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1 – 10 of 13
Article
Publication date: 1 August 2016

Jan Macioszczyk, Karol Malecha and Leszek J. Golonka

The purpose of this paper is a presentation of a miniature vertical dielectric barrier discharge (DBD) plasma generators. The presented devices, with sub- and superstrate…

Abstract

Purpose

The purpose of this paper is a presentation of a miniature vertical dielectric barrier discharge (DBD) plasma generators. The presented devices, with sub- and superstrate, were made using low temperature co-fired ceramics (LTCC). Such construction allowed to measure discharge spectra and device temperature easily.

Design/methodology/approach

The generators were made in the Du Pont 951 system with silver vertical metallizations and PdAg contacts. The devices had electrodes with different width and height. Also, the distance between them could be established. They were placed on substrate with buried temperature sensor and covered with a ceramic lid. The lid had opening to measure emitted light. Different configurations of vertical DBD were tested.

Findings

Geometry of vertical metallizations influences on spectra, as well as distance between them. Signal-to-noise ratio had a maximum for certain generators and can be measured by the intensity of highest peak.

Research limitations/implications

Height of vertical metallizations is limited by the difference in shrinkage of LTCC tape and via paste. Parameters of temperature sensors vary between measurements, according to rapid changes of temperature and presence of strong electric field.

Practical implications

The generators can be used for creating discharge for optical emission spectrometry. It is a convenient method to determine the amount of selected gas compounds.

Originality/value

This paper shows fabrication and performance of the novel vertical DBD generators with ceramic additions for convenient spectra measurement and monitoring temperature of the device during work.

Details

Microelectronics International, vol. 33 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Content available
Article
Publication date: 1 August 2001

141

Abstract

Details

Microelectronics International, vol. 18 no. 2
Type: Research Article
ISSN: 1356-5362

Article
Publication date: 1 August 1998

Reinhard Bauer, Leszek J. Golonka, Torsten Kirchner, Karol Nitsch and Heiko Thust

Thermal properties of Pt or RuO2 thick‐film heaters made on alumina, aluminum nitride or low temperature co‐fired ceramics (LTCC) were compared in the first step of our…

Abstract

Thermal properties of Pt or RuO2 thick‐film heaters made on alumina, aluminum nitride or low temperature co‐fired ceramics (LTCC) were compared in the first step of our work. Special holes to improve the heat distribution were included. Several heater layouts were analysed. The heat distribution was measured by an infrared camera, at different heating power. Second, the optimization of LTCC constructions was carried out. The simple structure of LTCC permitted the achievement of a high package density. It was possible to integrate a heating element made from special thick‐film ink as a buried film, inside a substrate. An important step in our technology was the making of the holes. A pattern of holes (achieved by punching or laser cutting) around the heating area permitted a changeable heat gradient. The quality of lamination and the structure of the buried elements were investigated with an ultrasonic microscope.

Details

Microelectronics International, vol. 15 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 December 2002

Jaroslaw Kita, Andrzej Dziedzic, Leszek J. Golonka and Tomasz Zawada

This paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special…

Abstract

This paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special software was used. It was applied successfully for fabrication of vias (minimum diameter – 50 μm) in fired and unfired LTCC ceramics and channels with width between 100 μm and 5 mm. The achievements and problems are presented and discussed. The influence of lamination process on quality of vias and channels as well as the problems connected with interaction of laser beam with ceramic tapes are shown. Three‐dimensional resistors and microfluidic system were successfully designed and fabricated based on our investigations. Chosen electrical and thermal parameters of constructed devices are shown, too.

Details

Microelectronics International, vol. 19 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Open Access
Article
Publication date: 12 May 2020

Tomasz Matusiak, Krzysztof Swiderski, Jan Macioszczyk, Piotr Jamroz, Pawel Pohl and Leszek Golonka

The purpose of this paper is to present a study on miniaturized instruments for analytical chemistry with a microplasma as the excitation source.

Abstract

Purpose

The purpose of this paper is to present a study on miniaturized instruments for analytical chemistry with a microplasma as the excitation source.

Design/methodology/approach

The atmospheric pressure glow microdischarge could be ignited inside a ceramic structure between a solid anode and a liquid cathode. As a result of the cathode sputtering of the solution, it was possible to determine its chemical composition by analyzing the emission spectra of the discharge. Cathodes with microfluidic channels and two types of anodes were constructed. Both types were tested through experimentation. Impact of the electrodes geometry on the discharge was established. A cathode aperture of various sizes and anodes made from different materials were used.

Findings

The spectroscopic properties of the discharge and its usefulness in the analysis depended on the ceramic structure. The surface area of the cathode aperture and the flow rate of the solution influence on the detection limits (DLs) of Zn and Cd.

Originality/value

Constructed ceramic structures were able to excite elements and their laboratory-size systems. During the experiments, Zn and Cd were detected with DLs 0.024 and 0.053 mg/L, respectively.

Details

Sensor Review, vol. 40 no. 4
Type: Research Article
ISSN: 0260-2288

Keywords

Open Access
Article
Publication date: 16 July 2020

Tomasz Matusiak, Arkadiusz Dabrowski and Leszek Golonka

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

Abstract

Purpose

The purpose of this paper is to present the properties of thick-film resistors made of novel pastes prepared from glass and graphite.

Design/methodology/approach

Graphite-based resistors were made of thick-film pastes with different graphite-to-glass mass fraction were prepared and examined. Sheet resistance, temperature coefficient of resistance, impact of humidity and short-term overload were investigated. The properties of the layers fired in atmospheres of air at 550°C and nitrogen at 875°C were compared.

Findings

Graphite-based resistors with various graphite-to-glass ratios made possible to obtain a wide range of sheet resistance from single O/square to few kO/square. These values were dependent on firing atmosphere, paste composition and the number of screen-printed layers. The samples made of paste with 1:1 graphite-to-glass ratio exhibited the temperature coefficient of resistance of about −1,000 ppm/°C, almost independently on the firing atmosphere and presence of a top coating. The resistors fired in the air after coating with overglaze, exhibited significantly lower sheet resistance, reduced impact of humidity and improved power capabilities.

Originality/value

In this paper, graphite-based resistors for applications in typical high-temperature cermet thick-film circuits were presented, whereas typical graphite-based resistors were fabricated in polymer thick-film technology. Owing to very low cost of the graphite, the material is suitable for low-power passive circuits, where components are not subjected into high temperature, above the typical temperature of operation of standard electronic components.

Details

Circuit World, vol. 47 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

Article
Publication date: 2 July 2018

Arkadiusz Dabrowski, Przemyslaw Rydygier, Mateusz Czok and Leszek Golonka

The purpose of this study was to design, fabricate and test devices based on transformers integrated with low-temperature co-fired ceramic (LTCC) modules with isolation…

Abstract

Purpose

The purpose of this study was to design, fabricate and test devices based on transformers integrated with low-temperature co-fired ceramic (LTCC) modules with isolation between primary and secondary windings at the level between 6 and 12 kV.

Design/methodology/approach

Insulating properties of the LTCC were examined. Dielectric strength and volume resistivity were determined for common LTCC tapes: 951 (DuPont), 41020, 41060 (ESL), A6M (Ferro) and SK47 (KEKO). According to the determined properties, three different devices were designed, fabricated and tested: a compact DC/DC converter, a galvanic separator for serial digital bus and a transformer for high-voltage generator.

Findings

Breakdown field intensity higher than 40 kV/mm was obtained for the test samples set, whereas the best breakdown field intensity of about 90 kV/mm was obtained for 951 tape. The materials 41020 and 951 exhibited the highest volume resistivity. Fabricated devices exhibited safe operation up to a potential difference of 10 kV, limited by minimum clearance. Long-term stability was assured by over 20 kV strength of inner dielectric.

Practical implications

This paper contains description of three devices made in the LTCC technology for application in systems with high-voltage isolation requirement, for example, for power or railway power networks.

Originality/value

The results show that LTCC is a suitable material for fabrication of high-voltage devices with integrated passives. Technology and properties of three examples of such devices are described, demonstrating the ability of the LTCC technology for application in reliable high-voltage devices and systems.

Details

Microelectronics International, vol. 35 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 1 September 2006

Marko Hrovat, Darko Belavič, Jaroslaw Kita, Janez Holc, Silvo Drnovšek, Jena Cilenšek, Leszek Golonka and Andrzej Dziedzic

Aims to evaluate different thick‐film materials for use in strain sensors and temperature sensors on low‐temperature co‐fired ceramic (LTCC) substrates.

1381

Abstract

Purpose

Aims to evaluate different thick‐film materials for use in strain sensors and temperature sensors on low‐temperature co‐fired ceramic (LTCC) substrates.

Design/methodology/approach

LTCC materials are sintered at the low temperatures typically used for thick‐film processing, i.e. around 850°C, The thick‐film resistor materials for use as strain and temperature sensors on LTCC tapes are studied. Thick‐film piezo‐resistors in the form of strain‐gauges are realised with 10 kΩ/sq. 2041 (Du Pont)and 3414‐B (ESL), resistor materials; thick‐film temperature‐dependent resistors were made from PTC 5093 (Du Pont), and NTC‐4993 (EMCA Remex) resistor materials.

Findings

The X‐ray spectra of the 2041 and 3414‐Bb low TCR resistors after drying at 150°C and after firing display more or less the same peaks. The electrical characteristics of 2041 resistors fired on alumina and LTCC substrates are similar indicating that the resistors are compatible with the LTCC material. After firing on LTCC substrates the sheet resistivities and TCRs of the 3414‐B resistors increased. Also, there is a significant increase in the GFs from 13 to over 25.

Originality/value

Investigates the compatibility of thick‐film materials and the characteristics of the force and temperature sensors.

Details

Microelectronics International, vol. 23 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 4 August 2014

Beata Barteczka, Piotr Slobodzian, Arkadiusz Dabrowski and Leszek Golonka

The purpose of this paper was to investigate the influence of non-uniform temperature distribution inside a box furnace during the firing process on electrical properties…

Abstract

Purpose

The purpose of this paper was to investigate the influence of non-uniform temperature distribution inside a box furnace during the firing process on electrical properties of the low-temperature co-fired ceramic (LTCC) materials used in radio frequency (RF)/microwave applications.

Design/methodology/approach

The authors studied the change in dielectric constant of two popular LTCC materials (DP 951 and DP 9K7) depending on the position of their samples inside the box furnace. Before firing of the samples, temperature distribution inside the box furnace was determined. The dielectric constant was measured using the method of two microstrip lines.

Findings

The findings showed that non-uniform temperature distribution with spatial difference of 6°C can result in 3-4 per cent change of the dielectric constant. It was also found that dielectric constant of the two tested materials shows disparate behavior under the same temperature distribution inside the box furnace.

Practical implications

The dielectric constant of the substrate materials is crucial for RF/microwave applications. Therefore, it was shown that 3-4 per cent deviation in dielectric constant can result in considerable detuning of microwave circuits and antennas.

Originality/value

To the best of the authors’ knowledge, the quantitative description of the impact of temperature distribution inside a box furnace on electrical properties of the LTCC materials has never been published in the open literature. The findings should be helpful when optimizing production process for high yield of reliable LTCC components like filters, baluns and chip antennas.

Details

Microelectronics International, vol. 31 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 4 August 2014

Arkadiusz Dabrowski, Karl Elkjaer, Louise Borregaard, Tomasz Zawada and Leszek Golonka

The purpose of this paper is to develop the device made of low temperature co-fired ceramics (LTCC) and lead zirconate titanate (PZT) by co-firing both materials. In the…

Abstract

Purpose

The purpose of this paper is to develop the device made of low temperature co-fired ceramics (LTCC) and lead zirconate titanate (PZT) by co-firing both materials. In the paper, the technology and properties of a miniature uniaxial ceramic accelerometer are presented.

Design/methodology/approach

Finite element method (FEM) is applied to predict properties of the sensor vs main dimensions of the sensor. The LTCC process is applied during manufacturing of the device. All the advantages of the technology are taken into account during designing three-dimensional structure of the sensor. The sensitivity and resonant frequency of the accelerometer are measured. Real material parameters of PZT are estimated according to measurement results and FEM simulations.

Findings

The ceramic sensor integrated with SMD package with outer dimensions of 5 × 5 × 5 mm3 is manufactured. The accelerometer exhibits sensitivity of 0.75 pC/g measured at 100 Hz. The resonant frequency is equal to about 2 kHz. Useful frequency range is limited by 3 dB sensitivity change at about 1 kHz.

Research limitations/implications

Sensitivity of the device is limited by interaction between LTCC and PZT materials during co-firing process. The estimated d parameters are ten times worse comparing to bulk Pz27 material. Further research on materials compatibility should be carried out.

Practical implications

The sensor can be easily integrated into various devices made of standard electronic printed circuit boards (PCBs). Applied method of direct integration of piezoelectric transducers with LTCC material enables manufacturing of complex ceramic systems with built-in accelerometer in the substrate.

Originality/value

The accelerometer is a sensor and a package simultaneously. The miniature ceramic device is compatible with surface mounting technology; hence, it can be used directly on PCBs for vibration monitoring inside electronic devices and systems.

Details

Microelectronics International, vol. 31 no. 3
Type: Research Article
ISSN: 1356-5362

Keywords

1 – 10 of 13