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Article
Publication date: 2 August 2011

Jin Taek Kim, Cheul Ro Lee, Daesuk Kim and Byung Joon Baek

Thermal management under high heat flux is crucial to developing high‐power light‐emitting diode (LED) applications. The purpose of this paper is to propose an efficient thermal…

Abstract

Purpose

Thermal management under high heat flux is crucial to developing high‐power light‐emitting diode (LED) applications. The purpose of this paper is to propose an efficient thermal dissipation technique for an LED back light unit (BLU) system.

Design/methodology/approach

A typical BLU system includes an LED package (GaN on sapphire, cathode/anode, silicone encapsulant, resin plus phosphor) on a printed circuit board (PCB), a light guide panel, and an aluminum cover frame. The temperature distribution of this system has been simulated and the thermal behavior within a 3D model has been investigated using a commercial computational fluid dynamic code (FLUENT 6.3).

Findings

The authors examined the heat‐spreading effect of cover lengths ranging from 6 to 300 mm and also observed the effect of back cover thickness on the junction temperature and cover frame temperature and investigated the influence of the air gap between the package and the cover frame. Removing the air gap lowers the maximum temperature by about 6 percent. It was found that the addition of a copper layer covering the external surfaces of the LED chip enhanced the cooling efficiency. Finally, the maximum junction temperature can be decreased by more than 21 percent in the range of parameters considered by removing the air gap, adding a heat spreader, and using a thick cover frame.

Originality/value

In this paper, thermal management for efficient heat spreading through a typical BLU system without using any additional devices is investigated. Several parameters that increase the system's temperature are examined, and a combination of design features that attenuate the junction temperature is proposed.

Open Access
Article
Publication date: 10 September 2021

Jun Sik Kim and Sol Kim

This paper investigates a retrospective on the Journal of Derivatives and Quantitative Studies (JDQS) on its 30th anniversary based on bibliometric. JDQSs yearly publications…

1149

Abstract

This paper investigates a retrospective on the Journal of Derivatives and Quantitative Studies (JDQS) on its 30th anniversary based on bibliometric. JDQSs yearly publications, citations, impact factors, and centrality indices grew up in early 2010s, and diminished in 2020. Keyword network analysis reveals the JDQS's main keywords including behavioral finance, implied volatility, information asymmetry, price discovery, KOSPI200 futures, volatility, and KOSPI200 options. Citations of JDQS articles are mainly driven by article age, demeaned age squared, conference, nonacademic authors and language. In comparison between number of views and downloads for JDQS articles, we find that recent changes in publisher and editorial and publishing policies have increased visibility of JDQS.

Details

Journal of Derivatives and Quantitative Studies: 선물연구, vol. 29 no. 4
Type: Research Article
ISSN: 1229-988X

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