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Microwave modules and hybrid circuits have some unique requirements that demand extremely precise dispensing and placement, delicate handling and well controlled curing (or reflow). Assembly of these products can be challenging and defects may result in labor‐intensive manual assembly methods. A better way is to apply automated manufacturing techniques to the assembly of microwave modules and hybrid circuits and thereby eliminate many of the variables that may narrow the process window.

Coors Ceramics GmbH, subsidiary of Coors Ceramics Company's Electronic Products Group, has appointed Mr Viktor Fronz as its German National Accounts Manager. Mr Fronz assumed responsibility for all of Coors Ceramics' electronic products accounts in Germany on 1 July 1994.

Alpha Metals has launched a range of thermoplastic die attach adhesives and adhesive films, following an agreement made with the manufacturers, Staystik Inc. The new adhesives have been developed for die attach in both chip packaging and hybrid circuitry and a comprehensive range is now available to the UK electronics market.

The wave coating machine, developed and manufactured by Robnorganic Systems for the hybrid electronic circuit market, has been designed to apply a protective coating of resin to one side of DIL‐circuits.

Universal Instruments' recently introduced 4785 HSP High Speed Placement system is capable of handling sizes ranging from 20 in. × 18 in. to 4 in. × 4 in. and assembling a wide range of components from 0402 chips to 52‐pin PLCCs. Its contact‐free, vision centring system, featuring 64 level grey‐scale processing, permits placement of components to 0·787 in. with 20 mil lead spacing.

Bath Scientific Ltd of Melksham, Wiltshire, has launched a high speed version of its PrecisionProbe bare/loaded substrate tester. The new version is aimed at higher throughput manufacturers in Europe. To overcome the limitations of jigs and fixtures, the system uses moving probe technology under software control and is available as a single‐sided or concurrent double‐sided test system with up to four probes per surface (maximum eight in total).