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The IBM ceramic quad flat pack (CQFP) is a high performance, low‐cost chip carrier for surface mount assembly. It is an extension of metallised ceramic (MC) and metallised ceramic with polyimide (MCP) product technologies. These finished modules conform to JEDEC I/O and footprint standards. They are available in 0.5 mm and 0.4 mm lead pitches with flexibility to address unique application requirements such as body sizes or lead pitches. Connection from integrated circuit (IC) to carrier is performed using flip‐chip (C4 ‐ Controlled Collapse Chip Connection) attach. Silicon die size and the quantity of C4 connections for flip‐chip joining have historically been constrained to reduce early life failures caused by solder fatigue wearout. This DNP (distance from neutral point of chip footprint) limitation has been overcome with increasing usage of epoxy encapsulation as a flip‐chip underfill. The encapsulant matches the coefficient of thermal expansion (CTE) of C4 solder and minimises stresses on the interconnection. This enhancement provides a substantial reliability improvement in comparison with unencapsulated packages. Also, it enables larger die with smaller C4 solder bumps on finer pitches to be assembled on ceramic carriers. Recent product development and testing have extended flip‐chip on ceramic packaging technology even further than previously anticipated. Test die up to 20 mm in size with over 2,000 C4 joints have been successfully assembled, encapsulated, stress tested and qualified in CQEP modules. Flip‐chip assembly and encapsulation of C4 connections on very large die to CQFP components have been implemented into IBM manufacturing production. This large‐scale packaging enhancement continues to demonstrate that flip‐chip underfill eliminates the intrinsic failure mechanisms associated with fatigue wearout. This provides a significant technology extension to this low‐cost and high reliability product offering.

Dr Nihal Sinnadurai has taken up his new post as Professor of Electronics Technology at Middlesex University and head of its Microelectronics Centre.

During the first half of this year the Association has continued to expand its exhibition programme by increasing its presence at overseas shows. Two DTI sponsored joint venture groups have been formed, one to Nepcon West, the other to Nepcon Beijing. Anaheim saw the biggest UK group for over 10 years, with CEMA taking three separate blocks in different sectors of the show. There is no doubt from the reception we received that CEMA is now firmly established at Nepcon West. We enjoyed tremendous support from both the British Consulate and the British‐American Chamber of Commerce with their President making several visits to the CEMA booth.

This Society, originally known as “The National Pure Food Association,” has been reconstituted under the above title. The objects of the Society are to assist as far as possible in checking the widespread evils of food adulteration, for this purpose to bring about a public realisation of the admittedly serious character of food frauds, and, under expert advice, to co‐operate with constituted authority in effecting their repression. The policy of the Society is directed by a representative Council, and, the Society being thus established on an authoritative basis, cannot fail to become a powerful and valuable organisation if adequately and generously supported by the public. The governing body of the Society is constituted as follows:—

A NEW YEAR is a season of Stocktaking in normal times; this year it is especially so. The library journals of the world all fill their pages with discussions on libraries in a time of economic depression and financial stringency; and in America this note is even more Stressed than in any country, and we trust that some good may come of it seeing that America has proved more helpless in the face of world depression than any nation had thought possible. That, however, is by the way. The immediate problem of the New Year is how to ensure that in the general reductions of expenditure that are being made the expenditure on libraries is reduced as little as possible.

Studies of solder‐bumped flip chips on organic substrates reported in the literature have so far suggested the necessity of a polymeric underfill to compensate for the large thermal mismatch between the silicon and the substrate. In this company's target applications of this process, the underfill not only has to meet the much published mechanical and chemical requirements, but also has to flow through a vertical clearance of 0.020 to 0.0375 mm quickly as well as being cured in a relatively short time. The evaluation of the underfill materials starts with some basic understanding of how the different ingredients in the underfill formulation might affect its physical and chemical properties. The flow characteristics of the underfills were a first priority in the selection. A detailed thermal‐mechanical analysis then helped to determine the optimal cure schedule with the desired physical properties. A simple test die/test board system has been designed to evaluate how the underfill might work in a quasi‐production process and to allow for subsequent reliability evaluation. This paper highlights the ‘pluses and minuses’ of the currently available commercial underfills in relation to the optimisation of a high‐volume production process.

This study aims to measure the global research landscape of the National Institute of Pharmaceutical Education and Research (NIPER) of India on a set of quantitative and qualitative metrics in terms of research output toward exploring research trends and give an overview of collaborative practices by researchers of NIPERs.

The present study has selected the Scopus database as a tool to retrieve potential publications of studied NIPERs during the last 12 years (2010–2021). NIPER-Mohali, NIPER-Hyderabad, NIPER-Ahmedabad, NIPER-Guwahati and NIPER-Kolkata have been selected for the study. The study has adopted a comprehensive search strategy to extract 3,926 publications data. VOS viewer 1.6.17, BibExcel and Microsoft Excel were used for data analysis and visualization.

The global scientific research output of NIPERs accrued 3,926 publications with an average of 327 publications per year. The retrieved publications fetched a total of 67,772 citations with an average citation impact of 17.26. There observed a steady growth of publications from 168 to 509 registered with an average growth rate of 18.44%. The mean relative growth rate and doubling time of research output are 0.26 and 2.94. The authorship patterns explore collaborative trends as most of the publications were published by multiple authors (99.39%). NIPERs have expanded their outreach to collaborate with the USA, Malaysia, Saudi Arabia, Australia and the UK to collaborate on research and regulatory reforms exhibits in the USA as a major contributor.

The present study is the first effort to evaluate the global research productivity of NIPERs and assess the current research trends on a set of quantitative and qualitative metrics to provide some insights into the complex dynamics of research productivity. The study’s outcome may help to identify the current research progress of NIPERs at the global level.

The purpose of the paper is to analyze the ventricular tachycardia by soft computing. Ventricular tachycardia is a type of regular and fast heart rate which arises from improper electrical activity in the ventricles of the heart.

In this study, a soft computing approach was applied for the ventricular tachycardia detection. The soft computing was used to detect which factors are the most important for the ventricular tachycardia.

Three factors were used: brain natriuretic peptide, troponin I which is a part of the troponin complex and C-reactive protein which is an annular (ring-shaped), pentameric protein found in blood plasma.

It was found that troponin I has the most influence on the ventricular tachycardia prediction.

During the last few years an increasing number of flip‐chip (FC) interconnection technologies have emerged. While flip‐chip assembly offers many advantages compared with conventional packaging techniques, several aspects prevent this technology from entering the high volume market. Among these are the availability of bumped chips and the costs of the substrates, i.e., ceramic substrates with closely matching coefficient of thermal expansion (CTE) to the chip, in order to maintain high reliability. Only recently, with the possibility of filling the gap between chip and organic substrate with an encapsulant, was the reliability of flip‐chips mounted on organic substrates significantly enhanced. This paper presents two approaches to a fluxless process, one based on soldering techniques using Au‐Sn metallurgy and the other on adhesive joining techniques. Soldering is performed with a thermode and with a laser based system. For both of these FC‐joining processes, alternative bump mettallurgies based on electroplated gold, electroplated gold‐tin, mechanical gold and electroless nickel gold bumps are applied.

The lesbian, gay, bisexual and transgender (LGBT) people face discrimination, verbal harassment, rejection and physical violence that affect their mental health and well-being. Adolescence is a critical period for the development of mental health and well-being. The purpose of this study is to analyze research publications on the mental health and well-being of LGBT adolescents.

A comprehensive research strategy was implemented using the SciVerse Scopus database to accomplish the objective of the study. The study period was all times up to 2020. VOS viewer program was used for mapping of frequent author keywords, journal citations and research collaboration.

The search strategy found 1,167 documents authored by 4,067 researchers and disseminated through 321 scientific journals. Research on the topic started half a century ago but showed a visible steep growth after 2008. Authors and institutions in the USA dominated the field. Northwestern University, based in the USA, was the most active institution. No significant cross-country collaboration was observed in this field. The most active journal was Journal of Adolescent Health (n = 67, 5.7%), followed distantly by the Journal of LGBT Youth (n = 48, 4.1%). The contribution of journals in the field of mental health to the topic was limited. Documents on family acceptance, suicidality and school victimization/violence received the highest number of citations. The retrieved documents in the field had five major topics: suicide, mental health/depression, bullying/victimization, substance use/alcohol and violence.

The present study has a few limitations that are typical of any bibliometric study. Both the search strategy and the use of Scopus are inherent limitations of bibliometric studies.

Policymakers and public health experts in various countries need to prioritize research on the mental health and well-being of LGBT adolescents based on the number of publications produced by the country. The finding that certain world regions have limited research contribution does not mean the absence of mental health problems of LGBT adolescents.

The limited number of scholars in the field of sexual health, the cultural barriers are the main obstacles for publishing in this field. Research on LGBT adolescents’ mental health and well-being should be prioritized in countries and world regions with limited research in this field. Therefore, journal editors should endorse publications in this field through publishing thematic issues in this field.

To the best of the authors’ knowledge, this is the first study to assess the scientific research publications on the mental health of the LGBT people as an indication of interest and social problems facing this community.