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Article
Publication date: 27 September 2011

Robert Bogue

The purpose of this paper is to review recent developments in micro‐scale assembly technologies, primarily in the context of microsystems based on three‐dimensional (3D…

Abstract

Purpose

The purpose of this paper is to review recent developments in micro‐scale assembly technologies, primarily in the context of microsystems based on three‐dimensional (3D) micro‐electromechanical systems (MEMS) and micro‐opto‐electromechanical systems (MOEMS) technologies.

Design/methodology/approach

Following a brief introduction, this paper first discusses the problems associated with the assembly of micro‐components and then considers the role of robots and self‐assembly technologies. This is followed by a brief summary and conclusion.

Findings

Experimental robotic systems have been developed and used for the assembly of a wide range of MEMS and MOEMS components. Various self‐assembly technologies offer prospects for massively parallel microassembly but have yet to achieve the success of the robotic approach. Some work has sought to combine the best feature of both approaches but as yet, no technologies have been developed that can rapidly, accurately and cost‐effectively assemble micro‐components into hybrid 3D MEMS/MOEMS devices in a true production environment.

Originality/value

This paper provides a detailed review of recent progress in the robotic and self‐assembly of micro‐components.

Details

Assembly Automation, vol. 31 no. 4
Type: Research Article
ISSN: 0144-5154

Keywords

Article
Publication date: 1 September 2004

Yantao Shen, Ning Xi, King W.C. Lai and Wen J. Li

This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene…

Abstract

This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. In this system, to allow close monitoring of magnitude and direction of microforces (adhesion, surface tension, friction, and assembly forces) acting on microdevices during assembly, the PVDF polymer films are used to fabricate the highly sensitive 1D and 2D sensors, which can detect the real‐time microforce and force rate information during assembly processes. This technology has been successfully used to perform a tele‐assembly of the surface MEMS structures with force/visual feedback via Internet between USA and Hong Kong. Ultimately, this E‐manufacture system will provide a critical and major step towards the development of automated micromanufacturing processes for batch assembly of microdevices.

Details

Assembly Automation, vol. 24 no. 3
Type: Research Article
ISSN: 0144-5154

Keywords

Content available
Article
Publication date: 1 August 2003

34

Abstract

Details

Microelectronics International, vol. 20 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 5 April 2013

487

Abstract

Details

Assembly Automation, vol. 33 no. 2
Type: Research Article
ISSN: 0144-5154

Content available
Article
Publication date: 25 September 2009

Clive Loughlin

732

Abstract

Details

Assembly Automation, vol. 29 no. 4
Type: Research Article
ISSN: 0144-5154

Article
Publication date: 8 April 2021

Boyoung Kim, Minyong Choi, Seung-Woo Son, Deokwon Yun and Sukjune Yoon

Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system…

219

Abstract

Purpose

Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system should assemble each part with adequate force and avoid breaking the circuits with excessive force. The purpose of this study is to assemble high precision components with relatively reasonable vision devices compared to previous studies.

Design/methodology/approach

This paper presents a vision-force guided precise assembly system using a force sensor and two charge coupled device (CCD) cameras without an expensive 3-dimensional (3D) sensor or computer-aided design model. The system accurately estimates 6 degrees-of-freedom (DOF) poses from a 2D image in real time and assembles parts with the proper force.

Findings

In this experiment, three connectors are assembled on a printed circuit board. This system obtains high accuracy under 1 mm and 1 degree error, which shows that this system is effective.

Originality/value

This is a new method for sub-mm assembly using only two CCD cameras and one force sensor.

Details

Assembly Automation, vol. 41 no. 2
Type: Research Article
ISSN: 0144-5154

Keywords

Content available
Article
Publication date: 1 September 2003

75

Abstract

Details

Sensor Review, vol. 23 no. 3
Type: Research Article
ISSN: 0260-2288

Keywords

Content available
Article
Publication date: 1 September 2003

Jon Rigelsford

117

Abstract

Details

Assembly Automation, vol. 23 no. 3
Type: Research Article
ISSN: 0144-5154

Keywords

Article
Publication date: 1 December 2004

Vincent Henneken, Marcel Tichem and Bernhard Karpuschewski

An alternative way of performing micro‐assembly tasks is by means of product‐internal assembly functions. After a coarse alignment step, the parts are fine positioned relative to…

Abstract

An alternative way of performing micro‐assembly tasks is by means of product‐internal assembly functions. After a coarse alignment step, the parts are fine positioned relative to each other by functionality that is integrated with the product. This functionality includes part actuation, position sensing and part freezing. They replace expensive machinery and delicate manual labour, and are aimed to result in lower total production costs. Micro electro mechanical system (MEMS) technology has important benefits to be used as supporting technology, because it allows for cost reduction (batch production), and structures can be made with small dimensions and high accuracy. The objective of this paper is to develop a reliable and reproducible interconnection technology using MEMS‐based product‐internal assembly functions, by which packaging cost is reduced and yield is improved. The considered case is the packaging of optical fibre to chip couplings.

Details

Assembly Automation, vol. 24 no. 4
Type: Research Article
ISSN: 0144-5154

Keywords

Article
Publication date: 28 January 2014

Cédric Clévy, Ion Lungu, Kanty Rabenorosoa and Philippe Lutz

– This paper aims to deal with the measurement of positioning accuracies of microscale components assembled to fabricate micro-optical benches (MOB).

Abstract

Purpose

This paper aims to deal with the measurement of positioning accuracies of microscale components assembled to fabricate micro-optical benches (MOB).

Design/methodology/approach

The concept of MOB is presented to explain how to fabricate optical MEMS based on out-of-plane micro-assembly of microcomponents. This micro-assembly platform includes a laser sensor that enables to measure the position of the microcomponent after its assembly. The measurement set-up and procedure is displayed and applied on several micro-assembly sets.

Findings

The measurement system provides results with maximum deviation smaller than ±0.005°. Based on this measurement system and micro-assembly procedure displayed in the article, it is shown that it is possible to obtain a positioning accuracy up to 0.009°.

Originality/value

These results clearly show that micro-assembly is a possible way to fabricate complex, heterogeneous and 3D optical MEMS with very good optical performances.

Details

Assembly Automation, vol. 34 no. 1
Type: Research Article
ISSN: 0144-5154

Keywords

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