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1 – 2 of 2The purpose of this study is to prepare a state-of-the-art review on advanced ceramic materials including their fabrication techniques, characteristics, applications and…
Abstract
Purpose
The purpose of this study is to prepare a state-of-the-art review on advanced ceramic materials including their fabrication techniques, characteristics, applications and wettability.
Design/methodology/approach
This review paper presents the various types of advanced ceramic materials according to their compounding elements, fabrication techniques of advanced ceramic powders as well as their consolidation, their characteristics, applications and wetting properties. Hydrophobic/hydrophilic properties of advanced ceramic materials are described in the paper with their state-of-the-art application areas. Optical properties of fine ceramics with their intrinsic characteristics are also presented within. Special focus is given to the brief description of application-based manipulation of wetting properties of advanced ceramics in the paper.
Findings
The study of wetting/hydrophobicity/hydrophilicity of ceramic materials is important by which it can be further modified to achieve the required applications. It also makes some sense that the material should be tested for its wetting properties when it is going to be used in some important applications like biomedical and dental. Also, these advanced ceramics are now often used in the fabrication of filters and membranes to purify liquid/water so the study of wetting characteristics of these materials becomes essential. The optical properties of advanced ceramics are equally making them suitable for many state-of-the-art applications. Dental, medical, imaging and electronics are the few sectors that use advanced ceramics for their optical properties.
Originality/value
This review paper includes various advanced ceramic materials according to their compounding elements, different fabrication techniques of powders and their consolidation, their characteristics, various application area and hydrophobic/hydrophilic properties.
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Keywords
Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng and Tao Zhang
This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.
Abstract
Purpose
This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.
Design/methodology/approach
Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.
Findings
The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.
Originality/value
A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.
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