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For the realization of optical waveguide components, needed for photonic integrated circuits, multimode-interference based (MMI-based) devices are an excellent component class for the realization of low loss optical splitters. A promising approach to the manufacturing of these components is their embedding in thin glass sheets by ion-exchange diffusion processes, which has not yet been extensively studied. This study aims to significantly enhance the modeling of the diffusion process to support manufacturing of graded-index, MMI-based optical splitters.

The methods of design and analysis of MMI-based components are based on a step-index refractive index profile. In this work, fundamental correlations between the properties of the manufacturing ion-exchange process and the characteristics of the graded-index, MMI-based components are established. The refractive index profile is calculated with a proprietary solver based on the finite element method. Any further investigation with respect to parameter influence is based on the beam propagation method, specifically a finite difference based, semi-vectorial, wide-angle beam propagation algorithm. The influence of the parameters of the self-imaging effect is investigated. On this basis, different approaches for efficient power splitting with graded-index, MMI-based waveguide components are evaluated.

Easy approximations – mostly linear – can be found to model the dependencies of the investigated parameters. The resulting graded-index splitters are characterized by their low excess and insertion loss.

These findings are the first step in the direction of the semi-analytical modeling of the respective waveguide components to reduce the numerical effort.

The purpose of this paper is to present a novel manufacturing process that aims to pattern metal tracks onto polyimide at atmospheric pressure and ambient environment. The process can be scaled up for industrial applications.

From a thorough literature survey, different approaches were carried out for processing polyimide. Following a design of experiments for the processing and various characterisation techniques, a micro‐coil was manufactured as a test demonstrator.

The characteristics of some main formaldehyde‐based electroless copper baths were compared. The quality of the sidewalls was characterised and the performance of the process was assessed.

This paper demonstrates a high‐value manufacturing technique that is mass manufacturable, low cost and suitable for use on 3D surfaces. Criteria required for the development of a direct‐writing process have been described. The issues surrounding electroless plating on polyimide have been explained.

The purpose of this paper is to study fabrication of optical‐PCBs on panel scale boards in a conventional modern PCB process environment. It evaluates impacts on board design and manufacturing with the developed optical board verifiers outlining challenges and requirements for manufacturing low‐loss waveguide structures and optical building blocks. The study aims to expand the current knowledge in the field by adding results obtained by utilizing industrial production infrastructure and developed scalable manufacturing processes to fabricate optical‐PCBs and board assemblies in high‐volumes and low‐cost manner.

Impacts on board design and manufacturing were studied with the developed optical technology verifiers. One verifier is optical‐PCB with embedded waveguides, integrated i/o couplers and optical vias. Another verifier is large size PCB with optical layer. A system‐level optical board assembly with 12.5 Gb/s Tx/Rx devices on surface mounted ball grid array (BGA) modules is designed for optical link analysis. Fabricated optical structures on verifiers are evaluated of their physical characteristics utilizing optical, SEM, LSCM analysis methods. Performance testing is conducted using standard optical transmission measurement methods and equipment.

The paper provides empirical results about fabrication of multimode optical waveguides with conventional PCB process equipment. Results suggest that current coating and imaging equipments are capable of producing optical waveguide patterns with high resolution and size accuracy. However, fabricators would require larger process window and defect tolerance for processing optical materials to obtain low‐loss waveguides with sufficient yields.

Because of the limited amount of design variants in production verifiers evaluated in this paper, some impacts like effect of base material, board construction, optical layer location and beam coupling solution were not evaluated. Likewise, impacts on long‐term stability and cost were not addressed. These factors however require further investigation to address technical feasibility of optical PCBs technology prior commercial high volume production.

The paper includes implications for the development of a fabrication methods and testing procedures for optical polymer waveguide layers on PCBs.

This paper fulfils need to provide results on design, fabrication and characterization of optical PCBs and backplanes from industrial fabricator's perspective. The paper provides input for end‐user and developers to evaluate technical performance, robustness, and maturity of building blocks and supply chain to support polymer waveguide based technology for intra‐system optical links.

This study aims to analyze the transmission characteristics of a long-period grating (LPG) fabricated on plastic optical fibers (POFs) and its refractive index (RI) sensing.

The geometric optic method is used to analyze the factors affecting the transmission characteristics of an LPG on POFs. The RI sensing performances of unbent LPGs and U-bent LPGs fabricated on POFs with different diameters are evaluated experimentally.

This study shows that the transmission loss caused by LPG strongly depends on the structural parameters of LPG and the environmental RI. For the unbent LPG, the highest RI sensitivity of 1,015%/RI unit (RIU) was obtained in the RI range of 1.33–1.45. For the U-bent LPG without cladding, the highest RI sensitivities of 1,007 and 559%/RIU are obtained in the RI ranges of 1.33–1.40 and 1.40–1.45, respectively.

A geometric optic method is used to analyze the transmission characteristics for an LPG on POFs, and the RI sensing of the LPGs are studied experimentally. The results show the LPG has a good RI sensing performances and is with the features of low-cost, simple structure and easy fabrication.

To present work and characterisation results from a project to develop a pluggable optical connector for board to board interconnect.

An optical backplane connection system is described, which allows for repeatable docking and undocking of an active optical interface housed on a daughtercard to waveguides fabricated on an optical backplane.

The optical backplane connection system described has demonstrated its successful implementation with respect to optical data transfer across multimode polymer waveguides. Measurement results presented show that such a system is a viable approach toward the application of pluggable optical backplane interconnects.

The direct connection to the exposed waveguide interface results in considerable optical loss and scattering. Future designs will have to address this. Additional work should also be undertaken to develop a means of connector engagement that is autonomous and requires no user intervention.

Prior research into the problem of coupling to an optical backplane has been concerned with interfaces that deflect optical signals by 90° into and out of the waveguides. Here, an alternative approach is proposed that launches light directly into the waveguide ends.

Polymeric materials have gained a wide theoretical interest and practical application in sensor technology. They can be used for very different purposes and may offer unique possibilities. The paper gives a broad summary about the sensor structures and sensing polymer films used in a wide variety of sensors. Finally, the present status and perspectives as well as the advantages of specific polymer based sensors are summarised.

As sensor research and development continues, spotting market niches is becoming a full time job, as Stephen McClelland explains.

Sensor Review publishes the results of a major sensor survey.