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The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder.

Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution.

It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current.

These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

This study explores how titanium oxide (TiO₂) filler influences the specific wear rate (SWR) in flax fiber-reinforced epoxy composites (FFRCs) through a Taguchi approach. It aims to boost abrasive wear resistance by incorporating TiO₂ filler, promoting sustainable and eco-friendly materials.

This study fabricates epoxy/flax composites with TiO₂ particles (0–8 wt%) using hand layup. Composites were tested for wear following American Society for Testing and Materials (ASTM) G99-05. Statistical analysis used Taguchi design of experiments (DOE), with ANOVA identifying key factors affecting SWR in abrasive sliding conditions.

The study illuminates how integrating TiO2 filler particles into epoxy/flax composites enhances abrasive wear properties. Statistical analysis of SWR highlights abrasive grit size (grit) as the most influential factor, followed by normal load, wt% of TiO₂ and sliding distance. Grit size has the highest effect at 43.78%, and wt% TiO₂ filler contributes 15.61% to SWR according to ANOVA. Notably, the Taguchi predictive model closely aligns with experimental results, validating its reliability.

This paper integrates TiO₂ filler and flax fibers to form a novel hybrid composite with enhanced tribological properties in epoxy composites. The use of Taguchi DOE and ANOVA offers valuable insights for optimizing control variables, particularly in natural fiber-reinforced composites (NFRCs).

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

The purpose of this study is to investigate the impact of titanium oxide (TiO₂) filler on the abrasive wear properties of bamboo fiber reinforced epoxy composites (BFRCs) using a Taguchi approach. The study aims to enhance the abrasive wear resistance of these composites by introducing TiO₂ filler as a potential reinforcement, thus contributing to the development of sustainable and environmentally friendly materials.

This study focuses on the fabrication of epoxy/bamboo composites infused with TiO₂ particles within the Wt.% range of 0–8 Wt.% using hand layup techniques. The resulting composites were subjected to wear testing according to ASTM G99-05 standards. Statistical analysis of the wear results was carried out using the Taguchi design of experiments (DOE). Additionally, an analysis of variance (ANOVA) was used to determine the influential control factors impacting the specific wear rate (SWR) and coefficient of friction (COF).

The study illuminates how integrating TiO₂ filler enhances abrasive wear in epoxy/bamboo composites. Statistical analysis of SWR highlights abrasive grit size (grit) as the most influential factor, followed by normal load, Wt.% of TiO₂ and sliding distance. Analysis of the COF identifies normal load as the primary influential factor, followed by grit, Wt.% of TiO₂ and sliding distance. The Taguchi predictive model closely aligns with experimental results, validating its reliability. The morphological study revealed significant differences between the unfilled and TiO₂-filled composites. The inclusion of TiO₂ improved wear resistance, as evidenced by reduced surface damage and wear debris.

This research paper aims to integrate TiO₂ filler and bamboo fibers to create an innovative hybrid composite material. TiO₂ micro and nanoparticles show promise as filler materials, contributing to improved tribological properties of epoxy composites. The utilization of Taguchi’s DOE and ANOVA for statistical analysis provides valuable guidance for academic researchers and practitioners in optimizing control variables, especially in the context of natural fiber reinforced composites.

This study aims to explore the feasibility of adding Si₃N₄ nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

In this paper, Sn58Bi-xSi₃N₄ (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

The experiment results demonstrate that including Si₃N₄ nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm², raised by 19.41% relative to those without Si₃N₄, and the wetting angle was the smallest at 0.6 Wt.% of Si₃N₄, with a minimum value of 8.35°. When the Si₃N₄ nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si₃N₄ nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si₃N₄ reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si₃N₄ nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

In this paper, Si₃N₄ nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si₃N₄ nanoparticles on Sn58Bi solder were investigated from various aspects.

This paper aims to report the effect of titanium oxide (TiO₂) particles on the physical, mechanical, tribological and water resistance properties of 5% NaOH-treated bamboo fiber–reinforced composites.

In this research, the epoxy/bamboo/TiO₂ hybrid composite filled with 0–8 Wt.% TiO₂ particles has been fabricated using simple hand layup techniques, and testing of the developed composite was done in accordance with the American Society for Testing and Materials (ASTM) standard.

The results of this study indicate that the addition of TiO₂ particles improved the mechanical properties of the developed epoxy/bamboo composites. Tensile properties were found to be maximum for 6 Wt.%, and impact strength was found to be maximum for 8 Wt.% TiO₂ particles-filled composite. The highest flexural properties were found at a lower TiO₂ fraction of 2 Wt.%. Adding TiO₂ filler helped to reduce the water absorption rate. The studies related to the wear and friction behavior of the composite under dry and abrasive wear conditions reveal that TiO₂ filler was beneficial in improving the wear performance of the composite.

This research paper attempts to include both TiO₂ filler and bamboo fibers to develop a novel composite material. TiO₂ micro and nanoparticles are promising filler materials; it helps to enhance the mechanical and tribological properties of the epoxy composites and in literature, there is not much work reported, where TiO₂ is used as a filler material with bamboo fiber–reinforced epoxy composites.

This paper aims to report the effect of titanium oxide (TiO₂) particles on the specific wear rate (SWR) of alkaline treated bamboo and flax fiber-reinforced composites (FRCs) under dry sliding condition by using a robust statistical method.

In this research, the epoxy/bamboo and epoxy/flax composites filled with 0–8 Wt.% TiO₂ particles have been fabricated using simple hand layup techniques, and wear testing of the composite was done in accordance with the ASTM G99-05 standard. The Taguchi design of experiments (DOE) was used to conduct a statistical analysis of experimental wear results. An analysis of variance (ANOVA) was conducted to identify significant control factors affecting SWR under dry sliding conditions. Taguchi prediction model is also developed to verify the correlation between the test parameters and performance output.

The research study reveals that TiO₂ filler particles in the epoxy/bamboo and epoxy/flax composite will improve the tribological properties of the developed composites. Statistical analysis of SWR concludes that normal load is the most influencing factor, followed by sliding distance, Wt.% TiO2 filler and sliding velocity. ANOVA concludes that normal load has the maximum effect of 31.92% and 35.77% and Wt.% of TiO2 filler has the effect of 17.33% and 16.98%, respectively, on the SWR of bamboo and flax FRCs. A fairly good agreement between the Taguchi predictive model and experimental results is obtained.

This research paper attempts to include both TiO₂ filler and bamboo/flax fibers to develop a novel hybrid composite material. TiO₂ micro and nanoparticles are promising filler materials, it helps to enhance the mechanical and tribological properties of the epoxy composites. Taguchi DOE and ANOVA used for statistical analysis serve as guidelines for academicians and practitioners on how to best optimize the control variable with particular reference to natural FRCs.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

Lead is a well-established environmental contaminant that over the last 50 years has become recognized as a neurotoxin with its greatest concern for the developing child (i.e. both in-utero and postnatally). What is problematic is that children exposed to lead often come from lower socioeconomic status (SES), are largely Black communities and are further at increased risk for developing adverse childhood experiences (ACEs). The literature on ACEs had focused much on trauma, single parenting, child abuse, lack of finances and stress, etc., but has not considered the intersectionality of these ACEs as risk factors within environmental neurotoxic exposures such as lead poisoning. This is important as most low SES communities are Black. In particular, within the New York City Housing Authority (NYCHA), Black families have been neglected of proper lead-abatement to their apartments for nearly 70 years.

This is a viewpoint/perspective paper that examines the lived experiences of Black folxs in NYCHA through a Black critical theory (BlackCrit) and antiblackness framework pertaining to ACEs, and lead poisoning within the NYCHA system of New York City. This perspective paper draws upon the last three years of news reports, five decades of publicly available data sets from NYCHA and the comptroller to raise an awareness of how Black children are treated by NYCHA generation after generation which can be argued as a mass atrocity against NYCHA residents. Furthermore, the systematic and institutionalized racism and environmental injustices by NYCHA and the state can also be considered as a crime against humanity. As such, BlackCrit could help to position awareness, advocacy and knowledge about Black folxs residing in NYCHA to achieve fair, safe and affordable public housing to experience Black joy across future generations.

Thus, rather than civic and state government response efforts focusing their full attention and resources to serving and supporting individuals affected by ACEs they should equally consider the environments in which Black people live and also allocate funds proportionally to address these areas often overlooked. Moreover, proportions of these funds should be redirected especially to lead-abatement and removal of known sources of lead exposures, evaluation of suspected sources of lead exposures (i.e. drinking water, baby food and formula, children’s juice and cereal products, superfund and other waste sites, electronic recycling plants, etc.) and accompanied by all affected children undergoing full and comprehensive neuropsychological testing and follow up studies paid for by the state. The goal should have two fundamental objectives: (1) accepting accountability for failing to address these preventable neuropsychological issues directly affecting Black children generation after generation and (2) offering the proper waived or reimbursable supports and resources to help Black children sustain the best quality of life (QOL) trajectory possible when diagnosed with lead poisoning.

The manuscript is a viewpoint/perspective paper grounded in BlackCrit and an antiblackness framework. There are ample public news reports and public data available from NYCHA on these matters over the last three years. However, the scope of this paper was not to delve too deep into these numbers per se, but rather to address the concerns leading up to and arguably contributing to, at least in part, to these numbers of lead-exposed Black children in NYCHA. Lead poisoning has never been considered as an ACE and its relationship to mass atrocity research is novel which may pave a new avenue for research of this kind through the utility of BlackCrit and antiblackness framework to support and advocate for change so that Black children can be provided with a basic human right of safe housing and experience Black joy.

BlackCrit has not been used in the context of lead poisoning research. Mostly individuals and families of middle- and low-income have been studied in the context of poverty and lead poisoning. However, many people who live in poverty, in public housing, within New York are Black. Thus, Black children are generation after generation exposed to unaddressed lead-abatement and it appears that now more than ever BlackCrit should become the framework for how this work should be discussed in the literature to raise awareness to state governments regarding Black folx's persistent lead poisoning, NYCHA's neglect and mass atrocity research as a long overdue advocacy effort to bring the necessary voice, authentic narrative, and actual knowledge of the lived experiences of Black families in NYCHA with lead poisoning.

The goal of this viewpoint/perspective paper should have two fundamental objectives (1) NYCHA and New York State accepting accountability for failing to address these preventable lead poisoning issues directly affecting Black children; and (2) offering the proper support and resources to help Black children sustain the best QOL trajectory possible when diagnosed with lead poisoning.

Lead poisoning research has never been approached through a mass atrocity and BlackCrit framework and perspective. This is the first report on bridging these fields within the context of NYCHA public housing neglect of lead-abatement and continued poisoning of current and future generations of Black children. This failure of NYCHA lead-abatement contributes annually to economic loss in New York State for many years to come which could be entirely avoided.