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This study aims to develop a facile ligand-exchange strategy to promote nano-sintering of oleylamine (OAM)-capped silver nanoparticles (AgNPs). By using ligand exchange process with NH₄OH to remove OAM from the surface of AgNP, this study reports effectively reducing the sintering temperature of AgNPs to achieve low-temperature nano-sintering. Compared with untreated AgNPs of OAM-capped, NH₄OH-treated AgNPs possess superior sintering performance that could be applied to a fractional generator device as conductor and in favour of the fabrication of flexible circuit modules.

First, oleylamine is used as reductant to synthesize monodisperse AgNPs by a simple one-step method. Then ligand exchange is used with NH₄OH at different treating times to remove OAM, and micro-Fourier transform infrared spectroscopy and contact angle test are applied to clear the mechanism and structure characteristics of these processes. Finally, NH₄OH-treated AgNPs sediment sintering is used at different temperatures to test electrical resistivity and use ex situ scanning electron microscopy combined with in situ X-ray diffraction to study changes in microstructure in the whole nano-sintering process.

The AgNPs are always capped by organic ligands to prevent nanoparticles agglomeration. And oleylamine used as reductant could synthesize desirable size distributions of 8–32 nm with monodisperse globular shapes, but the low-temperature nano-sintering seemed not to be achieved by the oleylamine-capped AgNPs because OAM is an organic with long C-chain. The ligand exchange approach was enabled to replace the original organic ligands capped on AgNPs with organic ligands of low thermal stability which could promote nano-sintering. After ligand exchange treated AgNPs could be sintered on photo paper, polydimethylsiloxane (PDMS) and polyethylene terephthalate flexible substrates at low temperature.

In this research, the method ligand exchange is used to change the ligand of AgNPs. During ligand exchange, NH₄OH was used to treat AgNPs. Through the treatment of NH₄OH, the change of hydrophilic and hydrophobic properties of AgNPs was successfully realized. The sintering temperature of AgNPs can also be reduced and the properties can be improved. Finally, the applicability of the AgNPs sediment with this nano-sintering process at low temperature for obtaining conductive patterns was evaluated using PDMS as substrates.

This paper aims to find proper technological parameters of low-temperature joining technique by silver sintering to eventually use this technique for reliable electronic packaging.

Based on the literature and author’s own experience, the factors influencing the nanosized Ag particle sintering results were identified, and their significance was assessed.

It has been shown that some important technological parameters clearly influence the quality of the joints, and their choice is unambiguous, but the meaning of some parameters is dependent on other factors (interactions), and they should be selected experimentally.

The value of this research is that the importance of all technological factors was analyzed, which makes it easy to choose the technological procedures in the electronic packaging.

Aluminum nitride (AlN) ceramics are suitable substrate and package materials for high-power integrated circuits.

Dense AlN ceramics with Y₂O₃ and LaF₃ as sintering additives are prepared. The effects of these additives on the density, phase composition, microstructure and thermal conductivity of AlN ceramics are investigated.

Results show that 2 Wt.% Y₂O₃-doped additive is insufficient for the samples to achieve the full densification sintered at 1,700°C. When LaF₃ is added with Y₂O₃, the samples are perfectly densified at the same sintering condition. The relative density and thermal conductivity of the samples are 97.8-99.07 per cent and 169.104-200.010 W·m-1·K-1, respectively. The density of the samples and their microstructure, especially the content and distribution of secondary phases, is necessary to control the thermal conductivity of AlN ceramics.

Y₂O₃ and LaF₃ additives can effectively promote densification and enhance the thermal conductivity of AlN ceramics in a low sintering temperature, and the AlN ceramics added with Y₂O₃-LaF₃ might have potential applications in package materials for high-power integrated circuits.

The purpose of this paper is to fabricate zirconia-nano alumina porous nanocomposites with different amount of alumina (0-30 Wt.%). Specimens were prepared by solid state sintering method at different temperature (1,400-1,700°C).

Effects of processing temperature and amount of alumina on microstructure, distribution of nanoparticles, flexural and compressive strengths, micro-hardness and densification were investigated.

Results indicated that interpenetration of particles and their contacts increased by increasing sintering temperature. As a consequence of better particles contacts and microstructure coarsening, the porosity decreased. As alumina nanoparticles content increased, the amount of porosity decreased conversely and distribution of pores become more uniform. Simultaneous enhancement of temperature and alumina nanoparticles content caused an improvement of flexural and compressive strengths because of an improvement of sintering process resulted from porosity reduction. Increase in hardness and density were observed as porosity values diminished and alumina nanoparticles were distributed well at micro zirconia grain boundaries as a result of increasing the process temperature.

This article contains original research.

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

The purpose of this paper is to explore the possibility of integrating inkjet printed circuitry with fused deposition modeling (FDM) structures to produce embedded electronics and smart structures. Several of the challenges of combining these technologies are identified, and potential solutions are developed.

An experimental approach is taken to investigate some of the relevant physical processes for integrating FDM and inkjet deposition, including the printing, drying and sintering processes. Experimental data are collected to assist understanding of the problems, and engineering solutions are proposed and implemented based on the gained understanding of the problems.

Three challenges have been identified, including the discontinuity of the printed lines resulting from the irregular surface of the FDM substrate, the non-conductivity of the printed lines due to the particle segregation during the droplet drying process and the slow drying process caused by the “skinning effect”. Two engineering solutions are developed for the discontinuity problem. The non-conductivity issue and the slow drying process are attributed to the motion of the nanoparticles caused by the evaporation flow. The thermally activated drying process for the Cabot ink suggests that the proposed solution is effective. Timescale analysis and experimental data show that the printing conditions do not have a clear influence on the conductivity of the printed lines, and drying and sintering processes are more important.

No quantitative model has yet been developed for simulating the printing, drying and sintering processes associated with inkjet printing on FDM substrates. Quantitative models can be extremely valuable for improvement in understanding the problems, optimizing the proposed solutions and coming up with better solutions.

The research findings in this work have great implications in implementing a hybrid FDM-inkjet deposition machine for fabricating embedded electronics and smart structures. All the proposed engineering solutions for the identified problems can be potentially integrated into one machine.

The success of the integration of the FDM and inkjet deposition process will enable the design of compact electro-mechanical structures to replace the large heavy electro-mechanical systems.

This work represents one of the first attempts for integrating inkjet deposition of silver nanoparticle inks with the FDM process for making compact electro-mechanical structures. Three critical challenges are identified, and corresponding engineering solutions are proposed and implemented based on analysis of the relevant physical processes, including the printing, drying and sintering processes, which has laid the foundation for integrating the FDM and inkjet deposition processes.

This purpose of this study was to develop a 3D printer based on powder particle. The best degreasing and sintering process of a blank body was investigated to obtain a metal product with high precision and high surface finish. This process will greatly reduce the difficulty and cost of forming a complex metal product with high application value.

Stainless steel powder and polymer materials were mixed using a rubber mixing machine. The powders were granulated to prepare a mixed material. A powder feed 3D printer was used at low temperature (about 200°C) to print and degrease the body. A series of sintering experiments were performed to study the different sintering temperatures, and the physical and mechanical properties of the sample sintered under various conditions were compared to determine the best degreasing and sintering process.

The reaction at 1,370°C was the optimal route for the metal billet degreasing. The resulting metal products had fine structure and stable performance compared with the products with traditional powder metallurgy composition.

Most 3D printed metal powder materials rely on imports, which are expensive and increase the manufacturing cost. These drawbacks limit the application and development of metal 3D printing technology to a certain extent. The successful study of this molding method greatly reduces the difficulty and cost of forming complex metal products with high application value. This report will provide valuable guidance for sintering process and forming methods.

The low-temperature sintering of silica glass combined with additive manufacturing (AM) technology has brought a revolutionary change in glass manufacturing. This study aims to carry out in an attempt to achieve precious manufacturing of silicate glassy matrix through the method of slurry extrusion.

A low-cost slurry extrusion modelling technology is used to extrude silicate glassy matrix inks, composed of silicate glass powder with different amounts of additives. Extrudability of the inks, their printability window and the featuring curves of silicate glassy matrix are investigated. In addition, the properties of the low-temperature sintering green part as a functional part are explored and evaluated from morphology, hardness and colour.

The results showed that the particle size was mainly distributed from 1.4 µm to 5.3 µm, showing better slurry stability and print continuity. The parameters were set to 8 mm/s, 80% and 0.4 mm, respectively, to achieve better forming of three-dimensional (3D) samples. Besides, the organic binder removal step was concentrated on 200°C–300°C and 590°C–650°C was the fusion bonding temperature of the powder. The hardness values of 10 test samples ranged from 588 HL to 613 HL, which met the requirements of hard stones with super-strong mechanical strength. In addition, the mutual penetration of elements caused by temperature changes may lead to a colourful appearance.

The custom continuous AM technology enables the fabrication of a glass matrix with 3D structural features. The precise positioning technology of the glass matrix is expected to be applied more widely in functional parts.

The purpose of this paper was to investigate an influence of a low temperature pressureless sintering process of silver paste on the quality of sintered joints.

The authors analyzed various curing conditions of the paste during its sintering process: 175°C/90 min, 200°C/60 min, 250°C/30 min, 250°C/60 min, 350°C/30 min and 350°C/60 min. They analyzed an influence of the surface plating applied on a ceramic substrate/layer (Cu, Ag, AgPt and Au thick film) on the joints quality. The authors analyzed microstructure and electrical resistance of the joints. They evaluated these properties from the point of view of thermal aging process and changing resistance, after a constant current loading of the sintered joints.

The nanoscale pressureless silver paste can be applied for replacing a pressure-assisted micro-sized silver paste. It was found that the quality of the metal plating applied on the ceramic substrate/layer has a significant impact on the quality of the sintered joints. Copper and AgPt plating have better impact on quality of sintered joints in compare with Ag plating.

This investigation of the quality of the pressureless sintered joints at the silver-silver interface reveals an evident cracking immediately after the silver paste curing. Rapid sintering process typical for silver-based films on the substrate is because of the inter-diffusion between the micro and nanoparticles of silver at interfacial interface.

Binder jetting is a promising route to produce complex copper components for electronic/thermal applications. This paper aims to lay a framework for determining the effects of sintering parameters on the final microstructure of copper parts fabricated through binder jetting.

The knowledge gained from well-established powder metallurgy processes was leveraged to study the densification behaviour of a fine high-purity copper powder (D₅₀ of 3.4 µm) processed via binder jetting, by performing dilatometry and microstructural characterization. The effects of sintering parameters on densification of samples obtained with a commercial water-based binder were also explored.

Sintering started at lower temperature in cold-pressed (∼680 °C) than in binder jetted parts (∼900 °C), because the strain energy introduced by powder compression reduces the sintering activation energy. Vacuum sintering promoted pore closure, resulting in greater and more uniform densification than sintering in argon, as argon pressure stabilizes the residual porosity. About 6.9% residual porosity was obtained with air sintering in the presence of graphite, promoting solid-state diffusion by copper oxide reduction.

This paper reports the first systematic characterization of the thermal events occurring during solid-state sintering of high-purity copper under different atmospheres. The results can be used to optimize the sintering parameters for the manufacturing of complex copper components through binder jetting.