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This paper presents an application of the physics‐of‐failure design philosophy to flip‐chip bonds in a microelectronic package. The physics‐of‐failure philosophy utilises knowledge of the life‐cycle load profile, package architecture and material properties to identify potential failure mechanisms and to prevent operational failures through robust design and manufacturing practices. The potential failure mechanisms and failure sites are identified in this paper for flip‐chip bonds, and an approach is presented to prevent the identified potential failure mechanisms by design. Finally, quality conformance issues are discussed to ensure a robust manufacturing process and qualification issues are addressed to evaluate the reliability of the designed flip‐chip bond.

The paper aims to focus on the recognition of corrosion product morphologies of AA5083‐H321 corroding aluminum‐magnesium alloys used in the manufacture of aluminum high speed boats and submarines during flow induced corrosion in seawater.

All experiments were conducted in a 3.5 percent NaCl solution as the simulated marine environment. Hydrodynamic conditions were created by an rotating cylinder electrode (RCE) system. Morphological characterization of the surface was undertaken using SEM and EDAX techniques. Cyclic polarization tests were used to determine the electrochemical behavior of the alloy.

The results obtained reveal that the pit density on the sample surface increased with increasing the rotation speed. The enhanced flow condition also enhanced the tendency for intermetallic particles, including submicron size Al(Mg,Mn) inclusions, to promote pitting corrosion of the alloy. An interesting result was that crystallographic pitting occurred at rotation speeds greater than 5 m/s.

In the selection of corrosion control methods for high speed aluminum‐hulled boats, control of erosion corrosion was determined to be more important than any other form of corrosion.

Provides information about the contribution of mechanical and electrochemical corrosion phenomena in corrosion of high speed aluminum boats under hydrodynamic conditions. Characterization of new intermetallic particles in aluminum‐magnesium alloys that can promote pitting during flow induced corrosion in marine environments. Provides new information about the origin of crystallographic pitting attack on aluminum.

The purpose of this paper is to investigate effects of the multiple rework of ball grid array (BGA) components on mechanical strength of BGA balls, as well as any possible intermetallic (IMC) embrittlement, and obtain data correlated with possible estimation on the maximum permitted limits of BGA rework.

In this paper, mechanical strength of BGA components assemblies with multiple numbers of rework operations was evaluated. Mechanical evaluation was conducted using BGA ball shear tests and four‐point bending tests of BGA assemblies. Test samples were prepared under the following conditions: virgin, one, two, three and five BGA reworks. Failure mechanism was evaluated using cross‐section and SEM analysis.

The results show that both ball shearing tests and four‐point bending tests indicates that strength of BGA solder ball itself was not reduced significantly after repair/rework operation from one to five cycles. The IMC structure layer after rework is a mixture of IMC, Sn‐rich and Pb‐rich phases. This mixture layers with thickness even more than 10 μm in thickness does not show reduction of strength of BGA solder balls and do not cause premature embrittlement. However, the bonding strength of the copper pads to the laminates is reduced with rework/repair operation, with the great reduction coming from the first and second rework operation.

In general, the industry recommends two rework cycles for BGA components on the same spot. This study indicates that further rework (up to five) causes little degradation, therefore there is room to increase the total rework cycle limit beyond recommended two for plastic BGA components.

Presented test results shows that in most cases industry overestimates risks associated with increased embritlement of the BGA solder joints due to the intermetallics growth after multiple BGA rework operations. Strength reduction of BGA assemblies is mostly associated with reduction of bonding strength of the copper pads to the laminates is reduced with rework/repair operation and number of reworks could be increased in most cases.

This paper discusses the microstructures of solder joints and the mechanism of thermal fatigue, which is an important source of failure in electronic devices. The solder joints studied were near‐eutectic Pb‐Sn solder contacts on copper. The microstructure of the joints is described. While the fatigue life of near‐eutectic solder joints is strongly dependent on the operating conditions and on the microstructure of the joint, the metallurgical mechanisms of failure are surprisingly constant. When the cyclic load is in shear at temperatures above room temperature the shear strain is inhomogeneous, and induces a rapid coarsening of the eutectic microstructure that concentrates the deformation in well‐defined bands parallel to the joint interface. Fatigue cracks propagate along the Sn‐Sn grain boundaries and join across the Pb‐rich regions to cause ultimate failure. The failure occurs through the bulk solder unless the joint is so thin that the intermetallic layer at the interface is a significant fraction of the joint thickness, in which case failure may be accelerated by cracking through the intermetallic layer. The coarsening and subsequent failure are influenced more strongly by the number of thermal cycles than by the time of exposure to high temperature, at least for hold times up to one hour. Thermal fatigue in tension does not cause well‐defined coarsened bands, but often leads to rapid failure through cracking of the brittle intermetallic layer. Implications are drawn for the design of accelerated fatigue tests and the development of new solders with exceptional fatigue resistance.

It is an accepted fact that copper‐tin intermetallic formation is necessary to produce a solder wetted copper surface. It is also a fact that this same beneficial intermetallic formation could result in subsequent problems, such as brittle solder joints, tin depletion of solder and intermetallic cracking, if its formation is uncontrolled and excessive. Since its formation is a function of temperature, time, and the availability of reactants, these parameters must be controlled to some degree in order to minimise the chances of problem occurrence.

In this paper, the interaction kinetics between eutectic PbSn solder and Au/Ni/Cu metallisation of plastic ball grid array packages during laser reflow bumping were investigated. The effects of processing variables, including laser reflow power and time, on the morphology of the intermetallic compounds formed at the solder/pad interface were studied by scanning electron microscopy and energy dispersive X‐ray spectrometry. Furthermore, dissolution and diffusion of Au and Sn inside the solder bump within the duration of the laser heating was analysed by Auger electron spectroscopy (AES). The results reveal that the morphology of the intermetallic compounds was strongly influenced by the laser input energy. The AES results showed that Au atoms dissolved rapidly into the solder after the solder was melted.

An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all‐around best options in terms of solderability protection and wire bondability. Nickel/Pd finishes offer a slightly reduced level of performance in these areas which is most likely due to variable Pd surface conditions. It is necessary to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that include thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non‐Pb bearing solders are discussed.

Damage to components during soldering and degradation of soldered joints is determined to a large extent by the mechanical properties and the metallurgy of solder alloys and soldered joints. Knowledge of these properties is required for understanding of the mechanisms of damage and degradation. A compilation of this background knowledge is presented in this first article. It comprises the elastic, strength, creep and fatigue characteristics of tin/lead solders. Further, the metallurgy of tin/lead solders and soldered joints is discussed in terms of solidification structures, formation of intermetallic compounds, ageing of structures and effects of different solderable metallisations and soldering technology.

The purpose of this paper is to understand the effect of pressurized steam on surface changes, structures of intermetallic particles and corrosion behavior of AA1050 aluminium.

Industrially pure aluminium (AA1050, 99.5 per cent) surfaces were exposed to pressurized steam produced from a commercial pressure cooker at the maximum temperature of 116oC for 10 min. Surface morphology was observed using SEM‐EDX and FIB‐SEM. Phase identification and compositional depth profiling were investigated using XRD and GDOES, respectively. Potentiodynamic polarization measurements were used to study corrosion behavior.

A 590 nm boehmite oxide layer was generated on AA1050 associated with partially dissolved and/or fallen off Fe‐containing intermetallic particles after exposure to pressurized steam. A significant reduction (25 times) in anodic and cathodic reactivities was observed due to the formation of the compact oxide layer.

This paper reveals a detailed investigation of how pressurized steam can affect the corrosion behaviour of AA1050 aluminium and the structure of Fe‐containing intermetallic particles.

The ageing behaviour of aluminium wire bonds (Al‐1%Si wire, 25 µm diameter) on five different gold thick film inks from three different manufacturers has been investigated. A new mechanism, the oxidation of the gold‐aluminium intermetallics, is proposed to explain the degradation of contact resistance for this system. With this theory the degradation of bond resistance, as well as the ‘healing effect’, can be explained. The oxidation can be proven by ageing in a vacuum. Surface analytical methods have shown the compound Au4Al to be responsible for the oxidation.