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1 – 10 of over 1000The purpose of this paper is to review recent developments in micro‐scale assembly technologies, primarily in the context of microsystems based on three‐dimensional (3D…
Abstract
Purpose
The purpose of this paper is to review recent developments in micro‐scale assembly technologies, primarily in the context of microsystems based on three‐dimensional (3D) micro‐electromechanical systems (MEMS) and micro‐opto‐electromechanical systems (MOEMS) technologies.
Design/methodology/approach
Following a brief introduction, this paper first discusses the problems associated with the assembly of micro‐components and then considers the role of robots and self‐assembly technologies. This is followed by a brief summary and conclusion.
Findings
Experimental robotic systems have been developed and used for the assembly of a wide range of MEMS and MOEMS components. Various self‐assembly technologies offer prospects for massively parallel microassembly but have yet to achieve the success of the robotic approach. Some work has sought to combine the best feature of both approaches but as yet, no technologies have been developed that can rapidly, accurately and cost‐effectively assemble micro‐components into hybrid 3D MEMS/MOEMS devices in a true production environment.
Originality/value
This paper provides a detailed review of recent progress in the robotic and self‐assembly of micro‐components.
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Yantao Shen, Ning Xi, King W.C. Lai and Wen J. Li
This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene…
Abstract
This paper presents our development of a novel Internet‐based E‐manufacturing system to advance applications in micromanipulation and microassembly using an in situ polyvinylidene fluoride (PVDF) piezoelectric sensor. In this system, to allow close monitoring of magnitude and direction of microforces (adhesion, surface tension, friction, and assembly forces) acting on microdevices during assembly, the PVDF polymer films are used to fabricate the highly sensitive 1D and 2D sensors, which can detect the real‐time microforce and force rate information during assembly processes. This technology has been successfully used to perform a tele‐assembly of the surface MEMS structures with force/visual feedback via Internet between USA and Hong Kong. Ultimately, this E‐manufacture system will provide a critical and major step towards the development of automated micromanufacturing processes for batch assembly of microdevices.
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Boyoung Kim, Minyong Choi, Seung-Woo Son, Deokwon Yun and Sukjune Yoon
Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system…
Abstract
Purpose
Many manufacturing sites require precision assembly. Particularly, similar to cell phones, assembly at the sub-mm scale is not easy, even for humans. In addition, the system should assemble each part with adequate force and avoid breaking the circuits with excessive force. The purpose of this study is to assemble high precision components with relatively reasonable vision devices compared to previous studies.
Design/methodology/approach
This paper presents a vision-force guided precise assembly system using a force sensor and two charge coupled device (CCD) cameras without an expensive 3-dimensional (3D) sensor or computer-aided design model. The system accurately estimates 6 degrees-of-freedom (DOF) poses from a 2D image in real time and assembles parts with the proper force.
Findings
In this experiment, three connectors are assembled on a printed circuit board. This system obtains high accuracy under 1 mm and 1 degree error, which shows that this system is effective.
Originality/value
This is a new method for sub-mm assembly using only two CCD cameras and one force sensor.
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Vincent Henneken, Marcel Tichem and Bernhard Karpuschewski
An alternative way of performing micro‐assembly tasks is by means of product‐internal assembly functions. After a coarse alignment step, the parts are fine positioned relative to…
Abstract
An alternative way of performing micro‐assembly tasks is by means of product‐internal assembly functions. After a coarse alignment step, the parts are fine positioned relative to each other by functionality that is integrated with the product. This functionality includes part actuation, position sensing and part freezing. They replace expensive machinery and delicate manual labour, and are aimed to result in lower total production costs. Micro electro mechanical system (MEMS) technology has important benefits to be used as supporting technology, because it allows for cost reduction (batch production), and structures can be made with small dimensions and high accuracy. The objective of this paper is to develop a reliable and reproducible interconnection technology using MEMS‐based product‐internal assembly functions, by which packaging cost is reduced and yield is improved. The considered case is the packaging of optical fibre to chip couplings.
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Cédric Clévy, Ion Lungu, Kanty Rabenorosoa and Philippe Lutz
– This paper aims to deal with the measurement of positioning accuracies of microscale components assembled to fabricate micro-optical benches (MOB).
Abstract
Purpose
This paper aims to deal with the measurement of positioning accuracies of microscale components assembled to fabricate micro-optical benches (MOB).
Design/methodology/approach
The concept of MOB is presented to explain how to fabricate optical MEMS based on out-of-plane micro-assembly of microcomponents. This micro-assembly platform includes a laser sensor that enables to measure the position of the microcomponent after its assembly. The measurement set-up and procedure is displayed and applied on several micro-assembly sets.
Findings
The measurement system provides results with maximum deviation smaller than ±0.005°. Based on this measurement system and micro-assembly procedure displayed in the article, it is shown that it is possible to obtain a positioning accuracy up to 0.009°.
Originality/value
These results clearly show that micro-assembly is a possible way to fabricate complex, heterogeneous and 3D optical MEMS with very good optical performances.
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