Search results

1 – 5 of 5
Open Access
Article
Publication date: 12 May 2020

Barbara Dziurdzia, Maciej Sobolewski, Janusz Mikołajek and Sebastian Wroński

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering…

2436

Abstract

Purpose

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

Design/methodology/approach

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

Findings

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

Originality/value

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

Details

Soldering & Surface Mount Technology, vol. 32 no. 4
Type: Research Article
ISSN: 0954-0911

Keywords

Open Access
Article
Publication date: 5 November 2018

Wei Wei Liu, Berdy Weng and Scott Chen

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be…

1477

Abstract

Purpose

The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu3Sn and Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture.

Design/methodology/approach

The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology.

Findings

The Cu6Sn5 intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu3Sn IMC. Cu6Sn5 IMC will convert to Cu3Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu3Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni3Sn4 IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni3Sn4 IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell.

Research limitations/implications

The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design.

Practical implications

This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology.

Originality/value

The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.

Details

PSU Research Review, vol. 3 no. 1
Type: Research Article
ISSN: 2399-1747

Keywords

Open Access
Article
Publication date: 13 October 2022

Marcin Myśliwiec, Ryszard Kisiel and Mirosław J. Kruszewski

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties…

Abstract

Purpose

The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research.

Design/methodology/approach

Mechanical and thermal properties of TIM joints between gold plated contacts of chip and substrate were investigated. Sintering technique based on Ag pastes was applied for purpose of this study. Performance properties were assessed by shear force tests and thermal measurements. Scanning electron microscopy was used for microstructural observations of cross-section of formed joints.

Findings

It was concluded that the best properties are achieved for pastes containing spherical Ag particles of dozens of micrometer size with flake shaped Ag particles of few micrometers size. Sintering temperature at 230°C and application of 1 MPa force on the chip during sintering gave the higher adhesion and the lowest thermal interface resistance.

Originality/value

The new material based on Ag paste containing mixtures of Ag particles of different size (form nanometer to dozens of microns) and shape (spherical, flake) suspended in resin was proposed. Joints prepared using sintering technique and Ag pastes at 230°C with applied pressure shows better mechanical and thermal than other TIM materials such as thermal grease, thermal gel or thermally conductive adhesive. Those material could enable electronic device operation at temperatures above 200°C, currently unavailable for Si-based power electronics.

Details

Microelectronics International, vol. 39 no. 4
Type: Research Article
ISSN: 1356-5362

Keywords

Open Access
Article
Publication date: 28 May 2019

Olanrewaju Ayobami Omoya, Kassandra A. Papadopoulou and Eric Lou

The purpose of this paper is to investigate the application of reliability engineering to oil and gas (O&G) pipeline systems with the aim of identifying means through which…

3031

Abstract

Purpose

The purpose of this paper is to investigate the application of reliability engineering to oil and gas (O&G) pipeline systems with the aim of identifying means through which reliability engineering can be used to improve pipeline integrity, specifically with regard to man-made incidents (e.g. material/weld/equipment failure, corrosion, incorrect operation and excavation damages).

Design/methodology/approach

A literature review was carried out on the application of reliability tools to O&G pipeline systems and four case studies are presented as examples of how reliability engineering can help to improve pipeline integrity. The scope of the paper is narrowed to four stages of the pipeline life cycle; the decommissioning stage is not part of this research. A survey was also carried out using a questionnaire to check the level of application of reliability tools in the O&G industry.

Findings

Data from survey and literature show that a reliability-centred approach can be applied and will improve pipeline reliability where applied; however, there are several hindrances to the effective application of reliability tools, the current methods are time based and focus mainly on design against failure rather than design for reliability.

Research limitations/implications

The tools identified do not cover the decommissioning of the pipeline system. Research validation sample size can be broadened to include more pipeline stakeholders/professionals. Pipeline integrity management systems are proprietary information and permission is required from stakeholders to do a detailed practical study.

Originality/value

This paper proposes the minimum applied reliability tools for application during the design, operation and maintenance phases targeted at the O&G industry. Critically, this paper provides a case for an integrated approach to applying reliability and maintenance tools that are required to reduce pipeline failure incidents in the O&G industry.

Details

International Journal of Quality & Reliability Management, vol. 36 no. 9
Type: Research Article
ISSN: 0265-671X

Keywords

Open Access
Article
Publication date: 31 August 2023

Jingjing Shi, Ning Qian, Honghua Su, Ying Yang and Yiping Wang

The electrical properties of piezoelectric vibrators have a crucial influence on the operating state of ultrasonic motors. In order to solve the problem that the current…

Abstract

Purpose

The electrical properties of piezoelectric vibrators have a crucial influence on the operating state of ultrasonic motors. In order to solve the problem that the current piezoelectric vibrator generates a large amount of heat during vibration to degrade its performance, which in turn affects the normal operation of ultrasonic motors, this paper prepares a novel piezoelectric vibrator and tests its maximum vibration velocity under the working condition, which is more than twice as much as that of the current commercial PZT-8.

Design/methodology/approach

The crystal structures of the samples were analyzed by using an X-ray diffractometer. For microstructure observation, samples were observed by scanning electron microscope (SEM). The quasi-static piezoelectric coefficient meter (ZJ-3AN) was used for piezoelectric measurement. Dielectric properties were measured by utilizing an impedance analyzer (Agilent 4294A) with a laboratory heating unit. Ferroelectric hysteresis loops were obtained using a ferroelectric analyzer (Radiant, Multiferroic 100). A Doppler laser vibrometer (Polytec PSV-300F, Germany) and a power amplifier were used for piezoelectric vibration measurements, during which the temperature rise was determined by an infrared radiation thermometer (Victor 303, China).

Findings

The ceramics exhibit enhanced piezoelectric performance at 0.1–0.4 mol% of Yb doping contents. The ceramic of 0.4 mol% Yb reaches the maximal internal bias field and presents a larger mechanical quality factor of 1,692 compared with that of 0.2 mol% Yb-doped ceramic, in spite of a slightly decreased dielectric constant of 439 pC/N, the unit of the piezoelectric constant, which is the ratio of the local charge (pC) to the frontal force (N) and electromechanical coupling coefficient of 0.63. The vibrator with this large mechanical quality factor ceramic displays a vibration velocity of up to 0.81 m/s under the constraint of 20 °C temperature rising, which is much higher than commercial high-power piezoelectric ceramics PZT-8.

Originality/value

The enhanced high-power properties of the piezoelectric vibrator by Yb doping may provide a potential application for the high-performance USM and offer the possibility of long-term stable operation under high power for special equipment like USM. In the subsequent phase of research, the novel PZT-based high-power piezoelectric vibrator can be utilized in the USM, and the motor's performance will be evaluated under aerospace conditions to objectively assess the reliability of the piezoelectric vibrator.

Details

Journal of Intelligent Manufacturing and Special Equipment, vol. 4 no. 3
Type: Research Article
ISSN: 2633-6596

Keywords

Access

Only Open Access

Year

Content type

1 – 5 of 5