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The purpose of this research is as follows: DPP-BOH-PVA has been synthesized from 1,1′:3′,1″-terphenyl-5'-boronic acid (DPP-OH) and polyvinyl alcohol (PVA). The afterglow lifetime of DPP-BOH-PVA was studied by changing contents of DPP-OH (1, 2 and 4 Wt.%). These films were characterized with Fourier transform infrared, X-ray diffraction as structural analysis and DSC as thermal analysis. Afterglow lifetimes were evaluated as time-resolved emission decay profile analysis. Fiber films of DPP-BOH-PVA-2-E have been prepared by electrospinning method with the diameter of 5 μm and afterglow life time of 2.1 s (@ 535 nm) under ambient conditions. Stimulus responsive properties with afterglow emission for fiber film were investigated.

During the synthesis of the polymer, modification was carried out using DPP-OH/PVA with a molar ratio of 1/4, under an alkalinity medium with ammonium hydroxide and with a temperature of 80°C.

XRD results indicate that DPP-BOH-PVA film had high crystallinity, which is crucial for preparing organic room temperature phosphorescence (RTP) materials.

The reaction mixture must be stirred continuously. Temperature should be controlled to prevent the rapid evaporation of ammonium hydroxide.

This study provides technical information for the synthesis of multidimensional stimulation response RTP micron fiber thin film. The electrospinning technology may also promote the applications of the large areas of RTP films.

This resin will be used for the multidimensional stimulation response RTP fiber thin film.

The diameter of fiber film of PP-BOH-PVA-2-E by electrospinning method was in the range of 5 μm, and its afterglow lifetime decayed to be 2.1 s.

This Friction stir welding study aims to weld thick AA8011 aluminium plates, and the interface joints created with a variety of tool pin profiles were examined for their effects on the welding process.

Scanning electron microscopy and optical microscopy and X-ray diffraction were used to examine the macro and micro-structural characteristics, as well as the fracture surfaces, of tensile specimens. The mechanical properties (tensile, hardness tests) of the base metal and the welded specimens under a variety of situations being tested. Additionally, a fracture toughness test was used to analyse the resilience of the base metal and the best weldments to crack formation. Using a response surface methodology with a Box–Behnken design, the optimum values for the three key parameters (rotational speed, welding speed and tool pin profile) positively affecting the weld quality were established.

The results demonstrate that a defect-free junction can be obtained by using a cylindrical tool pin profile, increasing the rotational speed while decreasing the welding speeds. The high temperature and compressive residual stress generated during welding leads to the increase in grain size. The grain size of the welded zone for optimal conditions is significantly smaller and the hardness of the stir zone is higher than the other experimental run parameters.

The work focuses on the careful examination of microstructures behaviour under various tool pin profile responsible for the change in mechanical properties. The mathematical model generated using Taguchi approach and parameters was optimized by using multi-objectives response surface methodology techniques.

The purpose of this paper is to provide a comprehensive review of a non-contact full-field optical measurement technique known as digital image correlation (DIC).

The approach of this review paper is to introduce the research pertaining to DIC. It comprehensively covers crucial facets including its principles, historical development, core challenges, current research status and practical applications. Additionally, it delves into unresolved issues and outlines future research objectives.

The findings of this review encompass essential aspects of DIC, including core issues like the subpixel registration algorithm, camera calibration, measurement of surface deformation in 3D complex structures and applications in ultra-high-temperature settings. Additionally, the review presents the prevailing strategies for addressing these challenges, the most recent advancements in DIC applications across quasi-static, dynamic, ultra-high-temperature, large-scale and micro-scale engineering domains, along with key directions for future research endeavors.

This review holds a substantial value as it furnishes a comprehensive and in-depth introduction to DIC, while also spotlighting its prospective applications.