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1 – 10 of 114
Content available
Article
Publication date: 1 December 2004

43

Abstract

Details

Soldering & Surface Mount Technology, vol. 16 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2003

34

Abstract

Details

Soldering & Surface Mount Technology, vol. 15 no. 3
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 September 2005

36

Abstract

Details

Circuit World, vol. 31 no. 3
Type: Research Article
ISSN: 0305-6120

Keywords

Content available
Article
Publication date: 1 April 2003

29

Abstract

Details

Soldering & Surface Mount Technology, vol. 15 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 August 2004

34

Abstract

Details

Soldering & Surface Mount Technology, vol. 16 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 April 2006

35

Abstract

Details

Soldering & Surface Mount Technology, vol. 18 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 June 2005

176

Abstract

Details

Soldering & Surface Mount Technology, vol. 17 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 1 February 2013

Hao Yu and Dongkai Shangguan

As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the…

Abstract

Purpose

As a literature review article, the purpose of this paper is to highlight the intricate interaction and correlation between the interconnection microstructure and the failure mechanism. It is therefore critical to summarize all the challenges in understanding solder solidification of interconnections.

Design/methodology/approach

Literature review.

Findings

Solidification of solder interconnections is therefore critical because it is the process during which the solder interconnection is formed. The as‐solidified microstructure serves as the starting point for all failure modes. Because of the miniaturization of electronics, the interconnection size decreases continuously, already to such a range that solder solidification takes place remarkably differently from the bulk ingot, on which solidification studies have been focused for decades. There are many challenges in understanding the solidification of tiny solder interconnections, including the complex metallurgical system, dynamic solder composition, supercooling and actual solidification temperature, localized temperature field, diverse interfacial IMC formation, and so on, warranting further research investment on solder solidification.

Originality/value

This paper provides a critical overview of the concerns in solidification study for lead‐free solder interconnection. It is probably an article initiating more attention towards solidification topics.

Details

Soldering & Surface Mount Technology, vol. 25 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Content available
Article
Publication date: 1 December 2002

198

Abstract

Details

Soldering & Surface Mount Technology, vol. 14 no. 3
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 1 April 2006

Peng Sun, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan and Johan Liu

To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around…

Abstract

Purpose

To determine the Coffin‐Manson (CM) equation constants for fatigue life estimation of Sn‐8Zn‐3Bi solder joints, since Sn‐8Zn‐3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn‐Pb solder which has previously been used in the electronics assembly industry.

Design/methodology/approach

Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead‐free solder joints, and eutectic Sn‐37Pb solder was used as a reference.

Findings

The CM equation for Sn‐8Zn‐3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833.

Originality/value

The CM equation can now be used to predict the reliability of Sn‐8Zn‐3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn‐Zn solder system has been increased.

Details

Soldering & Surface Mount Technology, vol. 18 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 10 of 114