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Article
Publication date: 21 February 2024

Mohamed Bechir Ben Hamida

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration…

Abstract

Purpose

This study investigates the impact of three parameters such as: number of LED chips, pitch and LED power on the junction temperature of LEDs using a best heat sink configuration selected according to a lower temperature. This study provides valuable insights into how to design LED arrays with lower junction temperatures.

Design/methodology/approach

To determine the best configuration of a heat sink, a numerical study was conducted in Comsol Multiphysics on 10 different configurations. The configuration with the lowest junction temperature was selected for further analysis. The number of LED chips, pitch and LED power were then varied to determine the optimal configuration for this heat sink. A general equation for the average LED temperature as a function of these three factors was derived using Minitab software.

Findings

Among 10 configurations of the rectangular heat sink, we deduce that the best configuration corresponds to the first design having 1 mm of width, 0.5 mm of height and 45 mm of length. The average temperature for this design is 50.5 C. For the power of LED equal to 50 W–200 W, the average temperature of this LED drops when the number of LED chips reduces and the pitch size decreases. Indeed, the best array-LED corresponds to 64 LED chips and a pitch size of 0.5 mm. In addition, a generalization equation for average temperature is determined as a function of the number of LED chips, pitch and power of LED which are key factors for reducing the Junction temperature.

Originality/value

The study is original in its focus on three factors that have not been studied together in previous research. A numerical simulation method is used to investigate the impact of the three factors, which is more accurate and reliable than experimental methods. The study considers a wide range of values for the three factors, which allows for a more comprehensive understanding of their impact. It derives a general equation for the average temperature of the LED, which can be used to design LED arrays with desired junction temperatures.

Details

Multidiscipline Modeling in Materials and Structures, vol. 20 no. 2
Type: Research Article
ISSN: 1573-6105

Keywords

Article
Publication date: 16 February 2023

Shanmugan Subramani and Mutharasu Devarajan

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in…

Abstract

Purpose

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (Rth) and rise in junction temperature (TJ) are critical parameters. The purpose of this work is to evaluate the Rth and Tj of the LED attached with the modified heat transfer area of the heatsink to improve thermal management.

Design/methodology/approach

This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink.

Findings

TJ was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm2 (flat) to 3,076 mm2 (outward step). On comparison with inward step geometry, the TJ value was low for outward step configuration (ΔTJ ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both Rth and TJ for different driving currents.

Originality/value

This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.

Details

Microelectronics International, vol. 41 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 2 February 2023

Shanmugan Subramani and Mutharasu Devarajan

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested…

Abstract

Purpose

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Design/methodology/approach

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Findings

Low value in total thermal resistance (Rth-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(Rth-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The TJ value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔTJ) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Originality/value

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the TJ values.

Details

Microelectronics International, vol. 41 no. 2
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 28 March 2024

Zhong Jin, Xiang Li, Feng He, Fangting Liu, Jinyu Li and Junhui Li

The performance of oil-filled pressure cores is very much affected by the corrugated diaphragm and the oil filling volume. The purpose of this paper is to show the effects of…

Abstract

Purpose

The performance of oil-filled pressure cores is very much affected by the corrugated diaphragm and the oil filling volume. The purpose of this paper is to show the effects of different corrugated diaphragms, different oil filling volumes and different treatments of the corrugated diaphragms on the performance of pressure sensors.

Design/methodology/approach

Pressure-sensitive cores with different diaphragm diameters, different diaphragm ripple numbers and different oil filling volumes are produced, and thermal cycling is introduced to improve the diaphragm performance, and finally the performance of each pressure-sensitive core is tested and the test data are analyzed and compared.

Findings

The experimental results show that the larger the diameter of the corrugated diaphragm used for encapsulation, the better the performance. For pressure-sensitive cores using smaller diameter corrugated diaphragms, the performance of one corrugation is better than that of two corrugations. When the number of corrugations and the diameter are the same size, the performance of the outer ring of the diaphragm with concave corrugations is better than that with convex corrugations. At the same time, the diaphragm after thermal cycling treatment and appropriate reduction of encapsulated oil filling can improve the performance of the pressure-sensitive core.

Originality/value

By exploring the effects of corrugated diaphragm and oil filling volume on the performance of oil-filled pressure cores, the design of oil-filled pressure sensors can be guided to improve sensor performance.

Details

Sensor Review, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 19 January 2024

Sobhan Pandit, Milan K. Mondal, Dipankar Sanyal, Nirmal K. Manna, Nirmalendu Biswas and Dipak Kumar Mandal

This study aims to undertake a comprehensive examination of heat transfer by convection in porous systems with top and bottom walls insulated and differently heated vertical walls…

Abstract

Purpose

This study aims to undertake a comprehensive examination of heat transfer by convection in porous systems with top and bottom walls insulated and differently heated vertical walls under a magnetic field. For a specific nanofluid, the study aims to bring out the effects of different segmental heating arrangements.

Design/methodology/approach

An existing in-house code based on the finite volume method has provided the numerical solution of the coupled nondimensional transport equations. Following a validation study, different explorations include the variations of Darcy–Rayleigh number (Ram = 10–104), Darcy number (Da = 10–5–10–1) segmented arrangements of heaters of identical total length, porosity index (ε = 0.1–1) and aspect ratio of the cavity (AR = 0.25–2) under Hartmann number (Ha = 10–70) and volume fraction of φ = 0.1% for the nanoparticles. In the analysis, there are major roles of the streamlines, isotherms and heatlines on the vertical mid-plane of the cavity and the profiles of the flow velocity and temperature on the central line of the section.

Findings

The finding of a monotonic rise in the heat transfer rate with an increase in Ram from 10 to 104 has prompted a further comparison of the rate at Ram equal to 104 with the total length of the heaters kept constant in all the cases. With respect to uniform heating of one entire wall, the study reveals a significant advantage of 246% rate enhancement from two equal heater segments placed centrally on opposite walls. This rate has emerged higher by 82% and 249%, respectively, with both the segments placed at the top and one at the bottom and one at the top. An increase in the number of centrally arranged heaters on each wall from one to five has yielded 286% rate enhancement. Changes in the ratio of the cavity height-to-length from 1.0 to 0.2 and 2 cause the rate to decrease by 50% and increase by 21%, respectively.

Research limitations/implications

Further research with additional parameters, geometries and configurations will consolidate the understanding. Experimental validation can complement the numerical simulations presented in this study.

Originality/value

This research contributes to the field by integrating segmented heating, magnetic fields and hybrid nanofluid in a porous flow domain, addressing existing research gaps. The findings provide valuable insights for enhancing thermal performance, and controlling heat transfer locally, and have implications for medical treatments, thermal management systems and related fields. The research opens up new possibilities for precise thermal management and offers directions for future investigations.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 34 no. 4
Type: Research Article
ISSN: 0961-5539

Keywords

Article
Publication date: 15 December 2023

Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng and Tao Zhang

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Abstract

Purpose

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Design/methodology/approach

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

Findings

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

Originality/value

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 26 December 2023

Aniket Halder, Arabdha Bhattacharya, Nirmalendu Biswas, Nirmal K. Manna and Dipak Kumar Mandal

The purpose of this study is to carry out a comprehensive analysis of magneto-hydrodynamics (MHD), nanofluidic flow dynamics and heat transfer as well as thermodynamic…

Abstract

Purpose

The purpose of this study is to carry out a comprehensive analysis of magneto-hydrodynamics (MHD), nanofluidic flow dynamics and heat transfer as well as thermodynamic irreversibility, within a novel butterfly-shaped cavity. Gaining a thorough understanding of these phenomena will help to facilitate the design and optimization of thermal systems with complex geometries under magnetic fields in diverse applications.

Design/methodology/approach

To achieve the objective, the finite element method is used to solve the governing equations of the problem. The effects of various controlling parameters such as butterfly-shaped triangle vertex angle (T), Rayleigh number (Ra), Hartmann number (Ha) and magnetic field inclination angle (γ ) on the hydrothermal performance are analyzed meticulously. By investigating the effects of these parameters, the authors contribute to the existing knowledge by shedding light on their influence on heat and fluid transport within butterfly-shaped cavities.

Findings

The major findings of this study reveal that the geometrical shape significantly alters fluid motion, heat transfer and irreversibility production. Maximum heat transfer, as well as entropy generation, occurs when the Rayleigh number reaches its maximum, the Hartmann number is minimized and the angle of the magnetic field is set to 30° or 150°, while the butterfly wings angle or vertex angle is kept at a maximum of 120°. The intensity of the magnetic field significantly controls the heat flow dynamics, with higher magnetic field strength causing a reduction in the flow strength as well as heat transfer. This configuration optimizes the heat transfer characteristics in the system.

Research limitations/implications

Further research can be expanded on this study by examining thermal performance under different curvature effects, orientations, boundary conditions and additional factors. This can be accomplished through numerical simulations or experimental investigations under various multiphysical scenarios.

Practical implications

The geometric configurations explored in this research have practical applications in various engineering fields, including heat exchangers, crystallization processes, microelectronic devices, energy storage systems, mixing processes, food processing, air-conditioning, filtration and more.

Originality/value

This study brings value by exploring a novel geometric configuration comprising the nanofluidic flow, and MHD effect, providing insights and potential innovations in the field of thermal fluid dynamics. The findings contribute a lot toward maximizing thermal performance in diverse fields of applications. The comparison of different hydrothermal behavior and thermodynamic entropy production under the varying geometric configuration adds novelty to this study.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 34 no. 2
Type: Research Article
ISSN: 0961-5539

Keywords

Article
Publication date: 9 January 2024

Bhupendra Kumar Sharma, Umesh Khanduri, Rishu Gandhi and Taseer Muhammad

The purpose of this paper is to study haemodynamic flow characteristics and entropy analysis in a bifurcated artery system subjected to stenosis, magnetohydrodynamic (MHD) flow…

Abstract

Purpose

The purpose of this paper is to study haemodynamic flow characteristics and entropy analysis in a bifurcated artery system subjected to stenosis, magnetohydrodynamic (MHD) flow and aneurysm conditions. The findings of this study offer significant insights into the intricate interplay encompassing electro-osmosis, MHD flow, microorganisms, Joule heating and the ternary hybrid nanofluid.

Design/methodology/approach

The governing equations are first non-dimensionalised, and subsequently, a coordinate transformation is used to regularise the irregular boundaries. The discretisation of the governing equations is accomplished by using the Crank–Nicolson scheme. Furthermore, the tri-diagonal matrix algorithm is applied to solve the resulting matrix arising from the discretisation.

Findings

The investigation reveals that the velocity profile experiences enhancement with an increase in the Debye–Hückel parameter, whereas the magnetic field parameter exhibits the opposite effect, reducing the velocity profile. A comparative study demonstrates the velocity distribution in Au-CuO hybrid nanofluid and Au-CuO-GO ternary hybrid nanofluid. The results indicate a notable enhancement in velocity for the ternary hybrid nanofluid compared to the hybrid nanofluids. Moreover, an increase in the Brinkmann number results in an augmentation in entropy generation.

Originality/value

This study investigates the flow characteristics and entropy analysis in a bifurcated artery system subjected to stenosis, MHD flow and aneurysm conditions. The governing equations are non-dimensionalised, and a coordinate transformation is applied to regularise the irregular boundaries. The Crank–Nicolson scheme is used to model blood flow in the presence of a ternary hybrid nanofluid (Au-CuO-GO/blood) within the arterial domain. The findings shed light on the complex interactions involving stenosis, MHD flow, aneurysms, Joule heating and the ternary hybrid nanofluid. The results indicate a decrease in the wall shear stress (WSS) profile with increasing stenosis size. The MHD effects are observed to influence the velocity distribution, as the velocity profile exhibits a declining nature with an increase in the Hartmann number. In addition, entropy generation increases with an enhancement in the Brinkmann number. This research contributes to understanding fluid dynamics and heat transfer mechanisms in bifurcated arteries, providing valuable insights for diagnosing and treating cardiovascular diseases.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. 34 no. 2
Type: Research Article
ISSN: 0961-5539

Keywords

Article
Publication date: 20 April 2023

Lezhi Ye, Xuanjie Song and Chang Yue

Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement…

76

Abstract

Purpose

Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement stroke, position calibration error and low production efficiency in optical alignment, this paper aims to propose a new wafer magnetic alignment technology (MAT) which is based on tunnel magneto resistance effect. MAT can realize micro distance alignment and reduces the design and manufacturing difficulty of wafer bonding equipment.

Design/methodology/approach

The current methods and existing problems of wafer optical alignment are introduced, and the mechanism and realization process of wafer magnetic alignment are proposed. Micro magnetic column (MMC) marks are designed on the wafer by the semiconductor manufacturing process. The mathematical model of the space magnetic field of the MMC is established, and the magnetic field distribution of the MMC alignment is numerically simulated and visualized. The relationship between the alignment accuracy and the MMC diameter, MMC remanence, MMC thickness and sensor measurement height was studied.

Findings

The simulation analysis shows that the overlapping double MMCs can align the wafer with accuracy within 1 µm and can control the bonding distance within the micrometer range to improve the alignment efficiency.

Originality/value

Magnetic alignment technology provides a new idea for wafer bonding alignment, which is expected to improve the accuracy and efficiency of wafer bonding.

Details

Microelectronics International, vol. 41 no. 1
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 22 September 2023

Chen Chen, Liang Zhang, Xi Huang and Xiao Lu

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and…

Abstract

Purpose

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

Design/methodology/approach

This study investigates the effect of adding Si3N4 NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

Findings

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si3N4 NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si3N4 NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si3N4 will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

Originality/value

The Si3N4 NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

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