) rose steeply to 34 from 1820‐1885, hovered between 28‐36 for the next 40 years then started its plunge to the present 18…

Abstract

America’s patent rate (per 100,000 population) rose steeply to 34 from 1820‐1885, hovered between 28‐36 for the next 40 years then started its plunge to the present 18. This article examines the numerous possible causes often found in the literature ‐ expenditures on R&D, poor patent protection, high fees and pendency delays, decline in education in sciences and engineering, etc. While there is some evidence to support each of these, none is as important as the decline in our immigrants from Europe. Projections of possible improvements in our creativity and innovation in sciences and technology are bound in the characteristics of our present and future immigrant streams, and these are not expected to replace the role played by our previous immigrant streams.

Details

American Journal of Business, vol. 3 no. 2
Type: Research Article
ISSN: 1935-5181

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Content available
Article
Publication date: 1 September 2004

Jon Rigelsford

Abstract

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Assembly Automation, vol. 24 no. 3
Type: Research Article
ISSN: 0144-5154

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Article
Publication date: 1 September 1932

THE Societa Italiana Ernesto Breda, of Milan, have recently completed trial flights with the Type 32 three‐engined, all‐metal, low‐wing monoplane. This is the first large…

Abstract

THE Societa Italiana Ernesto Breda, of Milan, have recently completed trial flights with the Type 32 three‐engined, all‐metal, low‐wing monoplane. This is the first large commercial aeroplane to be built by this well‐known Italian firm, who have hitherto specialised in the design and construction of military aircraft and, more recently, have produced two light types of aeroplane.

Details

Aircraft Engineering and Aerospace Technology, vol. 4 no. 9
Type: Research Article
ISSN: 0002-2667

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Article
Publication date: 16 June 2010

M. Grujicic, V. Sellappan, G. Arakere, J.M. Ochterbeck, Norbert Seyr, Andreas Obieglo, Marc Erdmann and Jochen Holzleitner

The purpose of this paper is to propose and analyse computationally a new concept for mechanical interlocking between metal and plastics. The approach utilizes some of the…

Abstract

Purpose

The purpose of this paper is to propose and analyse computationally a new concept for mechanical interlocking between metal and plastics. The approach utilizes some of the ideas used in the spot‐clinching joining process and is appropriately named “clinch‐lock polymer metal hybrid (PMH) technology.”

Design/methodology/approach

A new approach, the so‐called “direct‐adhesion” PMH technology, is recently proposed Grujicic et al. to help meet the needs of automotive original equipment manufacturers and their suppliers for a cost‐effective, robust, reliable PMH technology which can be used for the manufacturing of load‐bearing body‐in‐white (BIW) components and which is compatible with the current BIW manufacturing‐process chain. Within this approach, the necessary level of polymer‐to‐metal mechanical interconnectivity is attained through direct adhesion and mechanical interlocking.

Findings

In an attempt to fully assess the potential of the clinch‐lock approach for providing the required level of metal/polymer mechanical interlocking, a set of finite‐element based sheet‐metal forming, injection molding and structural mechanics analyses is carried out. The results obtained show that stiffness and buckling resistance levels can be attained which are comparable with those observed in the competing injection over‐molding PMH process but with an ∼3 percent lower weight (of the polymer subcomponent) and without the need for holes and for over‐molding of the free edges of the metal stamping.

Originality/value

The paper presents a useful discussion of clinch‐lock joining technology's potential for fabrication of PMH load‐bearing BIW components.

Details

Multidiscipline Modeling in Materials and Structures, vol. 6 no. 1
Type: Research Article
ISSN: 1573-6105

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Article
Publication date: 18 September 2007

Abstract

Details

Sensor Review, vol. 27 no. 4
Type: Research Article
ISSN: 0260-2288

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Article
Publication date: 1 June 2000

George K. Chako

Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or…

Abstract

Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in their efforts to develop and market new products. Looks at the issues from different strategic levels such as corporate, international, military and economic. Presents 31 case studies, including the success of Japan in microchips to the failure of Xerox to sell its invention of the Alto personal computer 3 years before Apple: from the success in DNA and Superconductor research to the success of Sunbeam in inventing and marketing food processors: and from the daring invention and production of atomic energy for survival to the successes of sewing machine inventor Howe in co‐operating on patents to compete in markets. Includes 306 questions and answers in order to qualify concepts introduced.

Details

Asia Pacific Journal of Marketing and Logistics, vol. 12 no. 2/3
Type: Research Article
ISSN: 1355-5855

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Article
Publication date: 22 March 2011

Yung‐Ta Li, Mu‐Hsuan Huang and Dar‐Zen Chen

Foundry, Design House, and integrated device manufacturers (IDM) are major characters in the semiconductor industry value chain. The purpose of this paper is to discuss…

Abstract

Purpose

Foundry, Design House, and integrated device manufacturers (IDM) are major characters in the semiconductor industry value chain. The purpose of this paper is to discuss patterns of characters' evolution in technology through patents classified as wafer‐design application patents and wafer‐process patents.

Design/methodology/approach

Various patent indicators, such as average patent citation count, and the combination of the average patent citation count and relative patent count share were used to measure the patent activity, patent quality, and the combination of the patent quality and relative patent activity share, respectively. The study period (1979‐2009) was divided into three major technology or wafer size eras, 1979‐1991 for the 6‐ and pre 6‐inch wafer era, 1989‐1999 for the 8‐inch wafer era, and 1997‐2009 for the 12‐inch wafer era.

Findings

Foundry has gradually become the technology transferor rather than purely the manufacturing capacity provider. Foundry's impact on the technology level has risen steeply on both the wafer‐process technology fields and the wafer‐design application technology fields. As a result, IDM, traditionally considered the primary technology contributor in the semiconductor value chain for the past 30 years, will continue to be challenged in the semiconductor industry.

Practical implications

Some hypotheses are clarified to provide managerial implications for the semiconductor industry. Owing to Foundry's rise in technology activity and quality, IDM/Design House should not merely view it as one of their capacity providers but should also pursue a technology alliance with it.

Originality/value

The paper clarifies the traditional hypotheses of the characters of technology in the semiconductor value chain.

Details

Industrial Management & Data Systems, vol. 111 no. 3
Type: Research Article
ISSN: 0263-5577

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Book part
Publication date: 22 September 2009

Bronwyn H. Hall and Rosemarie H. Ziedonis

We examine the patenting behavior of firms in an industry characterized by rapid technological change and cumulative innovation. Recent survey evidence suggests that…

Abstract

We examine the patenting behavior of firms in an industry characterized by rapid technological change and cumulative innovation. Recent survey evidence suggests that semiconductor firms do not rely heavily on patents to appropriate returns to R&D. Yet the propensity of semiconductor firms to patent has risen dramatically since the mid-1980s. We explore this apparent paradox by conducting interviews with industry representatives and analyzing the patenting behavior of 95 U.S. semiconductor firms during 1979–1995. The results suggest that the 1980s strengthening of U.S. patent rights spawned “patent portfolio races” among capital-intensive firms, but it also facilitated entry by specialized design firms.

Details

Economic Institutions of Strategy
Type: Book
ISBN: 978-1-84855-487-0

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Article
Publication date: 10 July 2018

Rosa Maria Ballardini, Iñigo Flores Ituarte and Eujin Pei

The purpose of this paper is to investigate the technology, business and intellectual property issues surrounding the production of spare parts through additive…

Abstract

Purpose

The purpose of this paper is to investigate the technology, business and intellectual property issues surrounding the production of spare parts through additive manufacturing (AM) from a digital source. It aims to identify challenges to the growth of the AM spares market and propose suitable solutions.

Design/methodology/approach

The paper begins with a systematic literature review and theoretical analysis. This is followed by case study research through semi-structured interviews, forming the basis of a triangulated, cross-case analysis of empirical data.

Findings

The paper identifies several obstacles to the development of the AM-produced digital spares market. The manufacturing industry will soon be forced to re-think AM as a real manufacturing alternative. Short-term, AM technology has implications for the production of components for legacy systems for which tooling facilities no longer exist. Long-term, AM will be used to produce a wide range of components especially when product and/or service functionality can be increased. To enable companies to navigate current uncertainties in the patent framework (especially the “repair vs make” doctrine), new intellectual property rights strategies could be developed around patenting both complex devices and their individual components, and seeking patent protection for CAD files. Further harmonization of the EU legal framework, the interpretation of claims and the scope of protection offered in the context of spare parts, will also be important.

Originality/value

This study pinpoints key issues that need to be addressed within the European AM business environment and the patent system and proposes recommendations for business and legal frameworks to promote the growth of a stable European digital spare parts market.

Details

Journal of Manufacturing Technology Management, vol. 29 no. 6
Type: Research Article
ISSN: 1741-038X

Keywords

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