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Article
Publication date: 22 October 2010

Jianbiao Li, Guangrong Wang, Juan Sun and Gulin Liu

The purpose of this paper is to investigate the relationship among ownership structure, information disclosure and benefits of control under Lab‐experimental frame, based…

Abstract

Purpose

The purpose of this paper is to investigate the relationship among ownership structure, information disclosure and benefits of control under Lab‐experimental frame, based on the ownership structure in China's stock market.

Design/methodology/approach

Theoretical Shapley value of shareholders was used as the representative of control right, and benefits of control in different experimental treatments were studied.

Findings

Experimental results show: first, more counterbalance of shareholders' control rights, less benefits of their control right. Accordingly, more chance to form core alliance for the major shareholder with small shareholders, less chance for them to get control right; second, the effect of information on benefits of control are mainly reflected in forming and maintaining the alliance; third, Shapley value of the major shareholder and the information determine the alliance type; fourth, control premium may be the cost of keeping the major shareholder's benefits safe and fifth, imperfect information is not always bad, concealing information partly can improve the distribution efficiency of a corporation.

Originality/value

The paper provides experimental analysis of the behavioral logic behind the benefits of control, which would help to explain the relationship among ownership structure, information disclosure and benefits of control.

Details

Nankai Business Review International, vol. 1 no. 4
Type: Research Article
ISSN: 2040-8749

Keywords

Article
Publication date: 4 June 2010

Li Weian, Li Xiaoyi and Li Jianbiao

The purpose of this paper is to focus on the characteristics, efficiencies and interaction of many alternative market governance modes, by the approach of comparative…

Abstract

Purpose

The purpose of this paper is to focus on the characteristics, efficiencies and interaction of many alternative market governance modes, by the approach of comparative institutional experimentation.

Design/methodology/approach

First, a highly simplified model of market economy is developed, which is embedded in a three‐layer governance structure. Then the model is transplanted into laboratory experimentation, so the characteristics and efficiencies of different governance modes can be identified by observing the subjects' behaviors under them.

Findings

The experimental results show that the market with governance structure based on rule is more efficient than the market with governance only based on long relation and based on preference or belief, and the dynamic improvement of governance based on rule has a destructive effect on the governance based on relation and governance based on preference or belief.

Originality/value

These results have profound implications for the development or enhancement of market institutions in transition or developing countries.

Details

Nankai Business Review International, vol. 1 no. 2
Type: Research Article
ISSN: 2040-8749

Keywords

Article
Publication date: 1 June 2012

Li Jianbiao, Liu Guilin and Ju Long

The purpose of this paper is to better depict the features of individual and group behaviors in sequential decisions under the effect of public belief drift.

Abstract

Purpose

The purpose of this paper is to better depict the features of individual and group behaviors in sequential decisions under the effect of public belief drift.

Design/methodology/approach

In this paper, the authors design a two‐shots game which is closer to decisions condition in the real market by using the method of experimental economics two shots game.

Findings

The experimental results show that information cascade occurs more frequently in the second stage and the decision accuracy is decreased. The conclusion may provide experimental evidence for the “Animal Spirits Theory” of Keynes. Additionally, decision‐maker ranking in the middle of the decision sequence systematically deviates from his/her private information in balance state.

Originality/value

As existing information cascade theory of one shot decision fails to describe the belief‐dependent mechanism, the authors design the multi‐shots information cascade experiment; in which every individual decision maker has more than one sequential decision chance on the same event.

Details

Nankai Business Review International, vol. 3 no. 2
Type: Research Article
ISSN: 2040-8749

Keywords

Article
Publication date: 18 September 2009

Jianbiao Pan, Tzu‐Chien Chou, Jasbir Bath, Dennis Willie and Brian J. Toleno

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC…

Abstract

Purpose

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

Design/methodology/approach

A four‐factor factorial design with three replications is selected in the experiment. The input variables are the peak temperature, the duration of time above solder liquidus temperature (TAL), solder alloy and thermal shock. The peak temperature has three levels, 12, 22 and 32°C above solder liquidus temperatures (or 230, 240 and 250°C for SAC305 and 195, 205, and 215°C for SnPb). The TAL has two levels, 30 and 90 s. The thermally shocked test vehicles are subjected to air‐to‐air thermal shock conditioning from −40 to 125°C with 30 min dwell times (or 1 h/cycle) for 500 cycles. Samples both from the initial time zero and after thermal shock are cross‐sectioned. The IMC thickness is measured using scanning electron microscopy. Statistical analyses are conducted to compare the difference in IMC thickness growth between SAC305 solder joints and SnPb solder joints, and the difference in IMC thickness growth between after thermal shock and after thermal aging.

Findings

The IMC thickness increases with higher reflow peak temperature and longer time above liquidus. The IMC layer of SAC305 soldered joints is statistically significantly thicker than that of SnPb soldered joints when reflowed at comparable peak temperatures above liquidus and the same time above liquidus. Thermal conditioning leads to a smoother and thicker IMC layer. Thermal shock contributes to IMC growth merely through high‐temperature conditioning. The IMC thickness increases in SAC305 soldered joints after thermal shock or thermal aging are generally in agreement with prediction models such as that proposed by Hwang.

Research limitations/implications

It is still unknown which thickness of IMC layer could result in damage to the solder.

Practical implications

The IMC thickness of all samples is below 3 μm for both SnPb and SAC305 solder joints reflowed at the peak temperature ranging from 12 to 32°C above liquidus temperature and at times above liquidus ranging from 30 to 90 s. The IMC thickness is below 4 μm after subjecting to air‐to‐air thermal shock from −40 to 125°C with 30 min dwell time for 500 cycles or thermal aging at 125°C for 250 h.

Originality/value

The paper reports experimental results of IMC thickness at different thermal conditions. The application is useful for understanding the thickness growth of the IMC layer at various thermal conditions.

Details

Soldering & Surface Mount Technology, vol. 21 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 18 September 2009

Martin Goosey

248

Abstract

Details

Soldering & Surface Mount Technology, vol. 21 no. 4
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 25 February 2019

Dániel Straubinger, Attila Géczy, András Sipos, András Kiss, Dániel Gyarmati, Oliver Krammer, Dániel Rigler, David Bušek and Gábor Harsányi

This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD…

Abstract

Purpose

This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries. The investigation involves a numerical approach and a physical validation with selected geometry configurations and high current loads to reveal possible failure sources. The work is a continuation of a previous study.

Design/methodology/approach

Current density was investigated using finite element modeling on BGA joints. Dummy BGA components, 0402 and 0603 zero ohm jumper resistors, were used, both in daisy chain setups on standard FR4 printed circuit boards (PCBs). Respective physical loading experiments were set to find effects of elevated current density at hot zones of the joints. Cross-section analysis, scanning electron microscopy and shear force tests were used to analyze the joints.

Findings

The findings reveal alterations in the joints, while the current loading is not directly affecting the structure. The modeling reveals the current density map in the selected formations with increased current crowding zones. Overall, the degradation does not reach the level of electromigration (EM)-induced voiding due to the limiting factor of the FR4 substrate.

Practical implications

The heavy current load affects joint reliability, but there are limitations of EM-induced failures on PCB-based assemblies due to the thermomechanical weakness of the FR4 material.

Originality/value

The experiments investigate current density from a novel aspect on frequently used BGA surface mounted components with modeling configurations focusing on possible effects of via-in-pad structure.

Details

Circuit World, vol. 45 no. 1
Type: Research Article
ISSN: 0305-6120

Keywords

Case study
Publication date: 1 September 2016

Feng Tianjun, Zhang Chunyi and He Jiani

Established in 2010, Mellower Coffee has 40 exquisite chain stores and three branches, namely Mellower Coffee Sales, Mellower Business Management and Shanghai Mellower…

Abstract

Established in 2010, Mellower Coffee has 40 exquisite chain stores and three branches, namely Mellower Coffee Sales, Mellower Business Management and Shanghai Mellower Roasting Factory. Positioned as a premium coffee brand in China, Mellower Coffee has realized the integrated operation and management of the whole industrial chain from raw coffee trade, roasting factory, coffee retail products, specialty coffee chain, office coffee to coffee academy. It has a vision to attract and cultivate more and more coffee lovers by constant innovation coffee culture promotion.

Details

Management School, Fudan University, vol. no.
Type: Case Study
ISSN: 2632-7635
Published by: Management School, Fudan University

Keywords

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