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Polyurethane concrete (PUC), as a new type of steel bridge deck paving material, the bond-slip pattern at the interface with the steel plate is not yet clear. In this study, the mechanical properties of the PUC and steel plate interface under the coupled action of temperature, normal force and tangential force were explored through shear tests and numerical simulations. An analytical model for bond-slip at the PUC/steel plate interface and a predictive model for the shear strength of the PUC/steel plate interface were developed.

The new shear test device designed in this paper overcomes the defect that the traditional oblique shear test cannot test the interface shear performance under the condition of fixed normal force. The universal testing machine (UTM) test machine was used to adjust the test temperature conditions. Combined with the results of the bond-slip test, the finite element simulation of the interface is completed by using the COHENSIVE unit to analyze the local stress distribution characteristics of the interface. The use of variance-based uncertainty analysis guaranteed the validity of the simulation.

The shear strength (τ_f) at the PUC-plate interface was negatively correlated with temperature while it was positively correlated with normal stress. The effect of temperature on the shear properties was more significant than that of normal stress. The slip corresponding to the maximum shear (D₁) positively correlates with both temperature and normal stress. The interfacial shear ductility improves with increasing temperature.

Based on the PUC bond-slip measured curves, the relationship between bond stress and slip at different stages was analyzed, and the bond-slip analytical model at different stages was established; the model was defined by key parameters such as elastic ultimate shear stress τ₀, peak stress τ_f and interface fracture energy G_f.

Due to its inexpensive production costs, low stress concentration and maintenance-friendliness, the adhesive bonded pipe joint is frequently utilized for pipe connection. However, further theoretical analysis is needed to understand the debonding failure mechanism of such bonded pipe joints under axial tension.

In this study, based on the bi-linear cohesive zone model, the integrated closed-form solutions were derived by considering the axial stiffness ratio and failure stage to determine the relative interfacial slip, interfacial shear stress and relationship of tension–displacement in the bonded pipe joint.

Additionally, solutions for the critical bonded length and the ultimate load capacity were put forth. Besides, the numerical study was conducted to verify the theoretical solutions regarding the load–displacement relationship. The interfacial shear stress distribution at different failure stages was presented to understand the interfacial shear stress transmission and debonding process. The effect of bonded length on the ultimate load and ductility of pipe joints was also discussed.

The findings in this study can give a reference for the design of bonded pipe joints in their actual engineering applications.

This paper aims to investigate the effect and mechanism of O atom single doping, Ce and O atoms co-doping on the interfacial microscopic behavior of brazed Ni-Cr/diamond.

Using first-principles calculations, the embedding energy, work of separation, interfacial energy and electronic structures of Ni-Cr-O/diamond and Ni-Cr-O-Ce/diamond interface models were calculated. Then, the effect of Ce and O co-doping was experimentally verified through brazed diamond with CeO₂-added Ni-Cr filler alloy.

The results show that O single-doping reduces the interfacial bonding strength between Ni-Cr filler alloy and diamond but enhances its interfacial stability to some extent. However, the Ce and O co-doping simultaneously enhances the interfacial bonding strength and stability between Ni-Cr filler alloy and diamond. The in-situ formed Ce-O oxide at interface impedes the direct contact between diamond and Ni-Cr filler alloy, which weakens the catalytic effect of Ni element on diamond graphitization. It is experimentally found that the fine rod-shaped Cr₃C₂ and Cr₇C₃ carbides are generated on diamond surface brazed with CeO₂-added Ni-Cr filler alloy. After grinding, the brazed diamond grits, brazed with CeO₂-added Ni-Cr filler alloy, present few fracture and the percentage of intact diamond reaches 67.8%. Compared to pure Ni-Cr filler alloy, the brazed diamond with CeO₂-added Ni-Cr filler alloy exhibit the better wear resistance and the slighter thermal damage.

Using first-principles calculations, the effect of Ce and O atoms co-doping on the brazed diamond with Ni-Cr filler alloy is investigated, and the calculation results are verified experimentally. Through the first-principles calculations, the interface behavior and reaction mechanism between diamond and filler alloy can be well disclosed, and the composition of filler alloy can be optimized, which will be beneficial for synergistically realizing the enhanced interface bonding and reduced thermal damage of brazed diamond.

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

The purpose of this study is to investigate the deposition of SS–Al transitional wall using the wire arc directed energy deposition (WA-DED) process with a Cu interlayer. This study also aims to analyse the metallographic properties of the SS–Cu and Al–Cu interfaces and their mechanical properties.

The study used transitional deposition of SS–Al material over each other by incorporating Cu as interlayer between the two. The scanning electron microscope analysis, energy dispersive X-ray analysis, X-ray diffractometer analysis, tensile testing and micro-hardness measurement were performed to investigate the interface characteristics and mechanical properties of the SS–Al transitional wall.

The study discovered that the WA-DED process with a Cu interlayer worked well for the deposition of SS–Al transitional walls. The formation of solid solutions of Fe–Cu and Fe–Si was observed at the SS–Cu interface rather than intermetallic compounds (IMCs), according to the metallographic analysis. On the other hand, three different IMCs were formed at the Al–Cu interface, namely, Al–Cu, Al₂Cu and Al₄Cu₉. The study also observed the formation of a lamellar structure of Al and Al₂Cu at the hypereutectic phase. The mechanical testing revealed that the Al–Cu interface failed without significant deformation, i.e. < 4.73%, indicating the brittleness of the interface.

The study identified the formation of HCP–Fe at the SS–Cu interface, which has not been previously reported in additive manufacturing literature. Furthermore, the study observed the formation of a lamellar structure of Al and Al2Cu phase at the hypereutectic phase, which has not been previously reported in SS–Al transitional wall deposition.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

Prior to manufacturing, designing plays a vital role in the selection of materials and other design parameters. Therefore, during the deposition of materials, substrate materials provide support and affect the microstructure of the deposits, which may not be desirable in the manufactured product. Hence, the main purpose of the study is to analyse the behaviour of the microstructure at the interface of deposited material and substrate.

In this study, two blocks of Inconel 625 (IN625) and Stainless steel 304L (SS304L) metal powders were deposited on an SS304L substrate using laser directed energy deposition (DED) technique. Deposited blocks comprised 50% IN625 + 50% SS304L or 100% IN625. After deposition, microstructural behaviour at the interface of the deposits and substrates was analysed using different tests such as optical microscopy (OM), microhardness testing, X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). An improvement in microstructure was proposed by performing heat treatment of the deposited sample.

Formation of martensite and precipitates at the interface of the deposit and substrate was observed. Formation of martensite and precipitates such as α, carbide and δ phases were observed in OM and SEM images. Due to the formation of these phases, interface regions showed a peak in the hardness graphs. Post-heat treatment of the samples was one of the solutions to resolve these issues.

This paper suggests the formation of a heat-affected zone (HAZ) at the interface of the deposit and substrate, which may negatively affect the overall utility of the deposited part. The properties of the HAZ were investigated. To suppress these detrimental effects, post-heat treatment of the deposited sample was performed, and the samples were further analysed. The post-heat-treated samples exhibited as reduction in HAZ thickness and had more uniform hardness throughout the cross-section compared with the untreated samples.

The paper aims to introduces an experimental work to investigate the torsional behavior of reinforced concrete (RC) beams strengthened by near-surface mounted (NSM) carbon fiber-reinforced polymer (CFRP) ropes.

In this research, nine rectangular RC beams of 250 mm × 300 mm cross-section and 1,600 mm in length were constructed and tested considering the studied parameters. These parameters include the length of the CFRP rope, the orientation of the CFRP rope, the arrangement of longitudinal and the scheme of NSM-CFRP ropes.

In comparison to control specimens, the results demonstrate a considerable improvement in the torsional response of RC beams strengthened with the CFRP rope. Additionally, specimens strengthened with 90° vertical ropes increase torsional moment capacity more efficiently than specimens strengthened with 45° inclined ropes since the stress concentration leads to premature debonding of the CFRP rope. Whereas RC beams' ability to withstand torsional moments is reduced as the distance between reinforcing CFRP ropes is increased. According to test results, adding CFRP ropes to RC beams' bottoms had a slightly positive impact on torsional response.

This paper fulfills an identified need to study how the using of the CFRP rope is effective in strengthening RC beam subjected to torsion moment.

Understanding the effect of process parameters on interfaces and interfacial bonding between two materials during multi-material additive manufacturing (MMAM) is crucial to the fabrication of high-quality and strong multi-material structures. The purpose of this paper is to conduct an experimental and statistical study to investigate the effect of process parameters of soft and hard materials on the flexural behavior of multi-material structures fabricated via material extrusion-based MMAM.

Sandwich beam samples composed of a soft core and hard shells are fabricated via MMAM under different printing conditions. A design of experiments is conducted to investigate the effect of the print speed and nozzle temperature on the flexural behavior of soft-hard sandwich beams. Analysis of variance and logistic regression analysis are used to analyze the significance of each process parameter. The interfacial morphology of the samples after the flexural tests is characterized. Thermal distributions during the MMAM process are captured to understand the effect of process parameters on the flexural behavior based on inter-bonding formation mechanisms.

Experimental results show that the soft-hard sandwich beams exhibited two different failure modes, including shell failure and interfacial failure. A transition of failure modes from interfacial failure to shell failure is observed as the nozzle temperatures increase. The samples that fail because of interfacial cracking exhibit a pure adhesive failure because of weak interfacial fracture properties. The samples that fail because of shell cracking exhibit a mixed adhesive and cohesive failure. The flexural strength and modulus are affected by the nozzle temperature for the hard material and the print speeds for both hard and soft materials significantly.

This paper first investigates the effect of process parameters for soft and hard materials on the flexural behavior of additively manufactured multi-material structures. Especially, the ranges of the selected process parameters are distinct, and the effect of all possible combinations of the process parameters on the flexural behavior is characterized through a full factorial design of experiments. The experimental results and conclusions of this paper provide guidance for future research on improving the interfacial bonding and understanding the failure mechanism of multi-material structures fabricated by MMAM.

As an efficient self-healing intelligent material, the encapsulation-based self-healing resin mineral composite (SHC) has a broad application prospect.

Aiming at the cracking performance of SHC, the dynamic load condition is employed to replace the traditional static load condition, the initial damage of the material is considered and the triggered cracking process and influencing factors of SHC are analyzed based on the extended finite element method (XFEM). In addition, the mechanism of matrix cracking and microcapsule triggered cracking process is explained from the microscopic point of view, and the cracking performance conditions of SHC are studied. On this basis, the response surface regression analysis method is used to obtain a second-order polynomial model of the microcapsule crack initiation stress, the interface bonding strength and the matching relationship between elastic modulus. Therefore, the model could be used to predict the cracking performance parameters of the microcapsule.

The interfacial bonding strength has an essential effect on the triggered cracking of the microcapsule. In order to ensure that the microcapsule can be triggered cracking normally, the design strength should meet the following relationship, that is crack initiation stress of microcapsule wall < crack initiation stress of matrix < interface bonding strength. Moreover, the matching relationship between elastic modulus has a significant influence on the triggered cracking of the microcapsule.

The results provide a theoretical basis for further oriented designing of the cracking performance of microcapsules.