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Flexible light-emitting textile display is designed with floats for electronic elements covering and electronic contacts insulation what at the same time provides an opportunity to develop aesthetic design of the display in the single piece construction of material. The paper aims to discuss these issues.

Display consists of interwoven electrically conductive yarns, non-conductive yarns and SMD LEDs connected to conductive yarns. Industrial jacquard weaving machine have been used, weave patterns were designed in PC-Edit software.

Weave can be used as a tool to build and evolve electrotextile. Exploring weaving techniques and perceiving electronic circuit as a weave pattern, new approaches can be developed in electrotextile design field.

Connections of electronic elements and conductive textile materials still is actual problem what should be explored in further research.

Flexible light emitting textile display can be used as output interface integrated into communication clothing by representing different animated images directly on clothing. Display also can be used for accessories, room and auto interior etc. applications.

Paper describes method of light source integration directly into textile structure, combining functional and visual design of textile display.

This review paper aims to introduce the inkjet printing as a tool for fabrication of flexible/wearable sensors. It summarizes inkjet printing techniques including various modes of operation, commonly used substrates and inks, commercially available inkjet printers and variables affecting the printing process. More focus is on the drop-on-demand printing mode, a strongly considered printing technique for patterning conductive lines on flexible and stretchable substrates. As inkjet-printed patterns are influenced by various variables related to its conductivity, resistivity, durability and dimensions of printed patterns, the main printing parameters (e.g. printing multilayers, inks sintering, surface treatment, cartridge specifications and printing process parameters) are reported. The embedded approaches of adding electronic components (e.g. surface-mounted and optoelectronic devices) to the stretchable circuit are also included.

In this paper, inkjet printing techniques for fabrication of flexible/stretchable circuits will be reviewed. Specifically, the various modes of operation, commonly used substrates and inks and variables affecting the printing process will be presented. Next, examples of inkjet-printed electronic devices will be demonstrated. These devices will be compared to their rigid counterpart in terms of ease of implementation and electrical behavior for wearable sensor applications. Finally, a summary of key findings and future research opportunities will be presented.

In conclusion, it is evident that the technology of inkjet printing is becoming a competitor to traditional lithography fabrication techniques, as it has the advantage of being low cost and less complex. In particular, this technique has demonstrated great capabilities in the area of flexible/stretchable electronics and sensors. Various inkjet printing methods have been presented with emphasis on their principle of operation and their commercial availability. In addition, the components of a general inkjet printing process have been discussed in details. Several factors affect the resulting printed patterns in terms of conductivity, resistivity, durability and geometry.

The paper focuses on flexible/stretchable optoelectronic devices which could be implemented in stretchable circuits. Furthermore, the importance and challenges related to printing highly conductive and highly stretchable lines, as well as reliable electronic devices, and interfacing them with external circuitry for power transmission, data acquisition and signal conditioning have been highlighted and discussed. Although several fabrication techniques have been recently developed to allow patterning conductive lines on a rubber substrate, the fabrication of fully stretchable wearable sensors remains limited which needs future research in this area for the advancement of wearable sensors.

The purpose of this paper is to present an electrothermal model of the module containing power light emitting diodes (LEDs) situated on a common base.

The electrothermal model of this device, which takes into account both self-heating and mutual thermal coupling between the diodes situated in this module, is described.

The correctness of the presented model is verified experimentally, and a good agreement of the calculated and measured optical and thermal characteristics of the considered module is obtained.

The presented model can be used for different structures of the LED module, but electrical inertia in the diodes is omitted.

The presented model was used to calculate electrical, thermal and optical waveforms of the module OSPR3XW1 containing three power LED situated on the common base.

The presented model takes into account thermal inertia in the considered LED module and its cooling systems with mutual thermal coupling between all the diodes situated in the same module.

This paper aims to present the results of investigations that show the influence of soldering process parameters on the optical and thermal parameters of power LEDs.

The power LEDs were soldered onto metal core printed circuit board (MCPCB) substrates in different soldering ovens: batch and tunnel types, characterized by different thermal profiles. Three types of solder pastes based on Sn99Ag0.3Cu0.7 with the addition of TiO₂ were used. The thermal and optical parameters of the diodes were measured using classical indirect electrical methods. The results of measurements obtained were compared and discussed.

It was shown that the type of oven and soldering thermal profile considerably influence the effectiveness of the removal of heat generated in the LEDs tested. This influence is characterized by thermal resistance changes. The differences between the values of this parameter can exceed 20%. This value also depends on the composition of the soldering paste. The differences between the diodes tested can exceed 15%. It was also shown that the luminous flux emitted by the diode depends on the soldering process used.

The results obtained could be useful for process design engineers for assembling power LEDs for MCPCBs and for designers of solid-state light sources.

This paper presents the results of investigations into the influence of the soldering profiles and soldering pastes used on the effectiveness of the removal of heat generated in power LEDs. It shows and discusses how the factors mentioned above influence the thermal resistance of the LEDs and optical parameters that characterize the light emitted.

One major problem in the lighting industry is the thermal management of the devices. Handling of thermal resistance from solder point to the ambiance of the light-emitting diode (LED) package is linked to the external thermal management that includes a selection of the cooling mode, design of heatsink/substrate and thermal interface material (TIM). Among the significant factors that increase the light output of the of the LED system are efficient substrate and TIM. In this work, the influence of TIM on the luminous flux performance of commercial indium gallium aluminium phosphide (InGaAlP) low-power (LP) LEDs was investigated.

One batch of LEDs was mounted directly onto substrates which were glass-reinforced epoxy (FR4) and aluminium-based metal-core printed circuit boards (MCPCBs) with a dielectric layer of different thermal conductivities. Another batch of LEDs was prepared in a similar way, but a layer of TIM was embedded between the LED package and substrate. The TIMs were thermally conductive epoxy (TCE) and thermally conductive adhesive (TCA). The LED parameters were measured by using the integrated system of thermal transient tester (T3Ster) and thermal-radiometric characterization of LEDs at various input currents.

With the employment of TIM, the authors found that the LED’s maximum luminous flux was significantly higher than the value mentioned in the LED datasheet, and that a significant reduction in thermal resistance and junction temperature was revealed. The results showed that for a system with low thermal resistance, the maximum luminous flux appeared to occur at a higher power level. It was found that the maximum luminous flux was 24.10, 28.40 and 36.00 lm for the LEDs mounted on the FR4 and two MCPCBs, respectively. After TCA application on the LEDs, the maximum luminous flux values were 32.70, 36.60 and 37.60 lm for the FR4 and MCPCBs, respectively. Moreover, the findings demonstrated that the performance of the LED mounted on the FR4 substrate was more affected by the employment of the TIM than that of MCPCBs.

One of the major problems in the lighting industry is the thermal management of the device. In many low-power LED applications, the air gap between the two solder pads is not filled up. Heat flow is restricted by the air gap leading to thermal build-up and higher thermal resistance resulting in lower maximum luminous flux. Among the significant factors that increase the light output of the LED system are efficient substrate and TIM.

The findings in this work can be used as a method to improve thermal management of LP LEDs by applying thermal interface materials that can offer more efficient and brighter LP LEDs. Using aluminium-based substrates can also offer similar benefits.

Users of LP LEDs can benefit from the findings in this work. Brighter automotive lighting (signalling and backlighting) can be achieved, and better automotive lighting can offer better safety for the people on the street, especially during raining and foggy weather. User can also use a lower LED power rating to achieve similar brightness level with LED with higher power rating.

Better thermal management of commercial LP LEDs was achieved with the employment of thermal interface materials resulting in lower thermal resistance, lower junction temperature and brighter LEDs.

The purpose of this paper is to investigate drivers’ differing psychological perceptions of cyclists’ conspicuity according to active visibility aid configurations on clothing.

The flashing light-emitting diodes (FLEDs) were positioned on the major joints (shoulders, elbows, wrists, hips, knees, and ankles) in eight configurations and pre- and post-surveys were conducted.

The results indicated that there were significant differences among the eight configurations in observers’ detection and recognition of cyclists, contributions of FLEDs, and visibility of cyclists (p<0.001). Among the eight different configurations on joints, FLEDs on the hips, knees, and ankles were the most detectable, recognizable, and visible.

Most of the previous studies have investigated passive visibility aids and there is a lack of research on FLED configurations on major joints for cyclists. Thus, this study is expected to be beneficial to designers when developing active visibility aid clothing for cyclists.

The purpose of this paper is to propose a new hybrid approach based on bibliometrics analysis (BA), morphology analysis (MA) and conjoint analysis (CA) to help identify new technology development opportunities.

A new hybrid approach based on BA, MA and CA has been conducted to help identify new technology development opportunities. The proposed hybrid process is illustrated with a case example of blue light‐emitting diode (LED) based on GaN.

In this paper, the proposed hybrid process is illustrated with a case example of document information from a blue light‐emitting diode (LED) based on GaN documents database. The results show that the configuration “Al₂O₃+MBE+two dimensional photonic crystal” should be given greater attention with respect to R&D activities in future.

This paper is of interest for technology opportunities analysis practitioners and policymakers at the industrial and government levels.

This paper proposes a new hybrid approach of technology opportunities analysis based on bibliometrics analysis, morphology analysis and conjoint analysis methods.

In general, lighting application, white light emitting diode (LED) usually exposed to an extreme operating temperature of above 90°C. It is well-known that luminous efficacy and spectral characteristic of white LED are dependent on the temperature, causing thermal effects on luminous efficacy and color shift of white LED become a critical application checkpoint to be addressed by white LED manufactures. Thus, the purpose of this paper is to minimize the thermal stability issue affecting white LED luminescence during operation by introducing phosphor sedimentation process.

The LED samples were assembled and sent for centrifugation with 0, 5 and 10 revolutions per second (rps), respectively, during phosphor sedimentation process. Luminescence properties of these LED samples were then characterized at a varying temperature to investigate the effect of phosphor sedimentation on the luminescence stability of LED samples. The LED samples were also cross-sectioned and analyzed to understand the phosphor sedimentation mechanism. Computational fluid dynamics (CFD) was applied to study the temperature distribution of the non-phosphor sediment (NPS) and phosphor sediment (PS) LED during operation to validate the hypotheses based on experimental data.

Experimental results show that the luminous intensity of PS LED samples degrades less significant at high temperature. The experimental results also show that the color coordinate for PS LED samples is more stable and is less blue-shifted than NPS LED samples as the temperature increased. These are because the heat generated by phosphor particles during operation can be dissipated effectively throughout a high thermal conductivity substrate after phosphor sedimentation. Thus, the phosphor temperature of PS LED is lower than NPS LED during operation as validated with the thermal simulation.

The study of this paper is applicable as a reference for industries who intend to resolve the thermal stability of white LED during operation. The luminescence properties changes as a function of the temperature study in this paper can be used to predict the application performances of white LED accurately. Apart from that, the analysis method of temperature distribution using CFD simulations can be extended by other CFD users in the future.

Implementation of phosphor sedimentation to reduce thermal instability issue of white LED has yet to be reported on previous studies. Most literature just studied the thermal instability issue of either assembled LED or raw material, without suggesting any solution to tackle the issue.

The purpose of this paper is to present a new method of measuring thermal resistance of power light-emitting diodes (LEDs). Properties of power LEDs strongly depend on their internal temperature. The value of this temperature depends on the cooling conditions characterized by thermal resistance.

The new method of measuring the value of this parameter belongs to the group of electric methods. In this method, the problem of estimating the value of electrical power converted into light is solved. By comparing the values of the case temperature obtained for the LED operating in the forward mode and the reverse-breakdown mode, the thermal power is estimated. On the basis of the measured value of the thermally sensitive parameter (the LED forward voltage) and the estimated value of the thermal power, thermal resistance is calculated.

The elaborated method was used to measure thermal resistance of the selected types of power LEDs operating at different cooling conditions. The correctness of the elaborated measurement method was proved by comparing the results of measurements obtained with the use of the new method and the infrared method.

On the basis of the obtained results of measurements and the catalog data of the tested diodes, the dependence of the measurement error of thermal resistance of the LED on its luminous efficiency is discussed.

The new measurement method is easy to use and more accurate than the classical method of thermal resistance measurement of the diode.