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1 – 10 of 21
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Article
Publication date: 1 June 2004

Abstract

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Circuit World, vol. 30 no. 2
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 June 2004

Abstract

Details

Circuit World, vol. 30 no. 2
Type: Research Article
ISSN: 0305-6120

Keywords

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Article
Publication date: 1 September 2002

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Circuit World, vol. 28 no. 3
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 18 May 2010

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Circuit World, vol. 36 no. 2
Type: Research Article
ISSN: 0305-6120

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Abstract

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Soldering & Surface Mount Technology, vol. 25 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 March 2004

Pete Starkey

Abstract

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Circuit World, vol. 30 no. 1
Type: Research Article
ISSN: 0305-6120

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Article
Publication date: 1 July 2006

John Ling

Abstract

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Soldering & Surface Mount Technology, vol. 18 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 18 May 2010

Axel Bindel, Paul Conway, Laura Justham and Andrew West

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with…

Abstract

Purpose

The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with embedded wireless components.

Design/methodology/approach

Business processes of the electronic manufacturing supply chain were analysed. A business case and the system opportunities for life cycle monitoring, based on embedded wireless components system were developed. Radio frequency identification (RFID) assembly technology was adapted for the integration of components into a multi‐layer printed circuit board (PCB).

Findings

By storing product‐related information into electronic products, tracing of components, monitoring of processes, operations and costs, environmentally optimised recycling can be enhanced.

Research limitations/implications

The research undertaken so far relates to the embedding of RFID tags into PCBs. Wireless components with more processing power will be used in the next project phase.

Originality/value

The paper details how wireless components can be embedded into multi‐layer PCBs and how a business case for a life cycle monitoring system can be established.

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Article
Publication date: 2 August 2011

Richard Bloss

The purpose of this paper is to review the automated assembly technology at the Assembly and Automation Expo. While assembly is the feature show, it combines with…

Abstract

Purpose

The purpose of this paper is to review the automated assembly technology at the Assembly and Automation Expo. While assembly is the feature show, it combines with manufacturing of electronics, plastics and medical devices at the same venue.

Design/methodology/approach

In‐depth interviews with exhibitors of automated systems, system integrators as well as suppliers of related components motion elements, laser markers.

Findings

Automated assembly continues to become more flexible, modular, as well as better suited for smaller lot orders and includes more real‐time inspection capabilities.

Originality/value

The paper shows that new products to be assembled are driving those who provide automated assembly systems to create better solutions. These include solutions that are more cost‐effective, faster and include more quality assessment and tracking as part of the automation.

Details

Assembly Automation, vol. 31 no. 3
Type: Research Article
ISSN: 0144-5154

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Content available
Article
Publication date: 1 December 2004

John Ling

Abstract

Details

Circuit World, vol. 30 no. 4
Type: Research Article
ISSN: 0305-6120

Keywords

1 – 10 of 21