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1 – 10 of 90Dorota Szwagierczak, Jan Kulawik, Beata Synkiewicz and Agata Skwarek
The work was aimed at preparation of green tapes based on a new material Bi2/3CuTa4O12, to achieve spontaneously formation of an internal barrier layer capacitor (IBLC)…
Abstract
Purpose
The work was aimed at preparation of green tapes based on a new material Bi2/3CuTa4O12, to achieve spontaneously formation of an internal barrier layer capacitor (IBLC), fabrication of multilayer elements using low temperature cofired ceramics (LTCC) technology and their characterization.
Design/methodology/approach
The study focused on tape casting, lamination and co-sintering procedures and dielectric properties of Bi2/3CuTa4O12 multilayer capacitors. Scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) studies of the ceramic elements were performed. Impedance spectroscopy was used for characterization of dielectric properties in the frequency range of 0.1 Hz to −2 MHz and in the temperature range from −55 to 400°C. DC conductivity was investigated in the temperature range 20 to 740°C.
Findings
SEM observations revealed a good compatibility of the applied commercial Pt paste with the ceramic layers. The EDS microanalysis showed a higher content of oxygen at grain boundaries. The dominant dielectric response, which was recorded in the low frequency range and at temperatures above 0°C, was attributed to grain boundaries. The dielectric response at low temperatures and/or high frequencies was related to grains. The fabricated multilayer capacitors based on Bi2/3CuTa4O12 exhibited a high specific capacitance.
Originality/value
A new material Bi2/3CuTa4O12 was applied for preparation of green ceramic tapes and utilized for fabrication of multilayer ceramic capacitors using the LTCC technology. This material belongs to the group of high permittivity nonferroelectric compounds with a complex perovskite structure of CaCu3Ti4O12, that causes the spontaneously formation of IBLCs.
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This paper aims to present the comparative study on the composition, microstructure and dielectric behavior of a group of new nonferroelectric high-permittivity A2/3CuTa4O12 (A …
Abstract
Purpose
This paper aims to present the comparative study on the composition, microstructure and dielectric behavior of a group of new nonferroelectric high-permittivity A2/3CuTa4O12 (A = Y, Nd, Sm, Gd, Dy or Bi) ceramics.
Design/methodology/approach
The materials under investigation were synthesized by solid-state reaction method and sintered at 1,120-1,230°C. Dielectric properties were investigated in the temperature range from −55 to 740°C at frequencies 10 Hz to 2 MHz. Microstructure, elemental composition and phase composition of the ceramics were examined by scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD) methods. DC conductivity was studied in the temperature range 20-740°C.
Findings
XRD analysis revealed peaks corresponding to Cu2Ta4O12 along with small amounts of secondary phases based on tantalum oxides. Impedance spectroscopic data and the results of SEM and EDS studies imply the spontaneous formation of internal barrier layer capacitors in the investigated materials. Two steps can be distinguished in the dielectric permittivity versus frequency plots. The low-frequency step of 1,000-100,000 is assigned to grain boundary barrier layer effect, while the high-frequency one of 34-46 is related to intrinsic properties of grains.
Originality/value
Search for new high-permittivity capacitor materials is important for the progress in miniaturization and integration scale of electronic passive components. The paper reports on processing, microstructure, microanalysis studies and dielectric properties of a group of novel nonferroelectric materials with the perovskite structure of CaCu3Ti4O12 and the general formula A2/3CuTa4O12, being spontaneously formed internal barrier layer capacitors.
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To permit multilayer ceramic capacitors to be soldered directly onto printed circuit boards and other components, the terminations are plated with a barrier layer (usually nickel…
Abstract
To permit multilayer ceramic capacitors to be soldered directly onto printed circuit boards and other components, the terminations are plated with a barrier layer (usually nickel) followed by either pure tin or a tin‐lead alloy. Pertinent properties of deposits and solutions are discussed and these include deposit thickness requirements, internal stress, solderability, effects of cross‐contamination, variations of tin‐lead composition with operating parameters and effluent treatment.
Meng H. Lean and Wei-Ping L. Chu
The purpose of this paper is to describe a rapid and robust axisymmetric hybrid algorithm to create dynamic temporal and spatial charge distributions, or charge map, in the…
Abstract
Purpose
The purpose of this paper is to describe a rapid and robust axisymmetric hybrid algorithm to create dynamic temporal and spatial charge distributions, or charge map, in the simulation of bipolar charge injection using Schottky emission and Fowler-Nordheim tunneling, field-dependent transport, recombination, and bulk and interfacial trapping/de-trapping for layered polymer films spanning the range from initial injection to near breakdown.
Design/methodology/approach
This hybrid algorithm uses a source distribution technique based on an axisymmetric boundary integral equation method (BIEM) to solve the Poisson equation and a fourth-order Runge-Kutta (RK4) method with an upwind scheme for time integration. Iterative stability is assured by satisfying the Courant-Friedrichs-Levy (CFL) stability criterion. Dynamic charge mapping is achieved by allowing conducting and insulating boundaries and material interfaces to be intuitively represented by equivalent free and bound charge distributions that collectively satisfy all local and far-field conditions.
Findings
Charge packets cause substantial increase of electric stress and could accelerate the breakdown of polymeric capacitors. Conditions for the creation of charge packets are identified and numerically demonstrated for a combination of impulsive step excitation, high charge injection, and discontinuous interface.
Originality/value
Metallized bi-axially oriented polypropylene (BOPP) dielectric thin film capacitor with self-clearing and enhanced current carrying capability offer an inexpensive and lightweight alternative for efficient power conditioning, energy storage, energy conversion, and pulsed power. The originality is the comprehensive physics and multi-dimensional modeling which span the dynamic range from initial injection to near breakdown. This model has been validated against some empirical data and may be used to identify failure mechanisms such as charge packets, gaseous voids, and electroluminescence. The value lies in the use of this model to develop mitigation strategies, including re-designs and materials matching, to avoid these failure mechanisms.
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This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper…
Abstract
This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis of ceramics and glass materials. The bibliography at the end of the paper contains references to papers, conference proceedings and theses/dissertations on the subject that were published between 1977‐1998. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, ferrites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.
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Owen Thomas, Martin Wickham and Chris Hunt
The purpose of this paper is to present work on the incorporation of capacitors into printed circuit boards (PCB) as a method to measure moisture content and follow moisture…
Abstract
Purpose
The purpose of this paper is to present work on the incorporation of capacitors into printed circuit boards (PCB) as a method to measure moisture content and follow moisture diffusion under ground planes.
Design/methodology/approach
PCBs were manufactured of FR‐4 incorporating different arrangements and sizes of capacitors formed between the tracks on adjacent layers of the PCB. The boards were placed in an 85°C and 85 per cent relative humidity (RH) environment to absorb moisture before baking at temperatures of 80, 110 or 125°C with the capacitance periodically measured. The effect of ground planes with different densities of plated and non‐plated through holes (PTH) has been studied by placing capacitors between ground planes.
Findings
Parallel plate capacitors embedded within a PCB showed a 10 per cent capacitance increase going from a dry state to being saturated with moisture in an 85°C and 85 per cent RH environment. The slow ingression of moisture under the capacitance planes meant that the measured capacitance change did not reflect the moisture content of the remainder of the board well. Capacitor plates with slots for the moisture to penetrate were also investigated, with the increase in capacitance found to show good correlation with the increase in board mass. In investigating moisture under ground planes, either by decreasing the hole density or by plating the holes, the time for moisture to diffuse out of the board was found to increase due to the lower exposed area on the PCB.
Originality/value
The paper illustrates a method that can be applied to PCB manufacturing to assess the moisture content of a board prior to reflow.
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Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in…
Abstract
Briefly reviews previous literature by the author before presenting an original 12 step system integration protocol designed to ensure the success of companies or countries in their efforts to develop and market new products. Looks at the issues from different strategic levels such as corporate, international, military and economic. Presents 31 case studies, including the success of Japan in microchips to the failure of Xerox to sell its invention of the Alto personal computer 3 years before Apple: from the success in DNA and Superconductor research to the success of Sunbeam in inventing and marketing food processors: and from the daring invention and production of atomic energy for survival to the successes of sewing machine inventor Howe in co‐operating on patents to compete in markets. Includes 306 questions and answers in order to qualify concepts introduced.
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An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability…
Abstract
An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all‐around best options in terms of solderability protection and wire bondability. Nickel/Pd finishes offer a slightly reduced level of performance in these areas which is most likely due to variable Pd surface conditions. It is necessary to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that include thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non‐Pb bearing solders are discussed.
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Some characteristics of the metallisation of leadless ceramic components are discussed, such as dissolution, reliability of joints, intermetallic compound formations and the…
Abstract
Some characteristics of the metallisation of leadless ceramic components are discussed, such as dissolution, reliability of joints, intermetallic compound formations and the migration of silver. It is concluded that it is not the type of the metallisation that is important, but the quality of the make.
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