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The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.

A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.

Ceramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity.

Relatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available.

Ceramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.

The main purpose of this study is to test the performance of the ink-jet printed microwave resonant circuits on Low temperature co-fired ceramics (LTCC) substrates combined with microfluidic channels for sensor applications. Normally, conductive patterns are deposited on an LTCC substrate by means of the screen-printing technique, but in this paper applicability of ink-jet printing in connection with LTCC materials is demonstrated.

A simple microfluidic LTCC sensor based on the microstrip ring resonator was designed. It was assumed the micro-channel, located under the ring, was filled with a mixture of DI water and ethanol, and the operating frequency of the resonator was tuned to 2.4 GHz. The substrate was fabricated by standard LTCC process, and the pattern of the microstrip ring resonator was deposited over the substrate by means of an ink-jet printer. Performance of the sensor was assessed with the use of various volumetric concentrations of DI water and ethanol. Actual changes in concentration were detected by means of microwave measurements.

It can be concluded that ink-jet printing is a feasible technique for fast fabrication of micro-strip circuits on LTCC substrates, including microfluidic components. Further research needs to be conducted to improve the reliability, accuracy and performance of this technique.

The literature shows the use of ink-jet printing for producing various conductive patterns in different applications. However, the idea to replace the screen-printing with the ink-jet printing on LTCC substrates in connection with microwave-microfluidic applications is not widely studied. Some questions concerning accuracy and reliability of this technique are still open.

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.