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There is an increasing popularity for the continuum robot in minimally invasive surgery owing to its compliance and dexterity. However, the dexterity takes the challenges in loading and precise control because of the absence of the shape tracking for the continuum robot. The purpose of this paper is to propose a new type of continuum manipulator with variable stiffness that can track the bending shape timely.

The low-melting-point alloy (LMPA) is used to implement the stiffness variation and shape detection for the continuum manipulator. A conceptual design for a single module is presented, and the principle of stiffness control based on the established static model is formulated. Afterward, a shape detection method is introduced in which the shape of the continuum manipulator can be detected by measuring the resistance of every LMPA. Finally, the effect of the proposed variable stiffness method is verified by simulation; the variable stiffness and shape detection methods are evaluated by experiments.

The results from the simulations and experiments indicate that the designed continuum manipulator has the ability of stiffness variation over 42.3% and the shape detection method has high precision.

Compared with conventional structures, the novel manipulator has a simpler structure and integrates the stiffness variation and shape detection capabilities with the LMPA. The proposed method is promising, and it can be conveniently extended to other continuum manipulators.

Fused deposition modelling (FDM) has gained popularity owing to its capability of producing complex and customized profiles at relatively low cost and in shorter periods. The study aims to extend the use of FDM printers for 3D printing of low melting point alloy (LMPA), which has applications in the electronics industry, rapid tooling, biomedical, etc.

Solder is the LMPA with alloy’s melting temperature (around 200°C) lower than the parent metals. The most common composition of the solder, which is widely used, is tin and lead. However, lead is a hazardous material having environmental and health deteriorating effects. Therefore, lead-free Sn89Bi10Cu non-eutectic alloy in the form of filament was used. The step-by-step method has been used to identify the process window for temperature, print speed, filament length (E) and layer height. The existing FDM printer was customized for the present work.

Analysis of infrared images has been done to understand discontinuity at a certain range of process parameters. The effect of printing parameters on inter-bonding, width and thickness of the layers has also been studied. The microstructure of the parent material and deposited bead has been observed. Conclusions were drawn out based on the results, and the scope for the future has been pointed out.

The experiments resulted in the process window identification of print speed, extrusion temperature, filament length and layer height of Sn89Bi10Cu which is not done previously.

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.

The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed.

It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%.

The obtained results of investigations can be usable for designers of the assembly process of power LED modules.

This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.

Rigid robotic hands are generally fast, precise and capable of exerting large forces, whereas soft robotic hands are compliant, safe and adaptive to complex environments. It is valuable and challenging to develop soft-rigid robotic hands that have both types of capabilities. The paper aims to address the challenge through developing a paradigm to achieve the behaviors of soft and rigid robotic hands adaptively.

The design principle of a two-joint finger is proposed. A kinematic model and a stiffness enhancement method are proposed and discussed. The manufacturing process for the soft-rigid finger is presented. Experiments are carried out to validate the accuracy of the kinematic model and evaluate the performance of the flexible body of the finger. Finally, a robotic hand composed of two soft-rigid fingers is fabricated to demonstrate its grasping capacities.

The kinematic model can capture the desired distal deflection and comprehensive shape accurately. The stiffness enhancement method guarantees stable grasp of the robotic hand, without sacrificing its flexibility and adaptability. The robotic hand is lightweight and practical. It can exhibit different grasping capacities.

It can be applied in the field of industrial grasping, where the objects are varied in materials and geometry. The hand’s inherent characteristic removes the need to detect and react to slight variations in surface geometry and makes the control strategies simple.

This work proposes a novel robotic hand. It possesses three distinct characteristics, i.e. high compliance, exhibiting discrete or continuous kinematics adaptively, lightweight and practical structures.