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This paper studies the profit efficiency of a sample of large U.S. commercial banks and explores how this performance varies with selected measures of bank risk reflecting aspects of credit risk, liquidity risk, and insolvency risk. We use a standard profit function and the stochastic frontier approach, and compare two standard functional forms – Cobb‐Douglas and translog – to assess the tradeoff between precision and parsimony. We find that profit efficiency is sensitive to credit risk and insolvency risk but not to liquidity risk or to the mix of loan products.

The purpose of this research is to examine the degree to which the UAE banks use risk management practices and techniques in dealing with different types of risk. The secondary objective is to compare risk management practices between the two sets of banks.

The authors developed a modified questionnaire, divided into two parts. The first part covers six aspects: understanding risk and risk management; risk identification; risk assessment and analysis; risk monitoring; risk management practices; and credit risk analysis. This part includes 43 closed‐ended questions based on an interval scale. The second part consists of two closed‐ended questions based on an ordinal scale dealing with two topics: methods of risk identification, and risks facing the sample banks.

This study found that the three most important types of risk facing the UAE commercial banks are foreign exchange risk, followed by credit risk, then operating risk. It also found that the UAE banks are somewhat efficient in managing risk, and risk identification and risk assessment and analysis are the most influencing variables in risk management practices. Finally, the results indicate that there is a significant difference between the UAE national and foreign banks in the practice of risk assessment and analysis, and in risk monitoring and controlling.

The article will be of value to those interested in the banking industry.

The purpose of this paper is to report empirical evidence regarding the risk management practices of banks operating in Bahrain.

A sample of bankers was surveyed through a questionnaire and the results used to examine if the risk management practices are significantly associated with the type of bank (conventional or Islamic) and if those practices are positively affected by understanding risk, risk management, risk identification, risk assessment analysis, risk monitoring and credit risk analysis. Several statistical and econometric methods were used to the test the hypotheses.

Banks in Bahrain are found to have a clear understanding of risk and risk management, and have efficient risk identification, risk assessment analysis, risk monitoring, credit risk analysis and risk management practices. In addition, credit, liquidity and operational risk are found to be the most important risks facing both conventional and Islamic banks. Furthermore, the risk management practices are determined by the extent to which managers understand risk and risk management, efficient risk identification, risk assessment analysis, risk monitoring and credit risk analysis. Islamic banks are found to be significantly different from their conventional counterparts in understanding risk and risk management. The levels of risks faced by Islamic banks are found to be significantly higher than those faced by conventional banks. Similarly, country, liquidity, and operational, residual, and settlement risks are found to be higher in Islamic banks than in conventional banks.

The results may have been influenced by the current economic global crisis. Although the response rate is very high, there is no evidence of non‐response bias, and there is high internal consistency within the responses. The reliance on survey methodology introduces the possibility that respondents expressed their beliefs and did not necessarily describe their actions.

Bankers, depositors, investors and regulators are likely to benefit from the results of the study when taking decisions related to the banking industry.

This is the first published attempt to investigate empirically the risk management practices of banks operating in Bahrain and to compare the practices of conventional and Islamic banks.

This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications.

More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs).

Many reviewed articles reported advanced CMP for semiconductor device fabrications and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded FOWLPs are very thin, wafer grinding becomes critical. The strength of the FOWLPs is significantly affected by grinding.

This paper attempts to provide an introduction to recent developments and the trends in abrasive processes for microelectronics manufacturing. With the references provided, readers may explore more deeply by reading the original articles. Original suggestions for future research work are also provided.

JingWei BIAN is Director of Urban Construction Environment and Resources Committee of Xiamen Municipal People's Congress. He graduated from Tongji University with doctor's degree in urban planning and design. He is Professorate Senior Urban Planner and National Registered Urban Planner. He is a part-time Professor at Xiamen University, Huaqiao University and Jimei University. He has served as President of Xiamen Urban Planning and Design Institute and Deputy Director of Xiamen Planning Bureau. His main research interests are the urban planning theory and design, urban traffic planning, urban and rural planning management and regulations. He has published 4 books and over 50 papers on these topics.

Autonomous mobile manipulation depends on a lot of effort at various levels. In general, the hardware design is as important as algorithm (or software) design. In particular, the absence of certain capabilities of hardware can seriously affect the feasibility and performance of algorithms. The purpose of this paper is to present work on developing hardware capability for mobile manipulation by low‐cost humanoids (LOCH) humanoid robot.

This paper presents research work on developing the hardware support which enables vision‐guided mobile manipulation realized on top of a biped humanoid robot called LOCH. One important goal which guides the development is to achieve the hardware capability with human‐like dexterity, modularity, functionality, and appearance.

This paper discusses the detail of solutions leading to the realization of the intended hardware capability, focusing in particular on the issues related to mechanism, actuation, distributed sensing, and distributed control of humanoid head, humanoid hands and humanoid arms. Finally, the paper shows the result of the actual prototype, which can be controlled by a remote control station through wireless connection.

In designing a machine, it is common to do motor‐sizing and material selection. Since these are standard procedures, these details are omitted because readers with the training in mechanical engineering should be able to work out such details in order to select the appropriate motors and materials. Also, this paper does not delve into the description of the biped system of LOCH humanoid, because such work requires another long paper in order to reveal major details.

This paper presents the major detail of research efforts toward developing hardware capabilities for achieving autonomous mobile manipulation by LOCH humanoid robot, focusing on three important modules, namely: perception head, human‐like hands, and arms. The uniqueness of this work is twofold. First, LOCH humanoid robot's perception head has the most versatile sensing capabilities, which are fully integrated into a compact and human‐like head. Second, each of LOCH humanoid robot's hands has 14 degrees of freedom, which are realized within a mechanism which is of human‐hand size and shape. In addition, the perception head, humanoid hands and humanoid arms are seamlessly integrated together owing to the adoption of a distributed system which supports networked sensing and control through the use of both control area network bus and transmission control protocol/internet protocol internet.

We present 3D simulation of low loss splitters made on Lithium Niobate used in Mach-Zehnder interferometers. The interferometer consists of the splitters designed with photonic crystal structures at splitting point and bend positions for reduced size and loss, and straight sections as channel waveguides with high electro-optical coefficient r₃₃ of Lithium Niobate for reduced interactive length and modulating voltage π. The simulation shows a reduced coupling loss to 1.37 dB with the channel waveguides made suspended and V_π?is only 0.42V for interactive length of 200 um.

Bumpless Cu/SiO₂ hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings. The SAB method is overdemanding in the bonding environment, and the TCB method requires a high temperature to remove copper oxide from surfaces, which increases the thermal budget and grossly damages the fine-pitch device.

In this review, methods to prevent and remove copper oxidation in the whole bonding process for a lower bonding temperature, such as wet treatment, plasma surface activation, nanotwinned copper and the metal passivation layer, are investigated.

The cooperative bonding method combining wet treatment and plasma activation shows outstanding technological superiority without the high cost and additional necessity of copper passivation in manufacture. Cu/SiO₂ hybrid bonding has great potential to effectively enhance the integration density in future 3D packaging for artificial intelligence, the internet of things and other high-density chips.

To achieve heterogeneous bonding at a lower temperature, the SAB method, chemical treatment and the plasma-assisted bonding method (based on TCB) are used, and surface-enhanced measurements such as nanotwinned copper and the metal passivation layer are also applied to prevent surface copper oxide.

The purpose of this paper is to introduce new non‐classical implementations of neural networks (NNs). The developed implementations are performed in the quantum, nano, and optical domains to perform the required neural computing. The various implementations of the new NNs utilizing the introduced architectures are presented, and their extensions for the utilization in the non‐classical neural‐systolic networks are also introduced.

The introduced neural circuits utilize recent findings in the quantum, nano, and optical fields to implement the functionality of the basic NN. This includes the techniques of many‐valued quantum computing (MVQC), carbon nanotubes (CNT), and linear optics. The extensions of implementations to non‐classical neural‐systolic networks using the introduced neural‐systolic architectures are also presented.

Novel NN implementations are introduced in this paper. NN implementation using the general scheme of MVQC is presented. The proposed method uses the many‐valued quantum orthonormal computational basis states to implement such computations. Physical implementation of quantum computing (QC) is performed by controlling the potential to yield specific wavefunction as a result of solving the Schrödinger equation that governs the dynamics in the quantum domain. The CNT‐based implementation of logic NNs is also introduced. New implementations of logic NNs are also introduced that utilize new linear optical circuits which use coherent light beams to perform the functionality of the basic logic multiplexer by utilizing the properties of frequency, polarization, and incident angle. The implementations of non‐classical neural‐systolic networks using the introduced quantum, nano, and optical neural architectures are also presented.

The introduced NN implementations form new important directions in the NN realizations using the newly emerging technologies. Since the new quantum and optical implementations have the advantages of very high‐speed and low‐power consumption, and the nano implementation exists in very compact space where CNT‐based field effect transistor switches reliably using much less power than a silicon‐based device, the introduced implementations for non‐classical neural computation are new and interesting for the design in future technologies that require the optimal design specifications of super‐high speed, minimum power consumption, and minimum size, such as in low‐power control of autonomous robots, adiabatic low‐power very‐large‐scale integration circuit design for signal processing applications, QC, and nanotechnology.