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The purpose of this paper is to propose a leakage reduction technique which will works for complementary metal oxide semiconductor (CMOS) and fin field effect transistor (FinFET). Power consumption will always remain one of the major concerns for the integrated circuit (IC) designers. Presently, leakage power dominates the total power consumption, which is a severe issue. It is undoubtedly clear that the scaling of CMOS revolutionizes the IC industry. Still, on the contrary, scaling of the size of the transistor has raised leakage power as one of the significant threats to the IC industry. Scaling of the devices leads to the scaling of other device parameters, which includes threshold voltage also. The scaling of threshold voltage leads to an exponential increase in the sub-threshold current. So, many leakage reduction techniques have been proposed by researchers for CMOS from time to time. Even the other nano-scaled devices such as FinFET, carbon nanotube field effect transistor and tunneling field effect transistor, have been introduced, and FinFET is the one which has evolved as the most favorable candidate for replacing CMOS technology.

Because of its minimum leakage and without having limitation of the short channel effects, it gradually started replacing the CMOS. In this paper, the authors have proposed a technique for leakage reduction for circuits using nano-scaled devices such as CMOS and FinFET. They have compared the proposed PMOS FOOTER SLEEP with the existing leakage reduction techniques such as LECTOR technique, LECTOR FOOTER SLEEP technique. The proposed technique has been implemented using CMOS and FinFET devices. This study found that the proposed method reduces the average power, as well as leakage power reduction, for both CMOS and FinFET devices.

This study found that the proposed method reduces the average power as well as leakage power reduction for both CMOS and FinFET devices. The delay has been calculated for the proposed technique and the existing techniques, which verifies that the proposed technique is suitable for high-speed circuit applications. The authors have implemented higher order gates to verify the performance of the proposed circuit. The proposed method is suitable for deep-submicron CMOS technology and FinFET technology.

All the existing techniques were proposed for either CMOS device or FinFET device, but the authors have implemented all the techniques with both the devices and verified with the proposed technique for CMOS as well as FinFET devices.

This paper aims to propose a new sleep signal controlled footless domino circuit for reducing the subthreshold and gate oxide leakage currents.

In the proposed circuit, a P channel MOSFET (PMOS) sleep switch transistor is inserted between the power supply and the output node. The sleep transistor, the source of the pull-down network, and the source of the N channel MOSFET (NMOS) transistor of the output inverter are controlled by this additional sleep signal to place the footless domino circuit in a low leakage state.

The authors simulate the proposed circuit by using HSPICE in 45-nm CMOS technology for OR and AND logic gates such as OR2, OR4, OR8, AND2 and AND4 at 25°C and 110°C. The proposed circuit reduces leakage power consumption as compared to the existing circuits.

The proposed circuit significantly reduces the total leakage power consumption up to 99.41 and 99.51 per cent as compared to the standard dual-threshold voltage footless domino circuits at 25°C and 110°C, respectively, and up to 93.79 and 97.98 per cent as compared to the sleep control techniques at 25°C and 110°C, respectively. Similarly, the proposed circuit reduces the active power consumption up to 26.76 and 86.25 per cent as compared to the standard dual-threshold voltage and sleep control techniques footless domino circuits at 25°C and 110°C, respectively.

This paper is an unprecedented effort to resolve the performance issue of very large scale integrated circuits (VLSI) interconnects encountered because of the scaling of device dimensions. Repeater interpolation technique is an effective approach for enhancing speed of interconnect network. Proposed buffers as repeater are modeled by using dual chirality multi-V_t technology to reduce delay besides mitigating average power consumption. Interconnects modeled with carbon nanotube (CNT) technology are compared with copper interconnect for various lengths. Buffer circuits are designed with both CNT and metal oxide semiconductor technology for comparison by using various combination of (CMOSFET repeater-Cu interconnect) and (CNTFET repeater-CNT interconnect). Compared to conventional buffer, ProposedBuffer1 saves dynamic power by 84.86%, leakage power by 88% and offers reduction in delay by 72%. ProposedBuffer2 brings about dynamic power saving of 99.94%, leakage power saving of 93%, but causes delay penalty. Simulation using Stanford SPICE model for CNT and silicon-field effective transistor berkeley short-channel IGFET Model4 (BSIM4) predictive technology model (PTM) for MOS is done in H simulation program with integrated circuit emphasis for 32 nm.

Usually, the dynamic power consumption dominates the total power, while the leakage power has a negligible effect. But with the scaling of device technology, leakage power has become one of the important factors of consideration in low power design techniques. Various strategies are explored to suppress the leakage power in standby mode. The adoption of a multi-threshold design strategy is an effective approach to improve the performance of buffer circuits without compromising on the delay and area overhead. Unlike MOS technology, to implement multi-V_t transistors in case of CNT technology is quite easy. It can be achieved by varying diameter of carbon nanotubes using chirality control.

An unprecedented approach is taken for optimizing the delay and power dissipation and hence drastically reducing energy consumption by keeping proper harmony between wire technology and repeater-buffer technology. This paper proposes two novel ultra-low power buffers (PB1 and PB2) as repeaters for high-speed interconnect applications in portable devices. PB1 buffer implemented with high-speed CML technique nested with multi-threshold (V_t) technology sleep transistor so as to improve the speed along with a reduction in standby power consumption. PB2 is judicially implemented by inserting separable sized, dual chirality P type carbon nanotube field effective transistors. The HSpice simulation results justify the correctness of schemes.

Result analysis points out that compared to conventional Cu interconnect, the CNT interconnects paired with Proposed CNTFET buffer designs are more energy efficient. PB1 saves dynamic power by 84.86%, reduces propagation delay by 72% and leakage power consumption by 88%. PB2 brings about dynamic power saving of 99.4%, leakage power saving of 93%, with improvement in speed by 52%. This is mainly because of the fact that CNT interconnect offers low resistance and CNTFET drivers have high mobility and ballistic mode of operation.

Major area of a die is consumed in memory components. Almost 60-70% of chip area is being consumed by “Memory Circuits”. The dominant memory in this market is SRAM, even though the SRAM size is larger than embedded DRAM, as SRAM does not have yield issues and the cost is not high as compared to DRAM. At the same time, the other attractive feature for the SRAM is speed, and it can be used for low power applications. CMOS SRAM is the crucial component in microprocessor chips and applications, and as the said major portion of the area is dedicated to SRAM arrays, CMOS SRAM is considered to be the stack holders in the memory market. Because of the scaling feature of CMOS, SRAM had its hold in the market over the past few decades. In recent years, the limitations of the CMOS scaling have raised so many issues like short channel effects, threshold voltage variations. The increased thrust for alternative devices leads to FinFET. FinFET is emerging as one of the suitable alternatives for CMOS and in the region of memory circuits.

In this paper, a new 11 T SRAM cell using FinFET technology has been proposed, the basic component of the cell is the 6 T SRAM cell with 4 NMOS access transistors to improve the stability and also makes it a dual port memory cell. The proposed cell uses a header scheme in which one extra PMOS transistor is used which is biased at different voltages to improve the read and write stability thus, helps in reducing the leakage power and active power.

The cell shows improvement in RSNM (read static noise margin) with LP8T by 2.39× at sub-threshold voltage 2.68× with D6T SRAM cell, 5.5× with TG8T. The WSNM (write static noise margin) and HM (hold margin) of the SRAM cell at 0.9 V is 306 mV and 384  mV. It shows improvement at sub-threshold operation also. The leakage power is reduced by 0.125× with LP8T, 0.022× with D6T SRAM cell, TG8T and SE8T. The impact of process variation on cell stability is also discussed.

The FinFet has been used in place of CMOS even though the FinFet has been not been a matured technology; therefore, pdk files have been used.

SRAM cell has been designed which has good stability and reduced leakage by which we can make an array and which can be used as SRAM array.

The cell can be used for SRAM memory for low power consumptions.

The work has been done by implementing various leakage techniques to design a stable and improved SRAM cell. The advantage of this work is that the cell has been working for low voltage without degrading the stability factor.

The purpose of this paper is to design a low power clock gating technique using Galeor approach by assimilated with replica path pulse triggered flip flop (RP-PTFF).

In the present scenario, the inclination of battery for portable devices has been increasing tremendously. Therefore, battery life has become an essential element for portable devices. To increase the battery life of portable devices such as communication devices, these have to be made with low power requirements. Hence, power consumption is one of the main issues in CMOS design. To reap a low-power battery with optimum delay constraints, a new methodology is proposed by using the advantages of a low leakage GALEOR approach. By integrating the proposed GALEOR technique with conventional PTFFs, a reduction in power consumption is achieved.

The design was implemented in mentor graphics EDA tools with 130 nm technology, and the proposed technique is compared with existing conventional PTFFs in terms of power consumption. The average power consumed by the proposed technique (RP-PTFF clock gating with the GALEOR technique) is reduced to 47 per cent compared to conventional PTFF for 100 per cent switching activity.

The study demonstrates that RP-PTFF with clock gating using the GALEOR approach is a design that is superior to the conventional PTFFs.

The aim of this paper is to formulate the effect of the process variation on various leakage currents and subthreshold swing factor in FinFET devices. These variations cause a large spread in leakage power, since it is extremely sensitive to process variations, which in turn results in larger temperature variations across different dies.

Owing to large temperature variation within the die, the authors investigate the variation of various leakage currents with absolute die temperature.

The results obtained on the basis of the model are compared and contrasted with reported numerical and experimental results. A close match was found which validates the analytical approach.

The analytical modeling of subthreshold leakage current, subthreshold swing, gate leakage current and its variation with process parameters are carried out in this paper.

The performance of the conventional 6T SRAM cell can be improved by using GNRFET devices with multi-threshold technology. The proposed cell shows the strong capability to operate at the minimum supply voltage of 325 mV, whereas the conventional Si-CMOS 6 T SRAM unable to operate below 725 mV, which result in an acceptable failure rate.The advance of Si-CMOS (complementary metal-oxide-semiconductor) based 6 T SRAM cell faces inherent limitation with aggressive downscaling. Hence, there is a need to propose alternatives for the conventional cells.

This study aims to improve the performance of the conventional 6T SRAM cell using dual threshold technology, device sizing, optimization of supply voltage under process variation with GNRFET technology. Further performance can be enhanced by resolving half-select issue.

The GNRFET-based 6T SRAM cell demonstrates that it is capable of continued improve the performance under the process, voltage, and temperature (PVT) variations significantly better than its CMOS counterpart.

Nano-material fabrication technology of GNRFETs is in the early stage; hence, the different transistor models can be used to evaluate the parameters of future GNRFETs circuit.

GNRFET devices are suitable for implementing low power and high density SRAM cell.

The conventional Si-CMOS 6 T SRAM cell is a core component and used as the mass storage element in cache memory in computer system organization, mobile phone and other data storage devices.

This paper presents a new approach to implement an alternative design of GNRFET -based 6T SRAM cell with doped reservoirs that also supports process variation. In addition, multi-threshold technology optimizes the performance of the proposed cell. The proposed design provides a means to analyze delay and power of GNRFET-based SRAM under process variation with considering edge roughness, and offers design and fabrication insights for cell in the future.

The purpose of this paper is to propose a simulation model for studying the lubricating gap between the ring gear and the case in internal gear pumps.

The pressure distribution of the wedge-shaped oil film between the ring gear and the case is obtained based on the theory of film lubrication using the Reynolds equation implemented with MATLAB. After that, the balance of the ring gear is achieved by the radial micro motion of the ring gear. The power loss due to the leakage and the shear stress is then calculated for optimized design of the radial clearance.

The hydrodynamic effect and the squeezing effect of the wedge-shaped oil film play a role in the hydrodynamic balance of the ring gear, and they become more intense when the operating speed gets lower and the pressure gets higher. The optimal radial clearance should stay between 20 and 25 µm for the minimum power loss.

The present research provides the first simulation model that treats the oil film between the ring gear and the case as wedge-shaped oil film and explains why the ring gear stays balanced. Furthermore, the simulation model can be regarded as a tool for optimized design of the radial clearance.

This work is proposed for low power energy-efficient applications like laptops, mobile phones, and palmtops. In this study, P-channel metal–oxide–semiconductor (PMOS)’s are used as access transistor in 7 transistors (7 T) Static Random Access Memory (SRAM) cell, and the theoretical Static Noise Margin (SNM) analysis for the proposed cell is also performed. A cell is designed using 7 T which consists of 4 PMOS and 3 NMOS. In this paper write and hold SNM is addressed and read SNM is also calculated for the proposed 7 T SRAM cell.

The authors have replaced N-channel metal–oxide–semiconductor (NMOS) access transistors with the PMOS access transistors, which results in proper data line recovery and provides the desired coupling. An error is likely to occur, if the read operation is performed too often probably by using the NMOS pass gate. It results in an improper recovery of the data line. Instead, by using PMOS as a pass gate, the time required for read operation can be brought down. As we know the mobility (µ) of the PMOS transistor is low, so the authors have used this property into the proposed design. When a low signal is applied to its control gate, the PMOS transistor come up with the desired coupling, when working as a pass gate.

Feedback switched transistor is used in the proposed circuit, which plays an important role in the write operation. This transistor is in OFF state and PMOS’s work as access transistor, when the proposed cell operating in read mode. This helps in the reduction of power. This work is simulated using UMC 40 nm technology node in the cadence virtuoso environment. The simulated result shows that, write power saving of 51.54% and 61.17%, hold power saving of 25.68% and 48.93% when compared with reported 7 T and 6 T, respectively.

The proposed 7 T SRAM cell provides proper data line recovery at a lower voltage when PMOS works as the access transistor. Power consumption is very less in this technique and it is best suitable for low power applications.

This paper aims to study the lubrication and sealing performance on the textured piston pair under the cross action of the shape and structure parameters. This paper further carries out the optimization design of low energy consumption hydraulic impact piston pair.

Based on the characteristics of the ring gap seal piston pair, the flow field analysis model of the whole film gap is established for its periodic treatment. The friction power loss of the piston pair is defined as the evaluation index of the lubrication performance and the leakage power loss as the evaluation index of the sealing performance. The orthogonal test design and CFD software were used to analyze the lubrication and sealing performance of the textured piston pair.

The cross action of shape and structure factors has a great influence of the lubrication and sealing performance on the textured piston pair. Clearance and shape parameters have great influence on it, while seal length and depth diameter ratio have little influence. The sealing performance of conical textured piston pair is good, while the lubrication performance of square textured piston pair is good. The primary and secondary order of influence of shape and structure on energy consumption on piston pair is B (seal clearance) > C (texture shape) > D (area ratio) > A (seal length) > E (depth diameter ratio).

Breaking the defect of local optimization design on traditional piston pair structure, then find the matching relationship of structural parameters on textured piston pair. Further improve the lubrication and sealing performance of the piston pair, and provide reference for the global optimization design of the low energy consumption hydraulic impact piston pair.