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This paper aims to report a stretchable piezoresistive strain sensor array that can detect various static and dynamic stimuli, including bending, normal force, shear stress and certain range of temperature variation, through sandwiching an array of conductive blocks, made of multiwalled carbon nanotubes (MWCNTs) and polydimethylsiloxane (PDMS) composite. The strain sensor array induces localized resistance changes at different external mechanical forces, which can be potentially implemented as electronic skin.

The working principle is the piezoresistivity of the strain sensor array is based on the tunnelling resistance connection between the fillers and reformation of the percolating path when the PDMS and MWCNT composite deforms. When an external compression stimulus is exerted, the MWCNT inter-filler distance at the conductive block array reduces, resulting in the reduction of the resistance. The resistance between the conductive blocks in the array, on the other hand, increases when the strain sensor is exposed to an external stretching force. The methodology was as follows: Numerical simulation has been performed to study the pressure distribution across the sensor. This method applies two thin layers of conductive elastomer composite across a 2 × 3 conductive block array, where the former is to detect the stretchable force, whereas the latter is to detect the compression force. The fabrication of the strain sensor consists of two main stages: fabricating the conducting block array (detect compression force) and depositing two thin conductive layers (detect stretchable force).

Characterizations have been performed at the sensor pressure response: static and dynamic configuration, strain sensing and temperature sensing. Both pressure and strain sensing are studied in terms of the temporal response. The temporal response shows rapid resistance changes and returns to its original value after the external load is removed. The electrical conductivity of the prototype correlates to the temperature by showing negative temperature coefficient material behaviour with the sensitivity of −0.105 MΩ/°C.

The conductive sensor array can potentially be implemented as electronic skin due to its reaction with mechanical stimuli: compression and stretchable pressure force, strain sensing and temperature sensing.

This prototype enables various static and dynamic stimulus detections, including bending, normal force, shear stress and certain range of temperature variation, through sandwiching an array of conductive blocks, made of MWCNT and PDMS composite. Conventional design might need to integrate different microfeatures to perform the similar task, especially for dynamic force sensing.

Semiconductor packaging industry has in recent years tightened the tolerance criteria for acceptable solder void size in the semiconductor packages due to the high usage in automotive applications. Semiconductor packaging component makers have strengthened the quality of the solder joint and its electrical conductivity by controlling the maximum solder void size reduction from 10-15% to 5% or below over die size. This paper aims to reduce the solder void size to minimum level that current industry could not achieve and introduce a new soldering processes by combining vacuum reflow and pressure cure to effectively reduce solder void.

This study is using the empirical data collection to prove the feasible in achieve the goal. It is an engineering approach. This research study is even considering sufficient data (>22 units) in each evaluation to represent the actual performance.

Successfully eliminate all the hollow solder void that current industry claimed as solder void. EDX analysis showed that the compressed solder voids remained in the solder are filled with solid carbon-based substances which could be originated from the trapped flux residues. It is empirical data proven in feasibility stage.

The study is able to produce solder void-less. This method is suitable for high volume manufacturing process also. This may lead a new pave way for industry to resolve solder void problem. The current pressure cure machine could not apply more than 200°C temperature which limits medium and high temperature solder paste or alloy testing. Therefore, only low temperature solder alloy Pb37Sn63 was able to be evaluated.

This study is original and has not been published elsewhere to produce high efficiency product in semiconductor packaging performance in electrical path and heat dissipation. It also improves package reliability due to solder joint used as interconnect in semiconductor packaging.