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In various publications noble steel is mentioned as a possibility for use as a substrate in thick film technology processing. The possibility to cut, stencil and drill steel sheets to desired shapes and the attractive price difference compared with alumina as well as PC board materials justified an investigation. A variety of steel sheets in various formulations from various vendors is offered on the market as well as ceramic pastes for thick film applications. This investigation aims to find out the most suitable ceramic paste for coating steel substrates in a common thick film process.

A month or so after the Stresa meeting, the French ISHM chapter, organising a session on ‘Gallic inks’ (!), summoned me to deliver some comments on the 5th European Hybrid Microelectronics Conference. Although it was only a matter of interlude during this technical session, I felt the task quite a difficult one. It became a hazardous project when Brian C. Waterfield kindly asked me to let what is in fact a personal opinion—my personal opinion, standing back from my daily work—appear in Hybrid Circuits. I'll do my best.

In this research work thick‐film manufacturing technology on stainless steel baseplates was developed. Adequate adhesion of dielectric IP211 to the steel substrate was achieved only by sand blast roughening. Standard PdAg thick‐film conductors were not solderable to IP211. The solution was to have a separate multilayer dielectric under conductors to be soldered. The reliability of soft soldering and gold wire bonding of thick‐film metallisation on stainless steel and other baseplate materials was evaluated. The technology developed was applied to manufacturing an intelligent signal node. Present expertise enables the manufacture of thick‐film hybrids on stainless steel baseplates. Development of an industrial production line would, however, involve considerable effort.