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Article
Publication date: 15 April 2024

Amer Mecellem, Soufyane Belhenini, Douaa Khelladi and Caroline Richard

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic…

Abstract

Purpose

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

Design/methodology/approach

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

Findings

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

Originality/value

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

Details

Microelectronics International, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1356-5362

Keywords

Article
Publication date: 15 December 2023

Fei Chu, Hongzhuan Chen, Zheng Zhou, Changlei Feng and Tao Zhang

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Abstract

Purpose

This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Design/methodology/approach

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

Findings

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

Originality/value

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 18 April 2024

Prajakta Chandrakant Kandarkar and V. Ravi

Industry 4.0 has put forward a smart perspective on managing supply chain networks and their operations. The current manufacturing system is primarily data-driven. Industries are…

Abstract

Purpose

Industry 4.0 has put forward a smart perspective on managing supply chain networks and their operations. The current manufacturing system is primarily data-driven. Industries are deploying new emerging technologies in their operations to build a competitive edge in the business environment; however, the true potential of smart manufacturing has not yet been fully unveiled. This research aims to extensively analyse emerging technologies and their interconnection with smart manufacturing in developing smarter supply chains.

Design/methodology/approach

This research endeavours to establish a conceptual framework for a smart supply chain. A real case study on a smart factory is conducted to demonstrate the validity of this framework for building smarter supply chains. A comparative analysis is carried out between conventional and smart supply chains to ascertain the advantages of smart supply chains. In addition, a thorough investigation of the several factors needed to transition from smart to smarter supply chains is undertaken.

Findings

The integration of smart technology exemplifies the ability to improve the efficiency of supply chain operations. Research findings indicate that transitioning to a smart factory radically enhances productivity, quality assurance, data privacy and labour efficiency. The outcomes of this research will help academic and industrial sectors critically comprehend technological breakthroughs and their applications in smart supply chains.

Originality/value

This study highlights the implications of incorporating smart technologies into supply chain operations, specifically in smart purchasing, smart factory operations, smart warehousing and smart customer performance. A paradigm transition from conventional, smart to smarter supply chains offers a comprehensive perspective on the evolving dynamics in automation, optimisation and manufacturing technology domains, ultimately leading to the emergence of Industry 5.0.

Details

Journal of Manufacturing Technology Management, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1741-038X

Keywords

Article
Publication date: 21 December 2023

Xinran Zhao, Yingying Pang, Gang Wang, Chenhui Xia, Yuan Yuan and Chengqian Wang

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Abstract

Purpose

This paper aims to realize the vertical interconnection in 3D radio frequency (RF) circuit by coaxial transitions with broad working bandwidth and small signal loss.

Design/methodology/approach

An advanced packaging method, 12-inch wafer-level through-mold-via (TMV) additive manufacturing, is used to fabricate a 3D resin-based coaxial transition with a continuous ground wall (named resin-coaxial transition). Designation and simulation are implemented to ensure the application universality and fabrication feasibility. The outer radius R of coaxial transition is optimized by designing and fabricating three samples.

Findings

The fabricated coaxial transition possesses an inner radius of 40 µm and a length of 200 µm. The optimized sample with an outer radius R of 155 µm exhibits S11 < –10 dB and S21 > –1.3 dB at 10–110 GHz and the smallest insertion loss (S21 = 0.83 dB at 77 GHz) among the samples. Moreover, the S21 of the samples increases at 58.4–90.1 GHz, indicating a broad and suitable working bandwidth.

Originality/value

The wafer-level TMV additive manufacturing method is applied to fabricate coaxial transitions for the first time. The fabricated resin-coaxial transitions show good performance up to the W-band. It may provide new strategies for novel designing and fabricating methods of RF transitions.

Details

Soldering & Surface Mount Technology, vol. 36 no. 2
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 14 July 2023

Claire Economidou, Dimitris Karamanis, Alexandra Kechrinioti, Konstantinos N. Konstantakis and Panayotis G. Michaelides

In this work, the authors analyze the dynamic interdependencies between military expenditures and the real economy for the period 1970–2018, and the authors' approach allows for…

Abstract

Purpose

In this work, the authors analyze the dynamic interdependencies between military expenditures and the real economy for the period 1970–2018, and the authors' approach allows for the existence of dominant economies in the system.

Design/methodology/approach

In this study, the authors employ a Network General Equilibrium GVAR (global vector autoregressive) model.

Findings

By accounting for the interconnection among the top twelve military spenders, the authors' findings show that China acts as a leader in the global military scene based on the respective centrality measures. Meanwhile, statistically significant deviations from equilibrium are observed in most of the economies' military expenses, when subjected to an unanticipated unit shock of other countries. Nonetheless, in the medium run, the shocks tend to die out and economies converge to an equilibrium position.

Originality/value

With the authors' methodology the authors are able to capture not only the effect of nearness on a country's military spending, as the past literature has documented, but also a country's defense and economic dependencies with other countries and how a unit's military expenses could shape the spending of the rest. Using state-to-the-art quantitative and econometric techniques, the authors provide robust and comprehensive analysis.

Details

Journal of Economic Studies, vol. 51 no. 3
Type: Research Article
ISSN: 0144-3585

Keywords

Book part
Publication date: 2 May 2024

Amanuel Elias

Research indicates a long historical connection between racism and nationalist ideologies. This connection has been highlighted in the resurgence of exclusionary nationalism in…

Abstract

Research indicates a long historical connection between racism and nationalist ideologies. This connection has been highlighted in the resurgence of exclusionary nationalism in recent years, across many multicultural societies. This chapter discusses the notions of race, ethnicity and nation, and critically examines how racism shapes contemporary manifestations of nationalist discourse across the world. It explores the historical role of settler-colonialism, imperial expansions and the capitalist development in shaping the racial/ethnic aspect of nationalist development. Moreover, it provides an analysis of the interconnections between the racialisation of minorities, exclusionary ideologies and the consolidation of ethno-nationalist tropes. This chapter further considers the impact of demographic changes in reinforcing anti-migrant exclusionary sentiments. This is examined in connection with emerging nativist discourse, exploring how xenophobic racism has shaped and is shaped by nostalgic nationalism based on the sanitisation of the legacies of Empire and colonialism.

Details

Racism and Anti-Racism Today
Type: Book
ISBN: 978-1-83753-512-5

Keywords

Article
Publication date: 15 April 2024

Dewan Mehrab Ashrafi and Jannatul Maoua

The purpose of this study is to examine the determinants impacting consumer behaviour in organic food consumption in Bangladesh. This study aims to identify the key factors…

Abstract

Purpose

The purpose of this study is to examine the determinants impacting consumer behaviour in organic food consumption in Bangladesh. This study aims to identify the key factors facilitating organic food consumption and establish a framework by analysing their contextual relationships.

Design/methodology/approach

The study used interpretive structural modelling (ISM), relying on expert perspectives from experienced academicians and marketing professionals. A Matrice d'Impacts Croisés Multiplication Appliqués à un Classement (MICMAC) analysis was performed to assess the driving forces and interdependencies among these determinants.

Findings

The MICMAC analysis grouped determinants influencing organic food purchases into four categories. The dependent factors, like attitude and food safety, showed moderate driving forces and high dependence. Linkage determinants, such as environmental concern and price, exerted considerable influence with moderate dependence. Independent variables, especially knowledge about organic food, had a strong impact with relatively low dependence.

Practical implications

This study’s insights offer valuable guidance for managers in the organic food industry, providing strategies to address consumer behaviour. Prioritising education on environmental benefits, transparent pricing, collaborating on policies, ensuring food safety and understanding determinants impacting purchase intent can aid in designing effective marketing strategies and product offerings aligned with consumer needs, ultimately promoting sustainability.

Originality/value

To the best of the authors’ knowledge, this study is the first to investigate the interconnections and relative significance of determinants influencing organic food purchases, using the ISM approach and MICMAC analysis. It delves into the previously unexplored territory of understanding the relationships and hierarchical significance of these determinants in shaping consumer behaviour towards organic food purchases.

Details

Journal of Modelling in Management, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1746-5664

Keywords

Article
Publication date: 12 April 2024

Dimitrios Dimitriou, Eleftherios Goulas, Christos Kallandranis, Alexandros Tsioutsios and Thi Ngoc Bich Thi Ngoc Ta

This paper aims to examine potential diversification benefits between Eurozone (i.e. EURO STOXX 50) and key Asia markets: HSI (Hong Kong), KOSPI (South Korea), NIKKEI 225 (Japan…

14

Abstract

Purpose

This paper aims to examine potential diversification benefits between Eurozone (i.e. EURO STOXX 50) and key Asia markets: HSI (Hong Kong), KOSPI (South Korea), NIKKEI 225 (Japan) and TSEC (Taiwan). The sample covers the period from 04-01-2008 to 19-10-2023 in daily frequency.

Design/methodology/approach

The empirical investigation is based on the wavelet coherence analysis, which is a localized correlation coefficient in the time and frequency domain.

Findings

The results provide evidence that long-term diversification benefits exist between EURO STOXX and NIKKEI, EURO STOXX and KOSPI (after 2015) and there are signs for the pair and EURO STOXX-TSEC (after 2014). During the short term, there are signs of diversification benefits during the sample period. However, during the medium term, the diversification benefits seem to diminish.

Originality/value

These results have crucial implications for investors regarding the benefits of international portfolio diversification.

Details

Journal of Asia Business Studies, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 1558-7894

Keywords

Article
Publication date: 17 April 2024

Zul-Atfi Ismail

This paper aims to identify the different system approach using Building Information Modelling (BIM) technology that is equipped with decision making processes. Maintenance…

Abstract

Purpose

This paper aims to identify the different system approach using Building Information Modelling (BIM) technology that is equipped with decision making processes. Maintenance planning and management are integral components of the construction sector, serving the broader purpose of post-construction activities and processes. However, as Precast Concrete (PC) construction projects increase in scale and complexity, the interconnections among these activities and processes become apparent, leading to planning and performance management challenges. These challenges specifically affect the monitoring of façade components for corrective and preventive maintenance actions.

Design/methodology/approach

The concept of maintenance planning for façades, along with the main features of information and communication technology tools and techniques using building information modeling technology, is grounded in the analysis of numerous literature reviews in PC building scenarios.

Findings

This research focuses on an integrated system designed to analyze information and support decision-making in maintenance planning for PC buildings. It is based on robust data collection regarding concrete façades' failures and causes. The system aims to provide appropriate planning decisions and minimize the risk of façade failures throughout the building's lifetime.

Originality/value

The study concludes that implementing a research framework to develop such a system can significantly enhance the effectiveness of maintenance planning for façade design, construction and maintenance operations.

Details

Facilities , vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0263-2772

Keywords

Abstract

Purpose

This study aims to explore the constructs of spirituality (SP) and entrepreneurial performance (EP) and their measurements to identify their connections. Attending to the needs of entrepreneurs to face the current global crisis, this research establishes a framework that integrates SP to enhance EP.

Design/methodology/approach

This study focuses on a comprehensive literature review and a comparison between constructs to come across with the proposal of a conceptual framework.

Findings

For SP, spiritual well-being was found as a good measure which, to the best of the authors’ knowledge, has never been used in entrepreneurship. EP has been typically measured by economic indicators, but recently, noneconomic benefits and effects on stakeholders have also been considered, so an integrated approach is proposed. The main contribution is a framework called holistic entrepreneurial inventory (HEI), which integrates the main elements of the constructs in a matrix showing their interconnection. It is accompanied by a scorecard for entrepreneurs to identify strengths and weaknesses in SP and EP.

Research limitations/implications

This is a theoretical research and proposal; further empirical research could help confirm the present conceptual findings.

Practical implications

To help entrepreneurs identify the areas where they would like to improve, understanding the connection between SP and EP, which are dynamic states in constant change.

Originality/value

EP has been mainly focused on exogenous causes. The HEI scorecard may give entrepreneurs a different perspective from the innermost part of their being.

1 – 10 of 241