Search results

The purpose of this paper is to investigate the thermal behaviors of high power LED packages to enhance the thermal performances of low temperature co‐fired ceramic chip on board (LTCC‐COB) package. Thermal analysis demonstrated an improved LTCC‐COB package design that is comparable to a metal lead frame package with low thermal resistance.

The LED device developed in this study is a LTCC package mounted directly on the metal PCB. A numerical simulation was performed to investigate the thermal characteristics of the LED module using the finite volume method, which is embedded in commercial software (Fluent V.6.3). Thermal resistance and temperature measurement validate the simulated results.

The effect of the thickness of the die attach material on the thermal resistance was dominant due to low thermal conductivity, and the junction temperature decreased significantly with slight increases in thermal conductivity, especially when the value was less than 5 W/mK. The results reveal that the thermal resistance of MCPCB is about 49 per cent‐58 per cent of the junction to board thermal resistance. The thermal model results showed good agreement with experimental results.

The developed model overcomes the large thermal resistance of a conventional LTCC package for high power LED module. The extensive results have demonstrated an improved thermal design, optimal dimensions of each component and boundary conditions for high power LTCC‐COB type package.

In order for system designers to make full use of the successive generations of semiconductor devices it is becoming increasingly necessary to choose interconnection systems that are tailored to the application. As this trend becomes more pronounced, the limitations of traditional methods of constructing boards onto which electronic components can be assembled are becoming more obvious. In this paper the application of selective electroplating, a technique that has been in use for many years but has not previously been fully exploited, is discussed. It is shown by examining a number of case studies that with a small amount of innovation this basic technique can be extended to meet the needs of a number of application areas while still operating within the normal processing windows of the materials.

The paper aims to present the influence of the co-firing process conditions of low temperature co-fired ceramics (LTCC) on the deformation of thin LTCC membranes.

The statistical design of the experiment methodology was used in the frame of these investigations to reduce the time and costs of the experiments and to ensure easier interpretation of the obtained results. Moreover, this conception permits the rough estimation of the membrane deflection fired at optimal process conditions.

The applied design of the experiment methodology allowed the researchers to find the optimal co-firing process conditions and to estimate the membrane deflection at the optimal process conditions. The estimation fits well with the results of real measurement that was conducted to confirm the estimation precision.

The experiment was conducted for only one type of LTCC, DP951. The precision of the design of the experiment optimization and estimation of the response at optimal conditions depend on the described object. Therefore, the findings of this paper do not have to be generally true for other LTCC tapes, and if other LTCC tapes deformation should be investigated, then similar analysis shall be conducted for them.

The deformation of LTCC membranes affects the sensitivity and repeatability of LTCC acceleration and pressure sensors. Hence, the decrease of membrane deflection increases the usability of LTCC in such applications.

This paper presents simple optimization of co-firing process conditions of LTCC devices using statistical design of the experiment.

Modern complex integrated circuits require more input/output connections and operate at faster switching speeds and higher power levels than was the case before LSI and VLSI devices. As a result, there is a need for packages with high electrical conductivity, low dielectric constant, high thermal conductivity, precise line resolution and low unit cost. Ideally, it should also be possible to include resistors and for the package to be manufactured in‐house for maximum control. Multilayer printed circuit boards, complex multilayer hybrid circuits and high temperature co‐fired ceramic packages have been used to accomplish the interconnection of complex ICs. A new technology has been developed which combines the benefits of thick film with the processing advantages of co‐fired ceramic. The thick film process begins with a bare substrate, usually 96% alumina, upon which gold, silver alloy or copper metallisation, and screen‐printable dielectric paste are applied. Processing is a series of printing and firing operations; the firing temperature is usually between 800°C and 1000°C. Interconnecting vias are typically formed by screen printing and are usually a minimum of 250 ?m (10 mil) in diameter. The high temperature co‐fired approach uses no substrate. Printing of tungsten, molybdenum or molymanganese metallisation is carried out on alumina tape dielectric. The vias are formed by mechanical punching and are typically a minimum of 200 ?m (8 mil) in diameter. A single firing is performed in a special atmosphere, usually at 1500°C. This paper describes a new materials system which consists of a tape dielectric and gold, silver and silver/palladium inner layer and via fill conductor compositions. Circuits and packages made with the system are fired in an air atmosphere in standard thick film furnaces and are compatible with other conventional thick film materials. The process for making these parts is described and critical process parameters are identified. The results of reliability testing under temperature, humidity and bias are discussed and supporting microstructural analysis is presented.

The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired ceramics technology (LTCC), especially on the properties such as warpage of LTCC associated with conductors, microstructure of the fired thick films, sheet resistance and adhesion on LTCC.

Silver thick film paste compositions were formulated by changing the silver glass frit ratio. The compatibility of these formulated paste compositions with LTCC (DP 951AX) substrate were evaluated. The properties such as microstructure developments, the change in sheet resistance, warpage of LTCC substrate with respect to glass frit ratio of the developed silver films on LTCC were evaluated.

The results reveal that the glass frit percentage used in paste formulation is equally responsible for the disturbance in the properties such as microstructure, warping and electrical properties of the fired thick films on LTCC. It was observed that the paste composition, in particular sample SP10B containing the highest glass frit percentage, is compatible with the LTCC tape under processing conditions. The sheet resistance value in the range of 5 mΩ/□ and the fired films showed very good adhesion (3.95 N), irrespective of the glass frit composition.

The paper provides useful evaluations of properties such as microstructure developments, changes in sheet resistance and warpage of LTCC substrate with respect to glass frit ratio of the developed silver pastes on LTCC.

The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented.

The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter scales was realized.

The developed ozone generator with the dimensions of 63.6 × 41.8 × 1.3 mm produces approximately 1 vol. % of ozone in oxygen flow of 15 ml/min, at an applied voltage of 7 kV.

A miniature ozone generator, manufactured in LTCC technology, produces high amount of ozone and more than it is described in the available references or in datasheets of commercial devices of similar size.

The purpose of this study was to design, fabricate and test devices based on transformers integrated with low-temperature co-fired ceramic (LTCC) modules with isolation between primary and secondary windings at the level between 6 and 12 kV.

Insulating properties of the LTCC were examined. Dielectric strength and volume resistivity were determined for common LTCC tapes: 951 (DuPont), 41020, 41060 (ESL), A6M (Ferro) and SK47 (KEKO). According to the determined properties, three different devices were designed, fabricated and tested: a compact DC/DC converter, a galvanic separator for serial digital bus and a transformer for high-voltage generator.

Breakdown field intensity higher than 40 kV/mm was obtained for the test samples set, whereas the best breakdown field intensity of about 90 kV/mm was obtained for 951 tape. The materials 41020 and 951 exhibited the highest volume resistivity. Fabricated devices exhibited safe operation up to a potential difference of 10 kV, limited by minimum clearance. Long-term stability was assured by over 20 kV strength of inner dielectric.

This paper contains description of three devices made in the LTCC technology for application in systems with high-voltage isolation requirement, for example, for power or railway power networks.

The results show that LTCC is a suitable material for fabrication of high-voltage devices with integrated passives. Technology and properties of three examples of such devices are described, demonstrating the ability of the LTCC technology for application in reliable high-voltage devices and systems.

Low temperature co‐fired ceramics (LTCC) material is introduced as an excellent alternative to silicon, glass, or plastic materials for the fabrication of miniaturised analytical devices, though it is most widely used in the automotive and microwave industries. The paper aims to study the laser ablation of LTCC material.

This kind of green tape material is mechanised by excimer laser (KrF, 248 nm) and UV laser (Nd: YAG, 355 nm), and for the first time by infra‐red laser (1,090 nm). The optical photos and the scanning electronic microscope (SEM) photos of the LTCC ablated by different kinds of laser sources are given in this paper.

When using the UV laser, the tapered structure can be easily seen from the SEM photo. However, a kind of clear and perfect ablation of LTCC can be seen for the first time by the 1,090 nm infra‐red laser ablation.

The laser ablation of LTCC by optical fibre sources is discussed.

The purpose of this paper is to focus on development and electrical characterization of miniature ion-selective electrode (ISE) for application in micro total analysis system or lab-on-chip devices. The presented ISE is made using low temperature co-fired ceramics (LTCC). It shows possibility of integration chemically sensitive layers with structures fabricated using modern microelectronic technology.

The presented ISEs were fabricated using LTCC microelectronic technology. The possibility of ISE fabrication on multilayer ceramic substrate made of two different LTCC material systems (CeramTec GC, Du Pont 951) with deposited thick-film silver pad is studied. Different configurations of LTCC/silver pad (surface, embedded) are taken into account. Electrical performance of all LTCC-based structures with integrated ISE was examined experimentally.

The preliminary measurements made for ammonium ions have shown good repeatability and linear response with slope of about 30-35 mV/dec. Moreover, no significant impact of the LTCC material system and silver pad configuration on fabricated ISEs’ electrical properties was noticed.

The presented research is a preliminary work. The authors focused on ISE fabrication on LTCC substrates without any microfluidic structures. Therefore, further research work will be needed to evolve ion-selective membrane deposition inside microfluidic structures made in LTCC substrates.

Development of the LTCC-based ISE makes the fabrication of detection units for integrated microfluidic systems possible. These devices can find practical applications in analytical diagnosis and continuous monitoring of various biochemical parameters.

This paper shows design, fabrication and performance of the novel ISE fabrication using LTCC technology.

The purpose of this paper is to focus on a description of reliable bonding technique of zero-shrink low-temperature co-fired ceramic (LTCC) and alumina ceramics. LTCC is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates, it is now possible to bond unfired substrates with other fired substrates, for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging.

The test structure contains a thick-film pattern for verification of the compatibility of the bonding process. We have used two methods for bonding the substrates: cold chemical lamination (CCL) and thermo compression method, using a dielectric thick-film paste as the adhesive. Optical microscopy, scanning electron microscopy and electric testing of the screen-printed patterns were used for verification of the bonding quality.

The thermo-compression method gave poor results in comparison with the CCL method. The best quality of lamination was achieved at room temperature combined with low pressure for both types of bonding materials. In addition, a possibility of using this bonding method for sensor fabrication was investigated. The ceramic pressure sensor samples with a cavity were created.

The possibility of bonding two different ceramic materials was investigated. A new approach to ceramic bonding showed promising results with possible use in sensors.