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Suhana Mohezar, Ainin Sulaiman, Mohammad Nazri Mohamad Nor and Safiah Omar
This paper aims to examine the impacts of corporate entrepreneurship, national policies and supply chain collaboration on the innovativeness of manufacturers of light emitting…
Abstract
Purpose
This paper aims to examine the impacts of corporate entrepreneurship, national policies and supply chain collaboration on the innovativeness of manufacturers of light emitting diode (LED) in Malaysia.
Design/methodology/approach
The data were collected by using questionnaire survey from the manufacturers involved in the various echelon of the supply chain. The data collected were analyzed by using partial least square (PLS).
Findings
Corporate entrepreneurship plays a moderating role in the relationship between national policies, supply chain collaboration and innovativeness.
Research limitations/implications
This study is only focusing on the supply chain of LED in Malaysia; hence, the results may not be suitable to be generalized to wider populations.
Practical implications
The findings of this study could help the local companies to understand on how, as entrepreneurs, they could expand from small scale to contract manufacturers through enhancing innovativeness. This is important as failure to do so may cause them to be excluded from the global supply chain.
Originality/value
This study expands the existing literature by providing empirical evidence from the perspective of an emerging country, namely, Malaysia. It also attempts to close the gaps by examining the role of corporate entrepreneurship as the moderating variable.
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Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek and Sebastian Wroński
This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering…
Abstract
Purpose
This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.
Design/methodology/approach
The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.
Findings
It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.
Originality/value
The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.
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Abstract
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Milena Kiliszkiewicz, Dariusz Przybylski, Jan Felba and Ryszard Korbutowicz
The purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of conductive…
Abstract
Purpose
The purpose of this paper is to analyze the individual steps during the printing of capacitor structures. The method of substrate preparation, the obtained roughness of conductive and dielectric layers are examined. Moreover, the capacitances of the obtained capacitors were examined.
Design/methodology/approach
Surface roughness and microscopic analysis were used to assess the quality of printed conductive structures. Two criteria were used to assess the quality of printed dielectric structures: the necessary lack of discontinuity of layers and minimal roughness. To determine the importance of printing parameters, a draft experimental method was proposed.
Findings
The optimal way to clean the substrate has been determined. The most important parameters for the dielectric layer (i.e. drop-space, table temperature, curing time and temperature) were found.
Research limitations/implications
If dielectric layers are printed correctly, most problems with printing complex electronic structures (transistors, capacitors) will be eliminated.
Practical implications
The tests performed identified the most important factors for dielectric layers. Using them, capacitors of repeatable capacity were printed.
Originality/value
In the literature on this subject, no factors were found which were responsible for obtaining homogeneous dielectric layers.
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