Search results

It is well known that stress singularity may exist at the edges of a bonded bi‐material interface due to the discontinuity of material properties. This stress singularity causes difficulty in accurately determining the bi‐material interface bonding strength. This paper aims to present a new design of specimen geometry to eliminate the stress singularity and present an experimental procedure to more accurately determine the bonding strength of the bi‐material interface.

The design is based on an asymptotic analysis of the stress field near the free edge of bi‐material interface. The critical bonding angle, which delineates the singular and non‐singular stress field near the free edge, is determined.

With the new designed specimen and a special iterative calculation algorithm, the interface bonding strength envelope of an epoxy‐aluminum interface was experimentally determined.

This new design of specimen, experimental procedure and iterative algorithm may be applied to obtain more reasonable and accurate bonding strength data for a wide range of bi‐material interfaces.

The purpose of this paper is to study the effects of these major parameters, including layer thickness, deposition velocity and infill rate, on product’s mechanical properties and explore the quantitative relationship between these key parameters and tensile strength of the part.

A VHX-1000 super-high magnification lens zoom three-dimensional (3D) microscope is utilized to observe the bonding degree between filaments. A temperature sensor is embedded into the platform to collect the temperature of the specimen under different parameters and the bilinear elastic-softening cohesive zone model is used to analyze the maximum stress that the part can withstand under different interface bonding states.

The tensile strength is closely related to interface bonding state, which is determined by heat transition. The experimental results indicate that layer thickness plays the predominant role in affecting bonding strength, followed by deposition velocity and the effect of infill rate is the weakest. The numerical analysis results of the tensile strength predict models show a good coincidence with experimental data under the elastic and elastic-softened interface states, which demonstrates that the tensile strength model can predict the tensile strength exactly and also reveals the work mechanism of these parameters on tensile strength quantitatively.

The paper establishes the quantitative relationship between main parameters including layer thickness, infill rate and deposition velocity and tensile strength for the first time. The numerically analyzed results of the tensile strength predict model show a good agreement with the experimental result, which demonstrates the effectiveness of this predict model. It also reveals the work mechanism of the parameters on tensile strength quantitatively for the first time.

The purpose of this study is to propose the use of a pre-deposition heating system for fused filament fabrication (FFF) as a means to enhance interlayer bonding by elevating the substrate temperature. The effects of the heating on thermal profile at the bonding interface and the mechanical properties of three-dimensional printed parts are investigated.

A 12-W laser head is integrated to a commercial printer as the pre-deposition heating system. The laser beam heats up substate before the deposition of a fresh filament. Effects of laser powers are investigated and the thermal profile is measured with thermocouple, infrared camera and finite element model. The correlation between the temperature at the bonding interface and the bonding quality is investigated by conducting tensile testing and neck width measurement with microscope.

The pre-deposition heating system is proven to be effective in enhancing the inter-layer strength in FFF parts. Tensile testing of specimens along build direction (Z) shows an increase of around 50% in ultimate strength. A linear relationship is observed between the pre-deposition temperature at bond interface and bonding strength. It is evident that elevating the pre-deposition temperature promotes interlayer polymer diffusion as shown by the increased neck width between layers.

Thermocouples that are sandwiched between layers are used to achieve accurate measurement of the interfacial temperature. The temperature profiles under pre-deposition heating are analyzed and correlated to the interlayer bonding strengths.

This paper aims to investigate the effect and mechanism of O atom single doping, Ce and O atoms co-doping on the interfacial microscopic behavior of brazed Ni-Cr/diamond.

Using first-principles calculations, the embedding energy, work of separation, interfacial energy and electronic structures of Ni-Cr-O/diamond and Ni-Cr-O-Ce/diamond interface models were calculated. Then, the effect of Ce and O co-doping was experimentally verified through brazed diamond with CeO₂-added Ni-Cr filler alloy.

The results show that O single-doping reduces the interfacial bonding strength between Ni-Cr filler alloy and diamond but enhances its interfacial stability to some extent. However, the Ce and O co-doping simultaneously enhances the interfacial bonding strength and stability between Ni-Cr filler alloy and diamond. The in-situ formed Ce-O oxide at interface impedes the direct contact between diamond and Ni-Cr filler alloy, which weakens the catalytic effect of Ni element on diamond graphitization. It is experimentally found that the fine rod-shaped Cr₃C₂ and Cr₇C₃ carbides are generated on diamond surface brazed with CeO₂-added Ni-Cr filler alloy. After grinding, the brazed diamond grits, brazed with CeO₂-added Ni-Cr filler alloy, present few fracture and the percentage of intact diamond reaches 67.8%. Compared to pure Ni-Cr filler alloy, the brazed diamond with CeO₂-added Ni-Cr filler alloy exhibit the better wear resistance and the slighter thermal damage.

Using first-principles calculations, the effect of Ce and O atoms co-doping on the brazed diamond with Ni-Cr filler alloy is investigated, and the calculation results are verified experimentally. Through the first-principles calculations, the interface behavior and reaction mechanism between diamond and filler alloy can be well disclosed, and the composition of filler alloy can be optimized, which will be beneficial for synergistically realizing the enhanced interface bonding and reduced thermal damage of brazed diamond.

Due to its inexpensive production costs, low stress concentration and maintenance-friendliness, the adhesive bonded pipe joint is frequently utilized for pipe connection. However, further theoretical analysis is needed to understand the debonding failure mechanism of such bonded pipe joints under axial tension.

In this study, based on the bi-linear cohesive zone model, the integrated closed-form solutions were derived by considering the axial stiffness ratio and failure stage to determine the relative interfacial slip, interfacial shear stress and relationship of tension–displacement in the bonded pipe joint.

Additionally, solutions for the critical bonded length and the ultimate load capacity were put forth. Besides, the numerical study was conducted to verify the theoretical solutions regarding the load–displacement relationship. The interfacial shear stress distribution at different failure stages was presented to understand the interfacial shear stress transmission and debonding process. The effect of bonded length on the ultimate load and ductility of pipe joints was also discussed.

The findings in this study can give a reference for the design of bonded pipe joints in their actual engineering applications.

As an efficient self-healing intelligent material, the encapsulation-based self-healing resin mineral composite (SHC) has a broad application prospect.

Aiming at the cracking performance of SHC, the dynamic load condition is employed to replace the traditional static load condition, the initial damage of the material is considered and the triggered cracking process and influencing factors of SHC are analyzed based on the extended finite element method (XFEM). In addition, the mechanism of matrix cracking and microcapsule triggered cracking process is explained from the microscopic point of view, and the cracking performance conditions of SHC are studied. On this basis, the response surface regression analysis method is used to obtain a second-order polynomial model of the microcapsule crack initiation stress, the interface bonding strength and the matching relationship between elastic modulus. Therefore, the model could be used to predict the cracking performance parameters of the microcapsule.

The interfacial bonding strength has an essential effect on the triggered cracking of the microcapsule. In order to ensure that the microcapsule can be triggered cracking normally, the design strength should meet the following relationship, that is crack initiation stress of microcapsule wall < crack initiation stress of matrix < interface bonding strength. Moreover, the matching relationship between elastic modulus has a significant influence on the triggered cracking of the microcapsule.

The results provide a theoretical basis for further oriented designing of the cracking performance of microcapsules.

This paper aims to evaluate the bonding properties of textile reinforced concrete (TRC)-confined concrete and corroded plain round bars.

The bonding performance of three types of specimens (not reinforced, reinforced after corrosion and reinforced before corrosion) was studied by a central pull out test.

The ultimate bond strength between the corroded steel bars and the concrete is improved when the corrosion ratio is small. After cracking, the degree of corrosion continues to grow and the ultimate bond strength decreases. TRC reinforcement has no detectable effect on the interfacial bonding properties between concrete and plain round bars when the corrosion of steel bars is small; however, when the concrete cracks under the action of rust corrosion, the TRC constraints can effectively improve the bonding performance of the two components.

TRC layer significantly delayed the chloride penetration rate, which can effectively limit the development of corrosion cracking.

This paper presents an application of the physics‐of‐failure design philosophy to flip‐chip bonds in a microelectronic package. The physics‐of‐failure philosophy utilises knowledge of the life‐cycle load profile, package architecture and material properties to identify potential failure mechanisms and to prevent operational failures through robust design and manufacturing practices. The potential failure mechanisms and failure sites are identified in this paper for flip‐chip bonds, and an approach is presented to prevent the identified potential failure mechanisms by design. Finally, quality conformance issues are discussed to ensure a robust manufacturing process and qualification issues are addressed to evaluate the reliability of the designed flip‐chip bond.

The purpose of this paper is to investigate the influence of key parameters on the bond strength and failure modes of laminated structures made of different aluminum alloys (i.e. Al 2024 and Al 7075) via the ultrasonic consolidation (UC) process.

The UC is used to fabricate laminated structures with various parameters. The push-pin tests were performed on the specimens of different materials and parameters, and the force and displacement were recorded during the tests. The peak punch force was used to represent the bond quality of the laminated structure, and the curves of force versus displacement were used to study the failure modes of the structures.

It is found that the lower normal force, the larger vibration amplitude and the lower travel speed can result in stronger bonding. Three different failure modes are observed in the tests, due to the different relations between the toughness of interface and raw materials. The process parameters have influence on the interface toughness of a laminated structure, which further leads to different failure modes.

The overall mechanical properties of a laminated structure highly depend on the bond quality between laminated layers. The push-pin test can easily and effectively evaluate the bond quality of the laminated structure. This paper not only focuses on the bond strength evaluation, but also analyzes the different failure modes of laminated structures made of different aluminum alloys, which can give an opportunity to optimize the parameters for different materials.

This study aims to outline the current challenges in ultrasonic additive manufacturing (AM). AM has revolutionized manufacturing and offers possible solutions when conventional techniques reach technological boundaries. Ultrasonic additive manufacturing (UAM) uses mechanical vibrations to join similar or dissimilar metals in three-dimensional assemblies. This hybrid fabrication method got attention due to minimum scrap and near-net-shape products.

This paper reviews significant UAM areas in process parameters such as pressure force, amplitude, weld speed and temperature. These process parameters used in different studies by researchers are compared and presented in tabular form. UAM process improvements and understanding of microstructures have been reported. This review paper also enlightens current challenges in the UAM process, process improvement methods such as heat treatment methods, foil-to-foil overlap and sonotrode surface roughness to increase the bond quality of welded parts.

Results showed that UAM could solve various problems and produce net shape products. It is concluded that process parameters such as pressure, weld speed, amplitude and temperature greatly influence weld quality by UAM. Post-weld heat treatment methods have been recommended to optimize the mechanical strength of ultrasonically welded joints process parameters. It has been found that the tension force is vital for the deformation of the pre-machined structures and for the elongation of the foil during UAM bonding. It is recommended to critically investigate the mechanical properties of welded parts with standard test procedures.

This study compiles relevant research and findings in UAM. The recent progress in UAM is presented in terms of material type, process parameters and process improvement, along with key findings of the particular investigation. The original contribution of this paper is to identify the research gaps in the process parameters of ultrasonic consolidation.