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This study aims to investigate the options for additive rapid prototyping methods in microelectromechanical systems (MEMS) technology. Additive rapid prototyping technologies, such as stereolithography (SLA), fused deposition modeling (FDM) and selective laser sintering (SLS), all commonly known as three-dimensional (3D) printing methods, are reviewed and compared with the resolution requirements of the traditional MEMS fabrication methods.

In the 3D print approach, the entire assembly, parts and prototypes are built using various plastic and metal materials directly from the software file input, completely bypassing any additional processing steps. The review highlights their potential place in the overall process flow to reduce the complexity of traditional microfabrication and long processing cycles needed to test multiple prototypes before the final design is set.

Additive manufacturing (AM) is a promising manufacturing technique in micro-device technology.

In the current state of 3D printing, microfluidic and lab-on-a-chip devices for fluid handling and manipulation appear to be the most compatible with the 3D print methods, given their fairly coarse minimum feature size of 50-500 μm. Future directions in the 3D materials and method development are identified, such as adhesion and material compatibility studies of the 3D print materials, wafer-level printing and conductive materials development. One of the most important goals should be the drive toward finer resolution and layer thickness (1-10 μm) to stimulate the use of the 3D printing in a wider array of MEMS devices.

The review combines two discrete disciplines, microfabrication and AM, and shows how microfabrication and micro-device commercialization may benefit from employing methods developed by the AM community.

Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in their efforts to develop and market new products. Looks at the issues from different strategic levels such as corporate, international, military and economic. Presents 31 case studies, including the success of Japan in microchips to the failure of Xerox to sell its invention of the Alto personal computer 3 years before Apple: from the success in DNA and Superconductor research to the success of Sunbeam in inventing and marketing food processors: and from the daring invention and production of atomic energy for survival to the successes of sewing machine inventor Howe in co‐operating on patents to compete in markets. Includes 306 questions and answers in order to qualify concepts introduced.

The purpose of this paper is to present the utilities of packaging and PCB fabrication processes for manufacturing micro electromechanical systems (MEMS) and its package for sensing and actuation applications.

A broad array of manufacturing approaches available in the packaging industry, including lamination, lithography, etching, electroforming, machining, bonding, etc. and a large number of available functional materials such as polymers, ceramics, metals, etc. were explored for producing functional microdevices with greater design freedom.

Good quality MEMS devices can be manufactured using packaging style fabrication, particularly using stacks of laminates. Furthermore, such microdevices can be built with a high degree of integration, pre‐packaged, and at low cost.

Further manufacturing research work should be undertaken in collaboration with the PCB and packaging industries, which stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own integrated MEMS products.

The paper presents examples of basic packaging fabrication processes for producing 3‐D structures and free‐standing structures, and a new MEMS manufacturing paradigm to build micro‐electromechanical (MEMS) for biomedical, optical, and RF communication applications.

Describes the key attributes of MEMS technology and existing and future business opportunities. Discusses the various stages in the fabrication of MEMS devices and offers guidance regarding the selection of processing methods for deposition, lithography and etching. Also describes the MEMS‐Exchange program and associated network of fabrication centres.

The purpose of this paper is to provide a technical review of silicon micro‐electromechanical systems (MEMS) technology and its applications.

Following an introduction, the paper describes silicon MEMS fabrication and assembly techniques, considers a selection of commercially important products and their applications and concludes with a brief review of power MEMS research.

Silicon MEMS fabrication technology is derived from techniques used in semiconductor manufacture and has yielded a diverse and ever‐growing range of sensors, actuators and other miniaturised devices that find applications in a multitude of industries.

This paper provides a detailed technical review of MEMS technology and its applications.

Aim of the present monograph is the economic analysis of the role of MNEs regarding globalisation and digital economy and in parallel there is a reference and examination of some legal aspects concerning MNEs, cyberspace and e‐commerce as the means of expression of the digital economy. The whole effort of the author is focused on the examination of various aspects of MNEs and their impact upon globalisation and vice versa and how and if we are moving towards a global digital economy.