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1 – 2 of 2Jiacheng Zhou, Jinglin Shi, Dongfan Yin, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu and Huijun He
This study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt.%…
Abstract
Purpose
This study aims to investigate the impact of indium (In) content on the thermal properties, microstructure and mechanical properties of Sn-3Ag-3Sb-xIn (x = 0, 1, 2, 3, 4, 5 Wt.%) solders to enhance the performance of tin-based solder under demanding conditions and to meet the urgent need for high-reliability microelectronic interconnection materials in emerging sectors such as automotive intelligent technology, 5G communication technology and high-performance computing.
Design/methodology/approach
In this study, Sn-3Ag-3Sb-xIn solder alloys were prepared. The thermal properties of the solder alloys were characterised by differential scanning calorimetry. Subsequently, optical microscopy, scanning electron microscopy, X-ray diffraction and an electron probe X-ray microanalyser were used to analyse the influence of the In content on the microstructure of the solder. The mechanical properties of solder alloys were determined through tensile testing.
Findings
As the In content increased, the melting temperature of the Sn-3Ag-3Sb-xIn solder decreased, accompanied by less nucleation undercooling and an expanded melting range. The incorporation of In led to an enhancement in the yield and tensile strengths of the Sn-3Ag-3Sb-xIn solder alloys, but with a concomitant decrease in plasticity. In comparison to commercial Sn-3.0Ag-0.5Cu solder alloys, the yield strength and tensile strength of the Sn-3Ag-3Sb-3In alloy increased by 8.64 and 21.69 MPa, respectively, while the elongation decreased by 11.48%.
Originality/value
Sn-3Ag-3Sb-3In solder alloy was the most appropriate and expected comprehensive properties. The enhancements will provide substantial assistance and precise data references for the interconnection requirements in high-strength interconnection fields, such as automotive intelligent technology, 5G communication technology and high-performance computing.
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Keywords
Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu and Huijun He
The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to…
Abstract
Purpose
The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.
Design/methodology/approach
In this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.
Findings
When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu3Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu3Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.
Originality/value
The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu3Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.
Details