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An overview of the concerns involved in the operation of electronic hardware at elevated temperatures is presented. Materials selection and package design issues are addressed for a wide range of packaging elements from the semiconductor chip to the box. It is found that most elements of common high density device and packaging architecture can be used up to 200°C. However, gold‐aluminium wirebonds, eutectic tin‐lead solder joints and die attaches, and FR‐4 boards will seriously degrade at temperatures below 200°C. For these elements, alternative materials of construction are recommended. Comparisons are made between package design for high power dissipation and that for high temperature operation.

The study aims to provide a quick-and-robust multifactorial screening technique for early detection of statistically significant effects that could influence a product's life-time performance.

The proposed method takes advantage of saturated fractional factorial designs for organizing the lifetime dataset collection process. Small censored lifetime data are fitted to the Kaplan–Meier model. Low-percentile lifetime behavior that is derived from the fitted model is used to screen for strong effects. A robust surrogate profiler is employed to furnish the predictions.

The methodology is tested on a difficult published case study that involves the eleven-factor screening of an industrial-grade thermostat. The tested thermostat units are use-rate accelerated to expedite the information collection process. The solution that is provided by this new method suggests as many as two active effects at the first decile of the data which improves over a solution provided from more classical methods.

To benchmark the predicted solution with other competing approaches, the results showcase the critical first decile part of the dataset. Moreover, prediction capability is demonstrated for the use-rate acceleration condition.

The technique might be applicable to projects where the early reliability improvement is studied for complex industrial products.

The proposed methodology offers a range of features that aim to make the product reliability profiling process faster and more robust while managing to be less susceptible to assumptions often encountered in classical multi-parameter treatments.

The paper presents an alternative solution to address part obsolescence. This paper discusses approaches to solve part obsolescence including an uprating approach. This paper also describes the methods to uprate parts, and demonstrates the practical application of the uprating approach in the form of a case study.

This paper has been written to provide an understanding of the uprating approach to mitigate the problems caused by part obsolescence. The paper discusses the challenge faced due to part obsolescence, the temperature ratings for electronic parts, the uprating methods and finally explains the use of uprating to mitigate part obsolescence in the form of a case study. The part being uprated is a microcontroller unit used in many avionics applications. The case study describes a particular use of uprating and the return on investment.

Based on the uprating approach, it was discovered that for the particular application, the commercially available plastic quad flat pack microcontroller could be used as a substitute for the “military” ceramic BGA version, which was discontinued by the manufacturer. It was discovered that there would be no problem with the commercial part's quality or reliability for the particular application. Parametric tests showed no evidence of instability of electrical characteristics over the uprated temperature range. There was substantial return on investment due to the use of uprated parts.

This paper can help electronics manufactures deal with part obsolescence. This paper demonstrates the practicality of uprating parts. Uprating can save companies money by reducing the need for life‐time buys, substitution of parts and even redesign.

The paper provides an alternative approach to address the problem of part obsolescence. This paper shows that proper uprating leads to cost saving while continuing to provide reliable service.

The attainment of superior quality and reliability in a manufactured product depends upon the existence of a framework integrating an organization’s capabilities in management, technology and information utilization. With respect to information utilization, statistical tools are particularly essential for optimizing product and process performance. This paper outlines the functions of these tools and examines the steps in which they are adopted by non‐statisticians in industry. A “seven S” approach is explained, highlighting a strategy for the effective deployment of statistical quality engineering.

Military electronics have typically been isolated from mainstream developments due to military unique requirements, specifications and procurement policies. As a consequence, military electronics systems have not profited from many of the commercial technological advancements and the lessons learned. Based on an understanding of this problem, DoD policy directives are now changing, although there are attempts to resist or side‐step implementation. To understand the key issues affecting early affordable access to leading electronics technologies by the US military and government, it is necessary to understand those military and government policies, regulations and organisations that have influenced both directly and indirectly, purposefully and accidentally, electronics effectiveness and worth. This paper provides a perspective to some of the key issues and critical differentiators between US military/government and commercial approaches to electronics.

Since technological lifecycles do not always match hardware/software (HW/SW) lifecycles, obsolescence becomes a major issue in system lifecycle management as it can cause premature and unscheduled replacement of HW/SW subsystems. The purpose of this paper is to report a dynamic model to predict the obsolescence dates for HW/SW subsystems.

The dynamic model estimates obsolescence dates for HW/SW subsystems based on graph theory concept. The model depicts the stages of subsystem obsolescence through transmittances composed of probability and time-distribution elements. The model predicts probability and mean time to obsolescence for line replaceable units (LRUs) over the lifetime of the system. An illustrative example in signaling systems used in a train control system was used to demonstrate the application of this model.

Generally, the short timespan for HW/SW subsystems, which are periodically replaced with newer technologies, results in the development of new product lines by suppliers while they try to support legacy systems for a reasonable period of time. Obsolescence of HW/SW subsystems increases operation and maintenance costs as legacy systems are typically more expensive to maintain. The costs can be reduced by an optimum time to obsolescence derived from the model.

This research adds to the body of knowledge on asset management and maintenance strategy. This paper may be of particular interest to reliability, maintainability and availability practitioners and project managers.

The originality of this paper lies in developing a graph-based model that predicts probability and mean time to obsolescence for LRUs over the lifetime of the system.

Some of the frequently asked questions about the what, why, when, how, where and who of statistical quality engineering are discussed. Questions answered include: “What would be an active approach to the objectives of statistical quality engineering?” “How is statistical quality engineering related to Six Sigma?” The concepts, techniques and illustrations, explained in a non‐mathematical language, are useful to both management and technical personnel interested in strategies and tools for cost‐effective quality improvement.

Current health care quality performance indicators appear to be inadequate to inform the public to make the right choices. The aim of this paper is to define a framework and an organizational setting in which valid and reliable healthcare information can be produced to inform the general public about healthcare quality.

To improve health care quality information, the paper explores the analogy between financial accounting, which aims to produce valid and reliable information to support companies informing their shareholders and stakeholders, and healthcare aiming to inform future patients about healthcare quality. Based on this analogy, the authors suggest a measurement framework and an organizational setting to produce healthcare information.

The authors suggest a five‐quality element framework to structure quality reporting. The authors also indicate the best way to report each type of quality, comparing performance indicators with certification/accreditation. Health gain is the most relevant quality indicator to inform the public, but this information is the most difficult to obtain. Finally, the organizational setting, comparable to financial accounting, required to provide valid, reliable and objective information on healthcare quality is described.

Framework elements should be tested in quantitative studies or case studies, such as a performance indicator's relative value compared to accreditation/ certification. There are, however, elements that can be implemented right away such as third party validation of healthcare information produced by healthcare institutions.

Given the money spent on healthcare worldwide, valid and reliable healthcare quality information's value can never be overestimated. It can justify delivering “expensive” healthcare, but also points the way to savings by stopping useless healthcare. Valid and reliable information puts the patient in the driver's seat and enables him or her to make the right decision when choosing their healthcare provider.

Eliminating lead in electronics is an environmentally considerate approach that is made prior to manufacture. Recently enacted legislation encourages increased recycling of electrical and electronic products. However, recycling is typically an end‐of‐use action occurring just before final disposal. From an environmentally‐considerate perspective, lead elimination or replacement is a better approach. Short of having a definitive study to follow, industry, regulators, and consumers are proceeding with the change. Various lead‐free alloys have been tested and used for electronic components and assemblies. There are many replacements for eutectic tin‐lead solder, and alloys containing tin, silver, copper, and bismuth have been used successfully. Assessing how the electronics industry is addressing the change to lead‐free materials and processes requires answers to various questions. These questions regard the effects of changes to electronic products and their processes. What drives lead‐free migration, how processes can develop, and when products will be available are issues which define the assessment.

This paper seeks to introduce a set of key practices that can be used to assess whether an organization has the ability to design, develop and manufacture reliable electronic products.

The ability to design, develop and manufacture reliable electronic products is defined in the paper in terms of a reliability capability maturity model, which is a measure of the practices within an organization that contribute to the reliability of the final product, and the effectiveness of these practices in meeting the reliability requirements of customers.

The paper presents a procedure for evaluating and benchmarking reliability capability. Criteria for assigning different capability maturity levels are presented. The paper also presents a case study corresponding to reliability capability benchmarking of an electronics company.

The paper provides a set of practices for evaluating and benchmarking reliability capability.