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The purpose of this paper is to discuss polyester fabric structures in terms of the surface morphology, crystal structure of copper films and interfacial bonding properties between polyester fabrics and copper films.

Nanoscale copper (Cu) thin films were deposited onto the surface of polyester fabrics with different structures by the radio frequency magnetron sputtering technique at room temperature.

Copper films uniformly deposited on the surface of the polyester nonwovens and nanofiber membranes have larger average particle diameters and surface roughness, and higher crystallinity.

Theoretical value: the effects of polyester substrate structures on the morphology and interfacial bonding properties of Cu thin films have rarely been reported.

The purpose of this study is to understand the behavior of hybrid bio-composites under varied applications.

Fabrication methods and material characterization of various hybrid bio-composites are analyzed by studying the tensile, impact, flexural and hardness of the same. The natural fiber is a manufactured group of assembly of big or short bundles of fiber to produce one or more layers of flat sheets. The natural fiber-reinforced composite materials offer a wide range of properties that are suitable for many engineering-related fields like aerospace, automotive areas. The main characteristics of natural fiber composites are durability, low cost, low weight, high specific strength and equally good mechanical properties.

The tensile properties like tensile strength and tensile modulus of flax/hemp/sisal/Coir/Palmyra fiber-reinforced composites are majorly dependent on the chemical treatment and catalyst usage with fiber. The flexural properties of flax/hemp/sisal/coir/Palmyra are greatly dependent on fiber orientation and fiber length. Impact properties of flax/hemp/sisal/coir/Palmyra are depended on the fiber content, composition and orientation of various fibers.

This study is a review of various research work done on the natural fiber bio-composites exhibiting the factors to be considered for specific load conditions.

The purpose of this paper is to investigate the efficiencies of argon (Ar), oxygen (O₂) and O₂ followed by Ar (O₂→Ar) plasma treatments in terms of contaminant removal and wire bond interfacial adhesion improvement. The aim of this study is to resolve the “lifted ball bond” issue, which is one of the critical reliability checkpoints for light emitting diodes (LEDs) in automotive applications.

Ar, O₂ and O₂→Ar plasma treatments were applied to LED chip bond pad prior to wire bonding process with different treatment durations. Various surface characterization methods and contact angle measurement were then used to characterize the surface properties of these chip bond pads. To validate the improvements of Ar, O₂ and O₂→Ar plasma treatments to the wire bond interfacial adhesion, the chip bond pads were wire bonded and examined with a ball shear test. Moreover, the contact resistance of the wire bond interfaces was also measured by using four-point probe electrical measurements to complement the interfacial adhesion validation.

Surface characterization results show that O₂→Ar plasma treatment was able to remove the contaminant while maintaining relatively low oxygen impurity content on the bond pad surface after the treatment and was more effective as compared with the O₂ and Ar plasma treatments. However, O₂→Ar plasma treatment also simultaneously reduced high-polarity bonds on the chip bond pad, leading to a lower surface free energy than that with the O₂ plasma treatment. Ball shear test and contact resistance results showed that wire bond interfacial adhesion improvement after the O₂→Ar plasma treatment is lower than that with the O₂ plasma treatment, although it has the highest efficiency in surface contaminant removal.

To resolve “lifted ball bond” issue, optimization of plasma gas composition ratios and parameters for respective Ar and O₂ plasma treatments has been widely reported in many literatures; however, the O₂→Ar plasma treatment is still rarely focused. Moreover, the observation that wire bond interfacial adhesion improvement after O₂→Ar plasma treatment is lower than that with the O₂ plasma treatment although it has the highest efficiency in surface contaminant removal also has not been reported on similar studies elsewhere.

The purpose of this study is to investigate surface treatments and fiber types on adhesion properties polylactic acid (PLA) three-dimensional (3D) parts printed on woven fabrics.

The cotton, flax and jute fabrics were exposed to alkali, hydrogen peroxide, stearic acid and ionic liquid treatments to modify surface characteristics before PLA 3D printing. The modification efficiency was assessed with Fourier transform infrared spectroscopy (FTIR) and scanning electron microscope (SEM) analyses. Then, fused deposition modeling (FDM) printer and PLA filament were used for 3D printing onto the untreated and treated fabrics. The adhesion strength between the fabrics and PLA 3D parts were tested according to DIN 53530 via universal tensile tester.

The fabric structure is effective on adhesion force and greater values were observed for plain weave fabrics. Maximum separation forces were obtained for alkali pretreated fabrics among jute and cotton. Hydrogen peroxide treatment also increased adhesion forces for jute and cotton fabrics while decreasing for flax fabrics. Stearic acid and ionic liquid treatments reduced adhesion forces compared to untreated fabrics. Treatments are effective to alter adhesion via changing surface chemistry, surface morphology and fabric physical properties but display different effects related to fabric material.

This study provides experimental information about effects of different fiber types and surface treatments on adhesion strength of PLA 3D parts. There is limited research about comprehensive observation on 3D printing on cellulosic-woven fabrics.

The purpose of this paper is to investigate the effects of alkali treatment on adhesion of industrial thermoplastic polyurethane elastomer (TPU)/polyester woven fabric inter-ply hybrid composites.

Inter-ply hybrid composites were exposed to varying concentration of sodium hydroxide at different temperature and time and their mechanical properties including differential scanning calorimetry, scanning electron microscope, tensile and peeling strength evaluated to determine optimal treatment parameters.

Modified polyester fabrics treated with alkali had higher tensile and peeling strengths. Accordingly, alkali treatment roughened the surface of polyester fabric, decreasing warp and weft densities, thus increasing fiber surface energy. The fabric had the highest peeling strength of 3.23 N/mm at treatment of 25% concentration of sodium hydroxide (NaOH). Short-term exposure to ultraviolet had little effect on interfacial adhesion of alkali-treated conveyor belt.

Polyester fabric, applied in reinforcing industrial conveyor belts, is never degreased, roughened, sensitized or activated. In this paper, one-step treatment of polyester fabric was performed to increase its adhesion with polyester inter-ply hybrid composites, providing a reference for practical industrial application.

The method developed in this research is simple and provides a solution to improving the interfacial adhesion of TPU/polyester conveyor belt.

The novel alkali treatment technology has many applications in the interfacial performance of composite materials.

Understanding the effect of process parameters on interfaces and interfacial bonding between two materials during multi-material additive manufacturing (MMAM) is crucial to the fabrication of high-quality and strong multi-material structures. The purpose of this paper is to conduct an experimental and statistical study to investigate the effect of process parameters of soft and hard materials on the flexural behavior of multi-material structures fabricated via material extrusion-based MMAM.

Sandwich beam samples composed of a soft core and hard shells are fabricated via MMAM under different printing conditions. A design of experiments is conducted to investigate the effect of the print speed and nozzle temperature on the flexural behavior of soft-hard sandwich beams. Analysis of variance and logistic regression analysis are used to analyze the significance of each process parameter. The interfacial morphology of the samples after the flexural tests is characterized. Thermal distributions during the MMAM process are captured to understand the effect of process parameters on the flexural behavior based on inter-bonding formation mechanisms.

Experimental results show that the soft-hard sandwich beams exhibited two different failure modes, including shell failure and interfacial failure. A transition of failure modes from interfacial failure to shell failure is observed as the nozzle temperatures increase. The samples that fail because of interfacial cracking exhibit a pure adhesive failure because of weak interfacial fracture properties. The samples that fail because of shell cracking exhibit a mixed adhesive and cohesive failure. The flexural strength and modulus are affected by the nozzle temperature for the hard material and the print speeds for both hard and soft materials significantly.

This paper first investigates the effect of process parameters for soft and hard materials on the flexural behavior of additively manufactured multi-material structures. Especially, the ranges of the selected process parameters are distinct, and the effect of all possible combinations of the process parameters on the flexural behavior is characterized through a full factorial design of experiments. The experimental results and conclusions of this paper provide guidance for future research on improving the interfacial bonding and understanding the failure mechanism of multi-material structures fabricated by MMAM.

Due to the non-polar nature of ultrahigh molecular weight polyethylene (UHMWPE), surface modification was needed to improve the adhesion of UHMWPE fibers. In this paper, UHMWPE gel fibers were treated with a solution of polar polymer during the extracting process, then the modified UHMWPE fibers were made after multi-step hot drawing. The physical and chemical changes in the fiber structure were examined with scanning electron microscopy and Fourier transform infrared absorption spectroscopy. The mechanical properties and interfacial adhesion properties of modified UHMWPE fibers were investigated with tensile testing. The results showed that polar groups were introduced into the surface of UHMWPE fiber during the treatment process; this could improve the interfacial shear strength of UHMWPE fibers without damaging the excellent mechanical properties of fibers. The interfacial shear strength of UHMWPE fiber with epoxy resin increased with increasing draw ratio. It was shown that ethylene/vinyl acetate copolymer (EVA) is an effective modifier. After modification, the shear strength of the interface between the modified UHMWPE fiber and epoxy increased by 100%, and the integrated mechanical properties of the modified UHMWPE fibers were also optimum.

In flip‐chip interconnection on organic substrates using eutectic tin/lead solder bumps, a highly reliable under bump metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1μm Al/0.2μm Ti/5μm Cu, 1μm Al/02μm Ti/1μm Cu, 1μm Al/0.2μm Ni/1μm Cu and 1μm Al/0.2μm Pd/1μm Cu, applied under eutectic tin/lead solder bumps, have been investigated with regard to their interfacial reactions and adhesion properties. The effects of the number of solder reflow cycles and the aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1μm Al/0.2μm Ti5μm Cu and 1μm Al/0.2μm Ni/1μm Cu even after four solder reflows or seven‐day aging at 150∞C. In contrast, 1μm Al/0.2μm Ti/1μm Cu and 1μm Al/0.2μm Pd/1μm Cu showed poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and non‐wettable metals such as Ti and AL, resulting in a delamination. In this case, thin 1μm Cu and 0.2μm Pd diffusion barrier layers were completely consumed by Cu‐Sn and Pd‐Sn reaction.

The purpose of this paper is to investigate the reliability of wire bonds with three varying ball bond diameters, which are ball bonded with three different sizes of gold wires in light-emitting diode (LED) package under high-temperature environment. In automotive applications, “lifted ball bond” issue is a potential critical point for LED device reliability, as the wire bonds are usually stressed under high operating temperature during their lifetime. Moreover, the reliability of wire bonds in recent LED production has fallen under scrutiny due to the practice of reducing wire diameters to cut down production costs.

Three gold wires with sizes of 2, 1.5 and 1 mm were ball bonded on the LED chip bond pad via thermosonic wire bonding method to produce three different ball bond diameters, that is, 140, 120 and 100 μm, respectively. The reliability of these wire bond samples was then studied by performing isothermal aging at 200°C for the time interval of 30, 100 and 500 hours. To validate hypotheses based on the experimental data, COMSOL Multiphysics simulation was also applied to study the thermal stress distribution of wire bond under an elevated temperature.

Experimental results show that the interfacial adhesion of wire bond degrades significantly after aging at 200°C for 500 hours, and the rate of interfacial degradation was found to be more rapid in the wire bond with smaller ball bond diameter. Experimental results also show that ball bonds randomly elongate along an axis and deforms into elliptical shapes after isothermal aging, and ball bonds with smaller diameters develop more obvious elongations. This observation has not been reported in any previous studies. Simulation results show that higher thermal stress is induced in the wire bond with the decrease of ball bond diameter.

The reliability study of this paper provides measurements and explanation on the effects of wire diameter downsizing in wire bonds for automotive application. This is applicable as a reliability reference for industries who intend to reduce their production costs. Other than that, the analysis method of thermal stresses using COMSOL Multiphysics simulations can be extended by other COMSOL Multiphysics users in the future.

To resolve “lifted ball bond” issue, optimization of the bond pad surface quality and the wire bond parameter has been studied and reported in many studies, but the influence of ball bond diameter on wire bond reliability is rarely focused. Moreover, the observation of ball bonds randomly elongate and deform more into elliptical shape, and ball bond with smaller diameter has the highest elongation after isothermal aging also still has not been reported in any previous studies.