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This paper examines the development of government-business relations in China’s recent economic reform and development. The paper first provides a review of theoretical issues about the role of government in economic development and the concepts of business promotion and government regulation. Next, the paper introduces major policies and changes that have been developed by the Chinese government. On the business promotion side, it includes major changes in incentive policy, government structure, and management operation that have been implemented during the reform years. On the government regulation side, the paper identifies new challenging issues in consumer, environment, and labor protection that may affect China’s future development. Finally, lessons and implications about the development of Chinese government-business relations are emphasized in the conclusion section.

The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit board (PCB) manufacture.

The flow field of THs and current density distribution on various AR of THs are calculated and analyzed. Meanwhile, corresponding simulation is used to study the performance of plating electrolytes on TP. Two electrochemical parameters, overpotential (η) and potential difference (△η), are chosen to evaluate the electrochemical properties of different plating solutions by galvanostatic measurement and potentiodynamic cathode polarization at different rotating speeds.

By combining both the results of simulation and practical plating, these two electrochemical properties of electrolytes exhibit significant impact to the system at varied conditions. Especially, the electrolyte with higher polarizing η and △η values lead to the elevated TP for AR of more than 2:1.

The harring cell model is built as a bridge between the theoretical and experimental study for control of uniformity of plating THs in PCB manufacturing. This dual-parameter evaluation is validated to be a promising decisive method to guide the THs plating with particular AR in industry.