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Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in their efforts to develop and market new products. Looks at the issues from different strategic levels such as corporate, international, military and economic. Presents 31 case studies, including the success of Japan in microchips to the failure of Xerox to sell its invention of the Alto personal computer 3 years before Apple: from the success in DNA and Superconductor research to the success of Sunbeam in inventing and marketing food processors: and from the daring invention and production of atomic energy for survival to the successes of sewing machine inventor Howe in co‐operating on patents to compete in markets. Includes 306 questions and answers in order to qualify concepts introduced.

The ideas expressed in this work are based on those put into practice at the Okuma Corporation of Japan, one of the world′s leading machine tool manufacturers. In common with many other large organizations, Okuma Corporation has to meet the new challenges posed by globalization, keener domestic and international competition, shorter business cycles and an increasingly volatile environment. Intelligent corporate strategy (ICS), as practised at Okuma, is a unified theory of strategic corporate management based on five levels of win‐win relationships for profit/market share, namely: ,1. Loyalty from customers (value for money) – right focus., 2. Commitment from workers (meeting hierarchy of needs) – right attitude., 3. Co‐operation from suppliers (expanding and reliable business) – right connections., 4. Co‐operation from distributors (expanding and reliable business) – right channels., 5. Respect from competitors (setting standards for business excellence) – right strategies. The aim is to create values for all stakeholders. This holistic people‐oriented approach recognizes that, although the world is increasingly driven by high technology, it continues to be influenced and managed by people (customers, workers, suppliers, distributors, competitors). The philosophical core of ICS is action learning and teamwork based on principle‐centred relationships of sincerity, trust and integrity. In the real world, these are the roots of success in relationships and in the bottom‐line results of business. ICS is, in essence, relationship management for synergy. It is based on the premiss that domestic and international commerce is a positive sum game: in the long run everyone wins. Finally, ICS is a paradigm for manufacturing companies coping with change and uncertainty in their search for profit/market share. Time‐honoured values give definition to corporate character; circumstances change, values remain. Poor business operations generally result from human frailty. ICS is predicated on the belief that the quality of human relationships determines the bottom‐line results. ICS attempts to make manifest and explicit the intangible psychological factors for value‐added partnerships. ICS is a dynamic, living, and heuristic‐learning model. There is intelligence in the corporate strategy because it applies commonsense, wisdom, creative systems thinking and synergy to ensure longevity in its corporate life for sustainable competitive advantage.

This study investigates the competencies required for quality management professionals to meet the needs of industry 4.0. The authors use a case study strategy at an electronics manufacturer in southern Malaysia, to adapt their role to be relevant in the industry 4.0 environment. In doing so, this study answers the following four questions: (1) How are the changing technological trends expected to impact the future role of quality in industry 4.0? (2) What are the competencies gap between current and future roles of quality professionals? (3) What are the views and practices related to quality roles? (4) How can the gaps identified be closed to meet the quality challenges of industry 4.0?

The research methods consist of a comprehensive review of literature on the technological trends towards industry 4.0 and the impact on the role of quality and competence that may be required in the future, as well as internal document review on the current roles of quality professionals in an electronics manufacturer in southern Malaysia, to identify the competence gap. Empirical data was collected based on surveys conducted on 64 quality professionals with a response rate of 96.88%. Interviews were conducted on three decision-makers from critical areas in the electronics manufacturer for viewpoints from three different perspectives: finance, operations and talent development.

Quality professionals will require technical competencies to interpret large amounts of data from processes to make strategic decisions, the use of new AR tools and be aware of data security risks. Methodological competencies will be required to use data to identify the source of problems, to access reliable sources of learning and the ability to use new tools for solving complex problems efficiently. Social competencies will be required in communications across multi-sites, suppliers and customers in new collaborative virtual platforms, with the ability to retain tacit and explicit knowledge, in a decentralized environment that will require leadership ability to make decisions. Personal competencies required will be the ability to work in a flexible workplace and time and more frequent work-related changes.

The limitation of the study is based on what the authors currently know of the future, which may not be much for the quality professionals in the electronics manufacturer, who have not been exposed much to the technology yet. The potential for the future landscape to change dramatically with rapid technology changes may also result in a different set of skills for future quality professionals. The quality professionals who were involved in this study were the quality executives, engineers and managers, irrespective of their gender, age, length of service and experience in the field of quality. Therefore, these variables were not taken into consideration for this research.

This research helped to identify the role of quality in industry 4.0 and key competencies that the quality professionals in the electronics manufacturer will require to adapt to their role in industry 4.0. However, based on the questionnaire and the interview comments of key personnel, it can be concluded that quality professionals lack awareness of their new roles in industry 4.0. This could be due to the fact that the new technology is not implemented by quality professionals but by the innovation team based in Singapore headquarters, as was also advised by the operations head.

The benefit of industry 4.0 technology is clearly shown by Philips's new Dutch factory with robotized technology that was able to produce the same output with one-tenth of the workers of its China factory (Rifkin, 2014, chapter 8). Rojko (2017, p. 80) also shared a similar view that industry 4.0 is expected to reduce production costs by 10–30%, logistics costs by 10–30% and quality management costs by 10–20%. The importance of this research can be seen from the findings of “The Future of Jobs” (2018, p. 22), which suggests that the window of opportunity for organizations to leverage the new technology to re-skill is within the period of 2018–2022, in order to enable employees to reach full potential in the high value-added tasks. The electronics manufacturer may need to keep to this timeline to maintain its competitive advantage.

The purpose of this paper was to determine the competence gap of current quality professionals in the electronics manufacturer with the competencies required in industry 4.0. This led to the third objective, to identify the views of stakeholders based on the propositions derived from the gaps identified, to triangulate the findings, to conclude the competency gaps of the current quality professionals in the electronics manufacturer. Finally, the objective of this paper was to make a recommendation on how to prepare the quality professionals in the electronics manufacturer for their role in industry 4.0. The research identified the technical, methodological, social and personal competencies gap of the quality professionals in the electronics manufacturer by looking at the changes expected in industry 4.0 from four aspects, factory (people and process), business, product and customers.

Examines the tenth published year of the ITCRR. Runs the whole gamut of textile innovation, research and testing, some of which investigates hitherto untouched aspects. Subjects discussed include cotton fabric processing, asbestos substitutes, textile adjuncts to cardiovascular surgery, wet textile processes, hand evaluation, nanotechnology, thermoplastic composites, robotic ironing, protective clothing (agricultural and industrial), ecological aspects of fibre properties – to name but a few! There would appear to be no limit to the future potential for textile applications.

Recent seminars in Munich, London and Rome, which were sponsored by the International Defense Electronics Association (IDEA), comprehensively cover the state of the art in Expert Systems and gave the cybernetician in particular, an insight into this fascinating area.

The purpose of this paper is to present a hybrid manufacturing system that integrates stereolithography (SL) and direct print (DP) technologies to fabricate three‐dimensional (3D) structures with embedded electronic circuits. A detailed process was developed that enables fabrication of monolithic 3D packages with electronics without removal from the hybrid SL/DP machine during the process. Successful devices are demonstrated consisting of simple 555 timer circuits designed and fabricated in 2D (single layer of routing) and 3D (multiple layers of routing and component placement).

A hybrid SL/DP system was designed and developed using a 3D Systems SL 250/50 machine and an nScrypt micro‐dispensing pump integrated within the SL machine through orthogonally‐aligned linear translation stages. A corresponding manufacturing process was also developed using this system to fabricate 2D and 3D monolithic structures with embedded electronic circuits. The process involved part design, process planning, integrated manufacturing (including multiple starts and stops of both SL and DP and multiple intermediate processes), and post‐processing. SL provided substrate/mechanical structure manufacturing while interconnections were achieved using DP of conductive inks. Simple functional demonstrations involving 2D and 3D circuit designs were accomplished.

The 3D micro‐dispensing DP system provided control over conductive trace deposition and combined with the manufacturing flexibility of the SL machine enabled the fabrication of monolithic 3D electronic structures. To fabricate a 3D electronic device within the hybrid SL/DP machine, a process was developed that required multiple starts and stops of the SL process, removal of uncured resin from the SL substrate, insertion of active and passive electronic components, and DP and laser curing of the conductive traces. Using this process, the hybrid SL/DP technology was capable of successfully fabricating, without removal from the machine during fabrication, functional 2D and 3D 555 timer circuits packaged within SL substrates.

Results indicated that fabrication of 3D embedded electronic systems is possible using the hybrid SL/DP machine. A complete manufacturing process was developed to fabricate complex, monolithic 3D structures with electronics in a single set‐up, advancing the capabilities of additive manufacturing (AM) technologies. Although the process does not require removal of the structure from the machine during fabrication, many of the current sub‐processes are manual. As a result, further research and development on automation and optimization of many of the sub‐processes are required to enhance the overall manufacturing process.

A new methodology is presented for manufacturing non‐traditional electronic systems in arbitrary form, while achieving miniaturization and enabling rugged structure. Advanced applications are demonstrated using a semi‐automated approach to SL/DP integration. Opportunities exist to fully automate the hybrid SL/DP machine and optimize the manufacturing process for enhancing the commercial appeal for fabricating complex systems.

This work broadly demonstrates what can be achieved by integrating multiple AM technologies together for fabricating unique devices and more specifically demonstrates a hybrid SL/DP machine that can produce 3D monolithic structures with embedded electronics and printed interconnects.

Develops an original 12‐step management of technology protocol and applies it to 51 applications which range from Du Pont’s failure in Nylon to the Single Online Trade Exchange for Auto Parts procurement by GM, Ford, Daimler‐Chrysler and Renault‐Nissan. Provides many case studies with regards to the adoption of technology and describes seven chief technology officer characteristics. Discusses common errors when companies invest in technology and considers the probabilities of success. Provides 175 questions and answers to reinforce the concepts introduced. States that this substantial journal is aimed primarily at the present and potential chief technology officer to assist their survival and success in national and international markets.

Rather than organize as traditional firms, many of today’s companies organize as platforms that sit at the nexus of multiple exchange and production relationships. This chapter considers a most basic question of organization in platform contexts: the choice of boundaries. Herein, I investigate how classical economic theories of firm boundaries apply to platform-based organization and empirically study how executives made boundary choices in response to changing market and technical challenges in the early mobile computing industry (the predecessor to today’s smartphones). Rather than a strict or unavoidable tradeoff between “openness-versus-control,” most successful platform owners chose their boundaries in a way to simultaneously open-up to outside developers while maintaining coordination across the entire system.