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Article
Publication date: 22 September 2023

Chen Chen, Liang Zhang, Xi Huang and Xiao Lu

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and…

Abstract

Purpose

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

Design/methodology/approach

This study investigates the effect of adding Si3N4 NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

Findings

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si3N4 NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si3N4 NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si3N4 will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

Originality/value

The Si3N4 NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 15 April 2024

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Zuraihana Bachok, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohamad Riduwan Ramli and Muhamed Abdul Fatah bin Muhamed Mukhtar

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Abstract

Purpose

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Design/methodology/approach

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Findings

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

Practical implications

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Originality/value

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 31 January 2024

Zhenkun Li, Zhili Zhao, Jinliang Liu and Xin Ding

To solve the problems caused by using precise molds for copper column positioning in the current column grid array package, this paper aims to optimize the proposed friction…

Abstract

Purpose

To solve the problems caused by using precise molds for copper column positioning in the current column grid array package, this paper aims to optimize the proposed friction plunge micro-welding (FPMW) technology without mold assistance, to overcome the problems of low interfacial bonding strength, shrinkage cavities and flash defects caused by the low hold-tight force of solder on the copper column.

Design/methodology/approach

A pressurizing device installed under the drill chuck of the friction welding machine is designed, which is used to apply a static constraint to the solder ball obliquely downward to increase the hold-tight force of the peripheral solder on the copper column during welding and promote the friction metallurgical connection between them.

Findings

The results show that the application of static constraint during welding can increase the compactness of the solder near the friction interface and effectively inhibit occurrences of flash, shrinkage cavities and crystal defects such as vacancies. Therefore, compared with the unconstrained (UC) FPMW, the average strength of the statically constrained (SC) FPMW joints and aged SC-FPMW joints can be increased by 51.1% and 122.6%, and the problem of the excessive growth of the interfacial connection layer in the UC-FPMW joints during aging can be effectively avoided.

Originality/value

The application of static constraint effectively inhibits the occurrence of defects such as shrinkage cavities, vacancies and flash in FPMW joints, and the welding quality is significantly improved.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 19 September 2023

Andromeda Dwi Laksono, Chih-Ming Chen and Yee-Wen Yen

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP)…

Abstract

Purpose

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

Design/methodology/approach

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

Findings

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

Originality/value

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 15 February 2024

Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun and Xing-Yu Guo

This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…

Abstract

Purpose

This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

Design/methodology/approach

In this paper, Sn58Bi-xSi3N4 (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

Findings

The experiment results demonstrate that including Si3N4 nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm2, raised by 19.41% relative to those without Si3N4, and the wetting angle was the smallest at 0.6 Wt.% of Si3N4, with a minimum value of 8.35°. When the Si3N4 nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si3N4 nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si3N4 reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si3N4 nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

Originality/value

In this paper, Si3N4 nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si3N4 nanoparticles on Sn58Bi solder were investigated from various aspects.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 20 November 2023

Annada Prasad Moharana, Ratnesh Raj and Amit Rai Dixit

The industrial application of continuous glass fabric-reinforced polymer composites (GFRPCs) is growing; however, the manufacturing boundedness of complex structures and the high…

Abstract

Purpose

The industrial application of continuous glass fabric-reinforced polymer composites (GFRPCs) is growing; however, the manufacturing boundedness of complex structures and the high cost of molds restrict their use. This research proposes a three-dimensional (3 D) printing process for GFRPCs that allows low-cost and rapid fabrication of complex composite parts.

Design/methodology/approach

The composite is manufactured using a digital light processing (DLP) based Vat-photopolymerization (VPP) process. For the composites, suitable resin material and glass fabrics are chosen based on their strength, stiffness, and printability. Jacob's working curve characterizes the curing parameters for adequate adhesion between the matrix and fabrics. The tensile and flexural properties were examined using UTM. The fabric distribution and compactness of the cured resin were analyzed in scanning electron microscopy.

Findings

The result showed that the object could print at a glass fabric content of 40 volume%. In DLP-based VPP printing technology, the adequate exposure time was found to be 30 seconds for making a GFRPC. The tensile strength and Young's modulus values were increased by 5.54 and 8.81 times, respectively than non-reinforced cured specimens. The flexural strength and modulus were also effectively increased to 2.8 and 3 times more than the neat specimens. In addition, the process is found to help fabricate the functional component.

Originality/value

The experimental procedure to fabricate GFRPC specimens through DLP-based AM is a spectacular experimental approach.

Article
Publication date: 27 February 2024

Jacques Abou Khalil, César Jiménez Navarro, Rami El Jeaid, Abderahmane Marouf, Rajaa El Akoury, Yannick Hoarau, Jean-François Rouchon and Marianna Braza

This study aims to investigate the morphing concepts able to manipulate the dynamics of the downstream unsteadiness in the separated shear layers and, in the wake, be able to…

Abstract

Purpose

This study aims to investigate the morphing concepts able to manipulate the dynamics of the downstream unsteadiness in the separated shear layers and, in the wake, be able to modify the upstream shock–boundary layer interaction (SBLI) around an A320 morphing prototype to control these instabilities, with emphasis to the attenuation or even suppression of the transonic buffet. The modification of the aerodynamic performances according to a large parametric study carried out at Reynolds number of 4.5 × 106, Mach number of 0.78 and various angles of attack in the range of (0, 2.4)° according to two morphing concepts (travelling waves and trailing edge vibration) are discussed, and the final benefits in aerodynamic performance increase are evaluated.

Design/methodology/approach

This article examines through high fidelity (Hi-Fi) numerical simulation the effects of the trailing edge (TE) actuation and of travelling waves along a specific area of the suction side starting from practically the most downstream position of the shock wave motion according to the buffet and extending up to nearly the TE. The present paper studies through spectral analysis the coherent structures development in the near wake and the comparison of the aerodynamic forces to the non-actuated case. Thus, the physical mechanisms of the morphing leading to the increase of the lift-to-drag ratio and the drag and noise sources reduction are identified.

Findings

This study investigates the influence of shear-layer and near-wake vortices on the SBLI around an A320 aerofoil and attenuation of the related instabilities thanks to novel morphing: travelling waves generated along the suction side and trailing-edge vibration. A drag reduction of 14% and a lift-to-drag increase in the order of 8% are obtained. The morphing has shown a lift increase in the range of (1.8, 2.5)% for angle of attack of 1.8° and 2.4°, where a significant lift increase of 7.7% is obtained for the angle of incidence of 0° with a drag reduction of 3.66% yielding an aerodynamic efficiency of 11.8%.

Originality/value

This paper presents results of morphing A320 aerofoil, with a chord of 70cm and subjected to two actuation kinds, original in the state of the art at M = 0.78 and Re = 4.5 million. These Hi-Fi simulations are rather rare; a majority of existing ones concern smaller dimensions. This study showed for the first time a modified buffet mode, displaying periodic high-lift “plateaus” interspersed by shorter lift-decrease intervals. Through trailing-edge vibration, this pattern is modified towards a sinusoidal-like buffet, with a considerable amplitude decrease. Lock-in of buffet frequency to the actuation is obtained, leading to this amplitude reduction and a drastic aerodynamic performance increase.

Details

International Journal of Numerical Methods for Heat & Fluid Flow, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0961-5539

Keywords

Article
Publication date: 9 January 2024

Yunfei Zou

This study aims to enhance the understanding of fiber-reinforced polymer (FRP) applications in partially confined concrete, with a specific focus on improving economic value and…

Abstract

Purpose

This study aims to enhance the understanding of fiber-reinforced polymer (FRP) applications in partially confined concrete, with a specific focus on improving economic value and load-bearing capacity. The research addresses the need for a more comprehensive analysis of non-uniform vertical strain responses and precise stress–strain models for FRP partially confined concrete.

Design/methodology/approach

DIC and strain gauges were employed to gather data during axial compression tests on FRP partially confined concrete specimens. Finite element analysis using ABAQUS was utilized to model partial confinement concrete with various constraint area ratios, ranging from 0 to 1. Experimental findings and simulation results were compared to refine and validate the stress–strain model.

Findings

The experimental results revealed that specimens exhibited strain responses characterized by either hardening or softening in both vertical and horizontal directions. The finite element analysis accurately reflected the relationship between surface constraint forces and axial strains in the x, y and z axes under different constraint area ratios. A proposed stress–strain model demonstrated high predictive accuracy for FRP partially confined concrete columns.

Practical implications

The stress–strain curves of partially confined concrete, based on Teng's foundation model for fully confined stress–strain behavior, exhibit a high level of predictive accuracy. These findings enhance the understanding of the mechanical behavior of partially confined concrete specimens, which is crucial for designing and assessing FRP confined concrete structures.

Originality/value

This research introduces innovative insights into the superior convenience and efficiency of partial wrapping strategies in the rehabilitation of beam-column joints, surpassing traditional full confinement methods. The study contributes methodological innovation by refining stress–strain models specifically for partially confined concrete, addressing the limitations of existing models. The combination of experimental and simulated assessments using DIC and FEM technologies provides robust empirical evidence, advancing the understanding and optimization of FRP-concrete structure performance. This work holds significance for the broader field of concrete structure reinforcement.

Details

International Journal of Structural Integrity, vol. 15 no. 2
Type: Research Article
ISSN: 1757-9864

Keywords

Article
Publication date: 5 February 2024

Dongsheng Wang, Xiaohan Sun, Yingchang Jiang, Xueting Chang and Xin Yonglei

Stainless-clad bimetallic steels (SCBS) are widely investigated in some extremely environmental applications areas, such as polar sailing area and tropical oil and gas platforms…

Abstract

Purpose

Stainless-clad bimetallic steels (SCBS) are widely investigated in some extremely environmental applications areas, such as polar sailing area and tropical oil and gas platforms areas, because of their excellent anticorrosion performance and relatively lower production costs. However, the properties of SCBS, including the mechanical strength, weldability and the anticorrosion behavior, have a direct relation with the manufacturing process and can affect their practical applications. This paper aims to review the application and the properties requirements of SCBS in marine environments to promote the application of this new material in more fields.

Design/methodology/approach

In this paper, the manufacturing process, welding and corrosion-resistant properties of SCBS were introduced systematically by reviewing the related literatures, and some results of the authors’ research group were also introduced briefly.

Findings

Different preparation methods, such as rolling composite, casting rolling composite, explosive composite, laser cladding and plasma arc cladding, as well as the process parameters, including the vacuum degree, rolling temperature, rolling reduction ratio, volume ratios of liquid to solid, explosive ratio and the heat treatment, influenced a lot on the properties of the SCBS through changing the interface microstructures. Otherwise, the variations in rolling temperature, pass, reduction and the grain size of clad steel also brought the dissimilarities of the mechanical properties, microhardness, bonding strength and toughness. Another two new processes, clad teeming method and interlayer explosive welding, deserve more attention because of their excellent microstructure control ability. The superior corrosion resistance of SCBS can alleviate the corrosion problem in the marine environment and prolong the service life of the equipment, but the phenomenon of galvanic corrosion should be noted as much as possible. The high dilution rate, welding process specifications and heat treatment can weaken the intergranular corrosion resistance in the weld area.

Originality/value

This paper summarizes the application of SCBS in marine environments and provides an overview and reference for the research of stainless-clad bimetallic steel.

Details

Anti-Corrosion Methods and Materials, vol. 71 no. 2
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 27 November 2023

Meng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu and Yuan Tao

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

Abstract

Purpose

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

Design/methodology/approach

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

Findings

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

Originality/value

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

Details

Soldering & Surface Mount Technology, vol. 36 no. 1
Type: Research Article
ISSN: 0954-0911

Keywords

1 – 10 of 72