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Assembling items to achieve bigger parts seems to be the solution to counterbalance the dimension limits of 3D printing. This work aims to propose an approach to achieve optimal assembling.

Acrylonitrile butadiene styrene polymer samples were printed using fused deposition modelling (FDM). These samples were assembled and the precise contribution of interfacial shearing and tension was measured using simple tensile experiments.

The results achieved show the correlation between the printing orientation and the assembling angle. It could be proved that rupture by an interfacial decohesion mechanism of glued parts can be avoided by simple adaptation of the assembling junction.

Design of large parts using FDM is no more a limitation if assembling configurations are adapted based on the knowledge gained about the interfacial phenomena occurring at the junction position.

The unbalanced contribution of shearing and tension at the interface defines new assembling profiles that exclude flat junctions.

The purpose of this study is to obtain the numerical as well as regularity results for the nonlinear elliptic set of equations arising in the study of fluid flow in microchannel induced by the pressure in the presence of interfacial electrokinetic effects.

For the numerical study, the authors implemented traditional FDM approach, and for the regularity results they used the classical energy estimates. The interfacial electrokinetic effects result in an additional source term in classical momentum equation, hence affecting the characteristics of the flow and heat transfer. The sinusoidal temperature variation is assumed on side walls.

The results were obtained for various combinations of physical parameters appearing in the governing equations. This study concludes that in the presence of electric double layer, the average heat transfer rate reduces along with larger values of Reynolds number. It is observed that the heat transfer increases with the increase in amplitude ratio and phase deviation. The flow behavior and heat transfer rate inside the microchannel are also strongly affected by the presence of κ (kappa).

To the best of the authors’ knowledge, the problem of heat transfer through microchannel in combination with sinusoidal temperature variation at boundary with electric double layer effects has not been considered previously. Hence, this paper focuses on the influence of the sinusoidal boundary temperature distributions on both sidewalls of a rectangular microchannel through parallel plates with electrokinetic effects on the pressure-driven laminar flow. In addition, a detailed mathematical analysis is also to be carried out to verify the regularity of this model with the proposed boundary conditions. The study used the classical energy method to get the regularity results.

An overview has been presented on the topic of alternative surface finishes for package I/Os and circuit board features. Aspects of processability and solder joint reliability were described for the following coatings: baseline hot‐dipped, plated, and plated‐and‐fused 100Sn and Sn‐Pb coatings; Ni/Au; Pd, Ni/Pd, and Ni/Pd/Au finishes; and the recently marketed immersion Ag coatings. The Ni/Au coatings appear to provide the all‐around best options in terms of solderability protection and wire bondability. Nickel/Pd finishes offer a slightly reduced level of performance in these areas which is most likely due to variable Pd surface conditions. It is necessary to minimize dissolved Au or Pd contents in the solder material to prevent solder joint embrittlement. Ancillary aspects that include thickness measurement techniques; the importance of finish compatibility with conformal coatings and conductive adhesives; and the need for alternative finishes for the processing of non‐Pb bearing solders are discussed.

To review, analyze and present the effects of the contact‐fluid interfacial shear strength and contact‐fluid interfacial slippage and the critical importance of these effects in elastohydrodynamic lubrication (EHL).

The experimental and theoretical research results of the contact‐fluid interfacial shear strength and its caused contact‐fluid interfacial slippage in hydrodynamic lubrication and especially in EHL obtained in the past decades and progressed in recent years by the present author and by others are reviewed. Analysis and presentation are made on both the contact‐fluid interfacial shear strength versus fluid pressure curve for a given bulk fluid temperature in an isothermal EHL and the influence of the bulk fluid temperature on this curve.

It is very clearly and well understood from the present paper that the value of the contact‐fluid interfacial shear strength in the inlet zone in an EHL contact, i.e. at low EHL fluid film pressures is usually low and usually has rather a weak dependence on the EHL fluid film pressure. This proves the correctness of the EHL theories previously developed by the author based on the assumption of this low value and dependence on the EHL fluid film pressure of the contact‐fluid interfacial shear strength. It is also very clearly understood that the bulk fluid temperature usually has a strong influence on the value of the contact‐fluid interfacial shear strength in EHL and the increase of this temperature usually significantly reduces the value of the contact‐fluid interfacial shear strength in EHL.

A very useful material for the engineers who are engaged in the design of EHL on gears, cams and roller bearings, and for the tribology scientists who thrust efforts in studying EHL and mixed EHL both by theoretical modeling and by experiments.

A new and generalized mode of mixed EHL is originally proposed by incorporating the finding of a more realistic mode of the contact regimes in a practical mixed EHL based on the contact‐fluid interfacial shear strength and contact‐fluid interfacial slippage effects. This mode of mixed EHL should become the direction of the theoretical research of mixed EHL in the future.

The purpose of this paper is to study the interfacial effect on mechanical properties of the cellulose nano crystal (CNC)–shape memory polymer (SMP) composites by using combination of the theoretical and experimental approaches.

SMP composites were fabricated by introducing CNCs into crystalline shape memory polyurethane. The morphological, thermal and mechanical properties were comprehensively investigated. Theoretical approach based upon the percolation model was used to simulate the storage modulus E’ variation of the composites in crystalline and amorphous states, respectively. The classic two-phase percolation model was used for the amorphous-state composites. Furthermore, a three-phase model consisting of interfacial regions was created for the crystalline-state composites.

The deviation of nano fillers mechanical reinforcements was disclosed as the composites triggered thermal transitions. Modified percolation theory involving the interfacial effects greatly enhanced the simulation accuracy.

The study made the traditional percolating theory suitable for dynamic modulus and polymorphs polymers in terms of mechanics, which may extend the potential application.

The findings may greatly benefit the development of novel interfacial reinforcing theory and intelligent polymeric nanocomposites featuring polymorphs and dynamic properties.

The purpose of this paper is to develop a new improved solution and a new model to predict both shear and normal interfacial stress in simply supported beams strengthened with bonded prestressed FRP laminates by taking into account the fiber volume fraction spacing that play an important role on the interfacial stresses concentration.

The study has been conducted by using analytical approaches for interfacial stresses in plated beams. The analysis is based on the deformation compatibility approach where both the shear and normal stresses are assumed to be invariant across the adhesive layer thickness. In addition, an unrealistic restriction of the same curvatures in the RC beam and FRP panel commonly used in most of the existing studies is released in the present theoretical formulation.

To verify the analytical model, the present predictions are compared first with those of (Malek et al., 1998; Smith and Teng, 2001) in the case of the absence of the prestressing force; for the second time, the present method is compared with that developed by (Al-Emrani and Kliger, 2006; Benachour et al., 2008) in the case where only the prestressing force is applied. From the presented results, it can be seen that the present solution agree closely with the other methods in the literature.

The paper puts in evidence a new originality approach theory, taking into account the mechanical load, and the prestressed FRP plate model having variable fiber spacing which considers a strength rigidity and resistance of the damaged structures, which is one aspect that has not been taken into account by the previous studies.

The purpose of this paper is to implement the numerical analysis based on finite volume method to compare the effects of stress-jump (SJ) and stress-continuity (SC) conditions on flow structure around and through a porous circular cylinder.

In this study, a steady flow of a viscous, incompressible fluid around and through a porous circular cylinder of diameter “D,” using Darcy-Brinkman-Forchheimer’s equation in the porous region, is discussed. The SJ condition proposed by Ochoa-Tapia and Whitaker is applied at the porous-fluid interface and compared with the traditional interfacial condition based on the SC condition in fluid and porous media. Equations with the relevant boundary conditions are numerically solved using a finite volume approach. In this study, Reynolds and Darcy numbers are varied within the ranges of 1 < Re < 40 and 10-7 < Da < 10-2, respectively, and the porosities are e=0.45, 0.7 and 0.95.

Results show that the SJ condition leads to a much smaller boundary layer within porous medium near the interface as compared to the SC condition. Two interfacial conditions yield similar results with decrease in porosity.

There is no published research in the literature about the effects of important parameters, such as Porosity and Darcy numbers on different fluid-porous interface conditions for a porous cylinder and comparison the effects of SJ and SC conditions on flow structure around and through a porous circular cylinder.

The sustainability of the structures is not only a technical goal, but also a matter of social and environmental values. This requires the researchers to use very rigid, highly durable and corrosion-resistant composite structures in order to achieve the technical, environmental and social goals. The purpose of this paper is to present an original work on reducing the interfacial stresses of bonded structures with fibre-reinforced polymers (FRP) plates based on new taper design.

In this proposed concept, the effect of combined taper is investigated on reducing interfacial stresses, attempting to enhance the structure performance and address the debonding problem that comes with reinforcing techniques. This research is carried out by using finite element analysis, incorporating many new parameters.

As a result, a new solution is discovered that combined taper in both adhesive layer and composite laminate, which significantly reduces the interfacial stresses at the end of the FRP plate. Additionally, a parametric study is carried out in order to determine the optimal configurations of taper dimensions as well as other parameters that influence the stress concentration distribution at the edge of the adherends.

This new design regarding the reduction of interfacial stresses will help in increasing the lifespan of damaged structures reinforced by FRP composites, preserving thus its technical, historical and social values.

The paper uses straight, concave and convex fillets with inverse taper as a new design solution with new parameters including thermo-mechanical loads and pre-stressed FRP plate with multi-layer, fibre orientation and shear-lag effects.

The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni₃Sn₄ phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn₄ phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni₃Sn₄ phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni₃Sn₄ layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn₄ layer.

The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study.

Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni₃Sn₄ phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn₄ phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates.

In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu substrate during multiple reflow.

The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250°C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma‐optical emission spectroscopy (ICP‐OES). The wetting behavior of the solders was characterized by analyzing the contact angles and spreading rates according to the Japanese Industrial Standard (JIS 23198‐3, 2003). The interfacial microstructure of the solder joints were investigated by field emission scanning electron microscope (FESEM) and energy dispersive X‐ray spectroscopy (EDAX).

It was found that upon the addition of 0.3 wt% Zn nanoparticles to the SAC solder, the growth of interfacial intermetallic compound (IMC) layers was retarded to a minimum value. Excessive amount of Zn nanoparticles (0.8 wt%) induced an additional IMC layer (Cu₅Zn₈) which increased the total IMC thickness and raising the reliability issue.

It is concluded that Zn nanoparticles undergo melting/reaction during reflow and impart their effect on the IMCs through alloying effects.